JPWO2024034359A5 - - Google Patents

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Publication number
JPWO2024034359A5
JPWO2024034359A5 JP2024540340A JP2024540340A JPWO2024034359A5 JP WO2024034359 A5 JPWO2024034359 A5 JP WO2024034359A5 JP 2024540340 A JP2024540340 A JP 2024540340A JP 2024540340 A JP2024540340 A JP 2024540340A JP WO2024034359 A5 JPWO2024034359 A5 JP WO2024034359A5
Authority
JP
Japan
Prior art keywords
terminal
semiconductor device
electrode
conductive member
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024540340A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024034359A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/026762 external-priority patent/WO2024034359A1/ja
Publication of JPWO2024034359A1 publication Critical patent/JPWO2024034359A1/ja
Publication of JPWO2024034359A5 publication Critical patent/JPWO2024034359A5/ja
Pending legal-status Critical Current

Links

JP2024540340A 2022-08-10 2023-07-21 Pending JPWO2024034359A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022127924 2022-08-10
PCT/JP2023/026762 WO2024034359A1 (ja) 2022-08-10 2023-07-21 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024034359A1 JPWO2024034359A1 (cg-RX-API-DMAC7.html) 2024-02-15
JPWO2024034359A5 true JPWO2024034359A5 (cg-RX-API-DMAC7.html) 2025-04-21

Family

ID=89851422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024540340A Pending JPWO2024034359A1 (cg-RX-API-DMAC7.html) 2022-08-10 2023-07-21

Country Status (2)

Country Link
JP (1) JPWO2024034359A1 (cg-RX-API-DMAC7.html)
WO (1) WO2024034359A1 (cg-RX-API-DMAC7.html)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5448110B2 (ja) * 2012-03-12 2014-03-19 ルネサスエレクトロニクス株式会社 半導体装置
JP5879238B2 (ja) * 2012-09-26 2016-03-08 日立オートモティブシステムズ株式会社 パワー半導体モジュール
JP6817777B2 (ja) * 2015-12-16 2021-01-20 ローム株式会社 半導体装置
WO2018043535A1 (ja) * 2016-09-02 2018-03-08 ローム株式会社 パワーモジュール、駆動回路付パワーモジュール、および産業機器、電気自動車またはハイブリッドカー
JP7368054B2 (ja) * 2019-05-16 2023-10-24 ローム株式会社 半導体装置

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