JPWO2023112735A5 - - Google Patents

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Publication number
JPWO2023112735A5
JPWO2023112735A5 JP2023567700A JP2023567700A JPWO2023112735A5 JP WO2023112735 A5 JPWO2023112735 A5 JP WO2023112735A5 JP 2023567700 A JP2023567700 A JP 2023567700A JP 2023567700 A JP2023567700 A JP 2023567700A JP WO2023112735 A5 JPWO2023112735 A5 JP WO2023112735A5
Authority
JP
Japan
Prior art keywords
electronic device
portions
terminal
sealing resin
dimension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023567700A
Other languages
English (en)
Japanese (ja)
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JPWO2023112735A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/044665 external-priority patent/WO2023112735A1/ja
Publication of JPWO2023112735A1 publication Critical patent/JPWO2023112735A1/ja
Publication of JPWO2023112735A5 publication Critical patent/JPWO2023112735A5/ja
Pending legal-status Critical Current

Links

JP2023567700A 2021-12-17 2022-12-05 Pending JPWO2023112735A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021205220 2021-12-17
JP2022116092 2022-07-21
PCT/JP2022/044665 WO2023112735A1 (ja) 2021-12-17 2022-12-05 電子装置

Publications (2)

Publication Number Publication Date
JPWO2023112735A1 JPWO2023112735A1 (cg-RX-API-DMAC7.html) 2023-06-22
JPWO2023112735A5 true JPWO2023112735A5 (cg-RX-API-DMAC7.html) 2024-08-29

Family

ID=86774605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023567700A Pending JPWO2023112735A1 (cg-RX-API-DMAC7.html) 2021-12-17 2022-12-05

Country Status (4)

Country Link
US (1) US20240332138A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2023112735A1 (cg-RX-API-DMAC7.html)
DE (1) DE112022005516T5 (cg-RX-API-DMAC7.html)
WO (1) WO2023112735A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025009349A1 (ja) * 2023-07-04 2025-01-09 ローム株式会社 電子装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3286765B2 (ja) * 1993-03-09 2002-05-27 株式会社日立製作所 半導体装置
JPH1012790A (ja) * 1996-06-24 1998-01-16 Mitsubishi Electric Corp 半導体集積回路装置
JP2000269395A (ja) * 1999-03-18 2000-09-29 Toshiba Corp 半導体装置
JP2006203048A (ja) * 2005-01-21 2006-08-03 Matsushita Electric Ind Co Ltd 半導体装置
JP6274553B2 (ja) * 2013-09-27 2018-02-07 大日本印刷株式会社 リードフレームおよびその製造方法、ならびに半導体装置およびその製造方法
JP7145798B2 (ja) * 2019-03-19 2022-10-03 三菱電機株式会社 半導体装置の製造方法および半導体装置

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