JPWO2023100663A5 - - Google Patents

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Publication number
JPWO2023100663A5
JPWO2023100663A5 JP2023564865A JP2023564865A JPWO2023100663A5 JP WO2023100663 A5 JPWO2023100663 A5 JP WO2023100663A5 JP 2023564865 A JP2023564865 A JP 2023564865A JP 2023564865 A JP2023564865 A JP 2023564865A JP WO2023100663 A5 JPWO2023100663 A5 JP WO2023100663A5
Authority
JP
Japan
Prior art keywords
semiconductor device
resin surface
thickness direction
resin
recessed region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023564865A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023100663A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/042650 external-priority patent/WO2023100663A1/ja
Publication of JPWO2023100663A1 publication Critical patent/JPWO2023100663A1/ja
Publication of JPWO2023100663A5 publication Critical patent/JPWO2023100663A5/ja
Pending legal-status Critical Current

Links

JP2023564865A 2021-12-01 2022-11-17 Pending JPWO2023100663A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021195176 2021-12-01
PCT/JP2022/042650 WO2023100663A1 (ja) 2021-12-01 2022-11-17 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023100663A1 JPWO2023100663A1 (cg-RX-API-DMAC7.html) 2023-06-08
JPWO2023100663A5 true JPWO2023100663A5 (cg-RX-API-DMAC7.html) 2024-08-15

Family

ID=86612147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023564865A Pending JPWO2023100663A1 (cg-RX-API-DMAC7.html) 2021-12-01 2022-11-17

Country Status (5)

Country Link
US (1) US20240258186A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2023100663A1 (cg-RX-API-DMAC7.html)
CN (1) CN118318300A (cg-RX-API-DMAC7.html)
DE (1) DE112022005210T5 (cg-RX-API-DMAC7.html)
WO (1) WO2023100663A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20260068693A1 (en) * 2024-08-27 2026-03-05 Wolfspeed, Inc. Power semiconductor device package

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01174956U (cg-RX-API-DMAC7.html) * 1988-05-30 1989-12-13
JPH0312954A (ja) * 1989-06-12 1991-01-21 Nec Corp 樹脂封止型半導体装置
JP5362658B2 (ja) * 1999-10-28 2013-12-11 ローム株式会社 半導体装置
JP7337733B2 (ja) * 2020-03-05 2023-09-04 株式会社東芝 半導体パッケージ

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