JPWO2024219218A5 - - Google Patents

Info

Publication number
JPWO2024219218A5
JPWO2024219218A5 JP2025515143A JP2025515143A JPWO2024219218A5 JP WO2024219218 A5 JPWO2024219218 A5 JP WO2024219218A5 JP 2025515143 A JP2025515143 A JP 2025515143A JP 2025515143 A JP2025515143 A JP 2025515143A JP WO2024219218 A5 JPWO2024219218 A5 JP WO2024219218A5
Authority
JP
Japan
Prior art keywords
semiconductor device
thickness direction
conductive
support member
recesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025515143A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024219218A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/013622 external-priority patent/WO2024219218A1/ja
Publication of JPWO2024219218A1 publication Critical patent/JPWO2024219218A1/ja
Publication of JPWO2024219218A5 publication Critical patent/JPWO2024219218A5/ja
Pending legal-status Critical Current

Links

JP2025515143A 2023-04-18 2024-04-02 Pending JPWO2024219218A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023067669 2023-04-18
PCT/JP2024/013622 WO2024219218A1 (ja) 2023-04-18 2024-04-02 半導体装置および車両

Publications (2)

Publication Number Publication Date
JPWO2024219218A1 JPWO2024219218A1 (cg-RX-API-DMAC7.html) 2024-10-24
JPWO2024219218A5 true JPWO2024219218A5 (cg-RX-API-DMAC7.html) 2026-01-23

Family

ID=93152848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025515143A Pending JPWO2024219218A1 (cg-RX-API-DMAC7.html) 2023-04-18 2024-04-02

Country Status (3)

Country Link
US (1) US20260060100A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2024219218A1 (cg-RX-API-DMAC7.html)
WO (1) WO2024219218A1 (cg-RX-API-DMAC7.html)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11710705B2 (en) * 2018-10-09 2023-07-25 Rohm Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
JP7363587B2 (ja) * 2020-03-04 2023-10-18 株式会社デンソー 半導体装置
JP7473376B2 (ja) * 2020-03-26 2024-04-23 ローム株式会社 半導体装置
JP7663401B2 (ja) * 2021-04-09 2025-04-16 ローム株式会社 半導体装置、および半導体装置の製造方法
WO2023021938A1 (ja) * 2021-08-18 2023-02-23 ローム株式会社 半導体装置

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