JPWO2024038736A5 - - Google Patents

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Publication number
JPWO2024038736A5
JPWO2024038736A5 JP2024541470A JP2024541470A JPWO2024038736A5 JP WO2024038736 A5 JPWO2024038736 A5 JP WO2024038736A5 JP 2024541470 A JP2024541470 A JP 2024541470A JP 2024541470 A JP2024541470 A JP 2024541470A JP WO2024038736 A5 JPWO2024038736 A5 JP WO2024038736A5
Authority
JP
Japan
Prior art keywords
die pad
semiconductor device
semiconductor element
leads
pad portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024541470A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024038736A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/027137 external-priority patent/WO2024038736A1/ja
Publication of JPWO2024038736A1 publication Critical patent/JPWO2024038736A1/ja
Publication of JPWO2024038736A5 publication Critical patent/JPWO2024038736A5/ja
Pending legal-status Critical Current

Links

JP2024541470A 2022-08-19 2023-07-25 Pending JPWO2024038736A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022131065 2022-08-19
PCT/JP2023/027137 WO2024038736A1 (ja) 2022-08-19 2023-07-25 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024038736A1 JPWO2024038736A1 (cg-RX-API-DMAC7.html) 2024-02-22
JPWO2024038736A5 true JPWO2024038736A5 (cg-RX-API-DMAC7.html) 2025-04-28

Family

ID=89941498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024541470A Pending JPWO2024038736A1 (cg-RX-API-DMAC7.html) 2022-08-19 2023-07-25

Country Status (2)

Country Link
JP (1) JPWO2024038736A1 (cg-RX-API-DMAC7.html)
WO (1) WO2024038736A1 (cg-RX-API-DMAC7.html)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012109435A (ja) * 2010-11-18 2012-06-07 Renesas Electronics Corp 半導体装置の製造方法
KR101555301B1 (ko) * 2014-05-13 2015-09-23 페어차일드코리아반도체 주식회사 반도체 패키지
JP2018107416A (ja) * 2016-12-28 2018-07-05 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP7527916B2 (ja) * 2020-09-29 2024-08-05 ローム株式会社 半導体装置
JPWO2022145177A1 (cg-RX-API-DMAC7.html) * 2021-01-04 2022-07-07

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