JPWO2024247688A5 - - Google Patents

Info

Publication number
JPWO2024247688A5
JPWO2024247688A5 JP2025523425A JP2025523425A JPWO2024247688A5 JP WO2024247688 A5 JPWO2024247688 A5 JP WO2024247688A5 JP 2025523425 A JP2025523425 A JP 2025523425A JP 2025523425 A JP2025523425 A JP 2025523425A JP WO2024247688 A5 JPWO2024247688 A5 JP WO2024247688A5
Authority
JP
Japan
Prior art keywords
recesses
semiconductor device
thickness direction
protrusions
corner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025523425A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024247688A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/017605 external-priority patent/WO2024247688A1/ja
Publication of JPWO2024247688A1 publication Critical patent/JPWO2024247688A1/ja
Publication of JPWO2024247688A5 publication Critical patent/JPWO2024247688A5/ja
Pending legal-status Critical Current

Links

JP2025523425A 2023-06-02 2024-05-13 Pending JPWO2024247688A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023091932 2023-06-02
PCT/JP2024/017605 WO2024247688A1 (ja) 2023-06-02 2024-05-13 半導体装置および車両

Publications (2)

Publication Number Publication Date
JPWO2024247688A1 JPWO2024247688A1 (cg-RX-API-DMAC7.html) 2024-12-05
JPWO2024247688A5 true JPWO2024247688A5 (cg-RX-API-DMAC7.html) 2026-03-02

Family

ID=93657503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025523425A Pending JPWO2024247688A1 (cg-RX-API-DMAC7.html) 2023-06-02 2024-05-13

Country Status (3)

Country Link
US (1) US20260082923A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2024247688A1 (cg-RX-API-DMAC7.html)
WO (1) WO2024247688A1 (cg-RX-API-DMAC7.html)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7834431B2 (en) * 2008-04-08 2010-11-16 Freescale Semiconductor, Inc. Leadframe for packaged electronic device with enhanced mold locking capability
WO2011049128A1 (ja) * 2009-10-20 2011-04-28 ローム株式会社 半導体装置および半導体装置の製造方法
JP6815217B2 (ja) * 2017-02-09 2021-01-20 エイブリック株式会社 半導体装置
JP7210868B2 (ja) * 2018-09-05 2023-01-24 ローム株式会社 半導体装置
US11398417B2 (en) * 2018-10-30 2022-07-26 Stmicroelectronics, Inc. Semiconductor package having die pad with cooling fins
US20230268311A1 (en) * 2020-07-16 2023-08-24 Rohm Co., Ltd. Semiconductor device, and production method for semiconductor device

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