JPWO2023090261A5 - - Google Patents

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Publication number
JPWO2023090261A5
JPWO2023090261A5 JP2023561567A JP2023561567A JPWO2023090261A5 JP WO2023090261 A5 JPWO2023090261 A5 JP WO2023090261A5 JP 2023561567 A JP2023561567 A JP 2023561567A JP 2023561567 A JP2023561567 A JP 2023561567A JP WO2023090261 A5 JPWO2023090261 A5 JP WO2023090261A5
Authority
JP
Japan
Prior art keywords
resin
sealing resin
pillar
semiconductor device
viewed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023561567A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023090261A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/042025 external-priority patent/WO2023090261A1/ja
Publication of JPWO2023090261A1 publication Critical patent/JPWO2023090261A1/ja
Publication of JPWO2023090261A5 publication Critical patent/JPWO2023090261A5/ja
Pending legal-status Critical Current

Links

JP2023561567A 2021-11-19 2022-11-11 Pending JPWO2023090261A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021188396 2021-11-19
PCT/JP2022/042025 WO2023090261A1 (ja) 2021-11-19 2022-11-11 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023090261A1 JPWO2023090261A1 (cg-RX-API-DMAC7.html) 2023-05-25
JPWO2023090261A5 true JPWO2023090261A5 (cg-RX-API-DMAC7.html) 2024-08-02

Family

ID=86396931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023561567A Pending JPWO2023090261A1 (cg-RX-API-DMAC7.html) 2021-11-19 2022-11-11

Country Status (5)

Country Link
US (1) US20240297107A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2023090261A1 (cg-RX-API-DMAC7.html)
CN (1) CN118235240A (cg-RX-API-DMAC7.html)
DE (1) DE112022005523T5 (cg-RX-API-DMAC7.html)
WO (1) WO2023090261A1 (cg-RX-API-DMAC7.html)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3313009B2 (ja) * 1995-05-19 2002-08-12 新光電気工業株式会社 放熱部材、リードフレーム及び半導体装置
JP5928485B2 (ja) * 2012-02-09 2016-06-15 富士電機株式会社 半導体装置および半導体装置の製造方法
JP6046421B2 (ja) * 2012-08-31 2016-12-14 京セラ株式会社 配線基板および電子装置
JP7406973B2 (ja) * 2019-12-11 2023-12-28 ローム株式会社 半導体装置
JP7416638B2 (ja) * 2020-02-05 2024-01-17 ローム株式会社 半導体装置および半導体装置の製造方法

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