JPWO2023176370A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023176370A5
JPWO2023176370A5 JP2024507659A JP2024507659A JPWO2023176370A5 JP WO2023176370 A5 JPWO2023176370 A5 JP WO2023176370A5 JP 2024507659 A JP2024507659 A JP 2024507659A JP 2024507659 A JP2024507659 A JP 2024507659A JP WO2023176370 A5 JPWO2023176370 A5 JP WO2023176370A5
Authority
JP
Japan
Prior art keywords
dimension
semiconductor element
die pad
wires
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024507659A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023176370A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/006742 external-priority patent/WO2023176370A1/ja
Publication of JPWO2023176370A1 publication Critical patent/JPWO2023176370A1/ja
Publication of JPWO2023176370A5 publication Critical patent/JPWO2023176370A5/ja
Pending legal-status Critical Current

Links

JP2024507659A 2022-03-17 2023-02-24 Pending JPWO2023176370A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022042701 2022-03-17
PCT/JP2023/006742 WO2023176370A1 (ja) 2022-03-17 2023-02-24 半導体素子および半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023176370A1 JPWO2023176370A1 (cg-RX-API-DMAC7.html) 2023-09-21
JPWO2023176370A5 true JPWO2023176370A5 (cg-RX-API-DMAC7.html) 2024-11-21

Family

ID=88023448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024507659A Pending JPWO2023176370A1 (cg-RX-API-DMAC7.html) 2022-03-17 2023-02-24

Country Status (3)

Country Link
US (1) US20250006775A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2023176370A1 (cg-RX-API-DMAC7.html)
WO (1) WO2023176370A1 (cg-RX-API-DMAC7.html)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014090117A (ja) * 2012-10-31 2014-05-15 Rohm Co Ltd 半導体装置、半導体装置の実装構造、および半導体装置の製造方法
EP2985785B1 (en) * 2013-04-10 2023-12-20 Mitsubishi Electric Corporation Method of manufacturing a semiconductor device with prevention of adhesive climbing up and corresponding semiconductor device
JP6522402B2 (ja) * 2015-04-16 2019-05-29 ローム株式会社 半導体装置
JP2017135295A (ja) * 2016-01-29 2017-08-03 サンケン電気株式会社 半導体素子
JP2018157168A (ja) * 2017-03-21 2018-10-04 東芝メモリ株式会社 半導体装置及びその製造方法
WO2019163941A1 (ja) * 2018-02-22 2019-08-29 京セラ株式会社 パワーモジュール用基板およびパワーモジュール

Similar Documents

Publication Publication Date Title
JP2008507134A5 (cg-RX-API-DMAC7.html)
JP2005150647A5 (cg-RX-API-DMAC7.html)
JP2023120061A5 (cg-RX-API-DMAC7.html)
JPWO2023140042A5 (cg-RX-API-DMAC7.html)
JPWO2023176370A5 (cg-RX-API-DMAC7.html)
JPWO2023112662A5 (cg-RX-API-DMAC7.html)
JPWO2024029336A5 (cg-RX-API-DMAC7.html)
JPWO2023189650A5 (cg-RX-API-DMAC7.html)
JPWO2023243278A5 (cg-RX-API-DMAC7.html)
JPWO2023095659A5 (cg-RX-API-DMAC7.html)
JPWO2023149257A5 (cg-RX-API-DMAC7.html)
JPWO2024018790A5 (cg-RX-API-DMAC7.html)
JPWO2024038736A5 (cg-RX-API-DMAC7.html)
JPWO2023090261A5 (cg-RX-API-DMAC7.html)
JPWO2022259809A5 (cg-RX-API-DMAC7.html)
JP2007134585A5 (cg-RX-API-DMAC7.html)
JPWO2023053874A5 (cg-RX-API-DMAC7.html)
JPWO2023181957A5 (cg-RX-API-DMAC7.html)
JPWO2024004614A5 (cg-RX-API-DMAC7.html)
JPWO2023120185A5 (cg-RX-API-DMAC7.html)
JPH0521694A (ja) 半導体装置
JPWO2024038746A5 (cg-RX-API-DMAC7.html)
JPWO2023112723A5 (cg-RX-API-DMAC7.html)
JPWO2024181293A5 (cg-RX-API-DMAC7.html)
JPWO2025013528A5 (cg-RX-API-DMAC7.html)