JP2007134585A5 - - Google Patents

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Publication number
JP2007134585A5
JP2007134585A5 JP2005327635A JP2005327635A JP2007134585A5 JP 2007134585 A5 JP2007134585 A5 JP 2007134585A5 JP 2005327635 A JP2005327635 A JP 2005327635A JP 2005327635 A JP2005327635 A JP 2005327635A JP 2007134585 A5 JP2007134585 A5 JP 2007134585A5
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JP
Japan
Prior art keywords
leads
mounting portion
sealing body
resin sealing
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2005327635A
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English (en)
Japanese (ja)
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JP2007134585A (ja
JP4732138B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2005327635A priority Critical patent/JP4732138B2/ja
Priority claimed from JP2005327635A external-priority patent/JP4732138B2/ja
Publication of JP2007134585A publication Critical patent/JP2007134585A/ja
Publication of JP2007134585A5 publication Critical patent/JP2007134585A5/ja
Application granted granted Critical
Publication of JP4732138B2 publication Critical patent/JP4732138B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005327635A 2005-11-11 2005-11-11 半導体装置及びその製造方法 Expired - Fee Related JP4732138B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005327635A JP4732138B2 (ja) 2005-11-11 2005-11-11 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005327635A JP4732138B2 (ja) 2005-11-11 2005-11-11 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2007134585A JP2007134585A (ja) 2007-05-31
JP2007134585A5 true JP2007134585A5 (cg-RX-API-DMAC7.html) 2008-12-25
JP4732138B2 JP4732138B2 (ja) 2011-07-27

Family

ID=38155983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005327635A Expired - Fee Related JP4732138B2 (ja) 2005-11-11 2005-11-11 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP4732138B2 (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011077277A (ja) * 2009-09-30 2011-04-14 Sanyo Electric Co Ltd 半導体装置
JP6923299B2 (ja) * 2016-09-26 2021-08-18 株式会社アムコー・テクノロジー・ジャパン 半導体装置及び半導体装置の製造方法
JP7144112B2 (ja) 2018-09-19 2022-09-29 ローム株式会社 半導体装置
JP7576927B2 (ja) * 2020-04-30 2024-11-01 浜松ホトニクス株式会社 半導体素子及び半導体素子製造方法
CN117936533A (zh) * 2022-07-19 2024-04-26 王永明 一款芯片及芯片、屏幕合一器件
CN120977877A (zh) * 2025-10-16 2025-11-18 甬矽电子(宁波)股份有限公司 引线框架封装方法和封装结构

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000299423A (ja) * 1999-04-16 2000-10-24 Hitachi Ltd リードフレームおよびそれを用いた半導体装置ならびにその製造方法
JP3879452B2 (ja) * 2001-07-23 2007-02-14 松下電器産業株式会社 樹脂封止型半導体装置およびその製造方法
JP2005057067A (ja) * 2003-08-05 2005-03-03 Renesas Technology Corp 半導体装置およびその製造方法

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