JPWO2023063025A5 - - Google Patents

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Publication number
JPWO2023063025A5
JPWO2023063025A5 JP2023555051A JP2023555051A JPWO2023063025A5 JP WO2023063025 A5 JPWO2023063025 A5 JP WO2023063025A5 JP 2023555051 A JP2023555051 A JP 2023555051A JP 2023555051 A JP2023555051 A JP 2023555051A JP WO2023063025 A5 JPWO2023063025 A5 JP WO2023063025A5
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JP
Japan
Prior art keywords
thickness direction
semiconductor device
viewed
mounting
recessed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023555051A
Other languages
English (en)
Japanese (ja)
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JPWO2023063025A1 (cg-RX-API-DMAC7.html
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/034711 external-priority patent/WO2023063025A1/ja
Publication of JPWO2023063025A1 publication Critical patent/JPWO2023063025A1/ja
Publication of JPWO2023063025A5 publication Critical patent/JPWO2023063025A5/ja
Pending legal-status Critical Current

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JP2023555051A 2021-10-13 2022-09-16 Pending JPWO2023063025A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021168361 2021-10-13
PCT/JP2022/034711 WO2023063025A1 (ja) 2021-10-13 2022-09-16 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023063025A1 JPWO2023063025A1 (cg-RX-API-DMAC7.html) 2023-04-20
JPWO2023063025A5 true JPWO2023063025A5 (cg-RX-API-DMAC7.html) 2024-07-04

Family

ID=85987668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023555051A Pending JPWO2023063025A1 (cg-RX-API-DMAC7.html) 2021-10-13 2022-09-16

Country Status (5)

Country Link
US (1) US20240250014A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2023063025A1 (cg-RX-API-DMAC7.html)
CN (1) CN118103973A (cg-RX-API-DMAC7.html)
DE (1) DE112022004904T5 (cg-RX-API-DMAC7.html)
WO (1) WO2023063025A1 (cg-RX-API-DMAC7.html)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014207430A (ja) 2013-03-21 2014-10-30 ローム株式会社 半導体装置
JP6695166B2 (ja) * 2016-02-23 2020-05-20 株式会社三井ハイテック リードフレーム、及び半導体パッケージの製造方法
JP6115671B2 (ja) * 2016-04-12 2017-04-19 日亜化学工業株式会社 リードフレーム、樹脂付きリードフレーム、光半導体装置
JP2019102467A (ja) * 2017-11-28 2019-06-24 トヨタ自動車株式会社 半導体装置
CN111868919B (zh) * 2018-03-12 2024-02-27 罗姆股份有限公司 半导体装置、及半导体装置的安装结构

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