JPWO2024190397A5 - - Google Patents

Info

Publication number
JPWO2024190397A5
JPWO2024190397A5 JP2025506672A JP2025506672A JPWO2024190397A5 JP WO2024190397 A5 JPWO2024190397 A5 JP WO2024190397A5 JP 2025506672 A JP2025506672 A JP 2025506672A JP 2025506672 A JP2025506672 A JP 2025506672A JP WO2024190397 A5 JPWO2024190397 A5 JP WO2024190397A5
Authority
JP
Japan
Prior art keywords
resin
electronic device
die pad
lead
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025506672A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024190397A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/007012 external-priority patent/WO2024190397A1/ja
Publication of JPWO2024190397A1 publication Critical patent/JPWO2024190397A1/ja
Publication of JPWO2024190397A5 publication Critical patent/JPWO2024190397A5/ja
Pending legal-status Critical Current

Links

JP2025506672A 2023-03-15 2024-02-27 Pending JPWO2024190397A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023040763 2023-03-15
PCT/JP2024/007012 WO2024190397A1 (ja) 2023-03-15 2024-02-27 電子装置

Publications (2)

Publication Number Publication Date
JPWO2024190397A1 JPWO2024190397A1 (cg-RX-API-DMAC7.html) 2024-09-19
JPWO2024190397A5 true JPWO2024190397A5 (cg-RX-API-DMAC7.html) 2025-12-02

Family

ID=92754973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025506672A Pending JPWO2024190397A1 (cg-RX-API-DMAC7.html) 2023-03-15 2024-02-27

Country Status (3)

Country Link
US (1) US20260005087A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2024190397A1 (cg-RX-API-DMAC7.html)
WO (1) WO2024190397A1 (cg-RX-API-DMAC7.html)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016072012A1 (ja) * 2014-11-07 2016-05-12 三菱電機株式会社 電力用半導体装置およびその製造方法
JP7001826B2 (ja) * 2018-07-12 2022-01-20 ローム株式会社 半導体装置
JP7541456B2 (ja) * 2020-09-10 2024-08-28 ローム株式会社 半導体装置
JPWO2022145177A1 (cg-RX-API-DMAC7.html) * 2021-01-04 2022-07-07

Similar Documents

Publication Publication Date Title
KR920003567A (ko) 반도체장치
KR970067736A (ko) 리이드 프레임과 그것을 사용한 반도체장치 및 그 제조방법
JP2025186549A (ja) 半導体装置
US10340208B2 (en) Semiconductor device
JPWO2023167000A5 (cg-RX-API-DMAC7.html)
JPWO2024190397A5 (cg-RX-API-DMAC7.html)
JPWO2023140042A5 (cg-RX-API-DMAC7.html)
CN107479282B (zh) 一种阵列基板、显示面板及显示装置
JPWO2022264834A5 (cg-RX-API-DMAC7.html)
JPWO2024128011A5 (cg-RX-API-DMAC7.html)
JP2023146128A5 (cg-RX-API-DMAC7.html)
JPWO2023149257A5 (cg-RX-API-DMAC7.html)
JPWO2023243464A5 (cg-RX-API-DMAC7.html)
JPWO2023176267A5 (cg-RX-API-DMAC7.html)
JPWO2024247688A5 (cg-RX-API-DMAC7.html)
JPWO2024034359A5 (cg-RX-API-DMAC7.html)
JPWO2023153188A5 (cg-RX-API-DMAC7.html)
JPWO2023171343A5 (cg-RX-API-DMAC7.html)
US6153923A (en) Semiconductor device
JPWO2023100754A5 (cg-RX-API-DMAC7.html)
JPWO2024190426A5 (cg-RX-API-DMAC7.html)
JPWO2023140046A5 (cg-RX-API-DMAC7.html)
JPWO2023090059A5 (cg-RX-API-DMAC7.html)
JPWO2024038736A5 (cg-RX-API-DMAC7.html)
JPWO2024038746A5 (cg-RX-API-DMAC7.html)