JPWO2024038746A5 - - Google Patents

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Publication number
JPWO2024038746A5
JPWO2024038746A5 JP2024541476A JP2024541476A JPWO2024038746A5 JP WO2024038746 A5 JPWO2024038746 A5 JP WO2024038746A5 JP 2024541476 A JP2024541476 A JP 2024541476A JP 2024541476 A JP2024541476 A JP 2024541476A JP WO2024038746 A5 JPWO2024038746 A5 JP WO2024038746A5
Authority
JP
Japan
Prior art keywords
opening
die pad
semiconductor device
main surface
pad portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024541476A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024038746A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/027378 external-priority patent/WO2024038746A1/ja
Publication of JPWO2024038746A1 publication Critical patent/JPWO2024038746A1/ja
Publication of JPWO2024038746A5 publication Critical patent/JPWO2024038746A5/ja
Pending legal-status Critical Current

Links

JP2024541476A 2022-08-19 2023-07-26 Pending JPWO2024038746A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022131067 2022-08-19
PCT/JP2023/027378 WO2024038746A1 (ja) 2022-08-19 2023-07-26 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024038746A1 JPWO2024038746A1 (cg-RX-API-DMAC7.html) 2024-02-22
JPWO2024038746A5 true JPWO2024038746A5 (cg-RX-API-DMAC7.html) 2025-04-28

Family

ID=89941515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024541476A Pending JPWO2024038746A1 (cg-RX-API-DMAC7.html) 2022-08-19 2023-07-26

Country Status (2)

Country Link
JP (1) JPWO2024038746A1 (cg-RX-API-DMAC7.html)
WO (1) WO2024038746A1 (cg-RX-API-DMAC7.html)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6832094B2 (ja) * 2016-08-05 2021-02-24 ローム株式会社 パワーモジュール及びモータ駆動回路
JP2019114618A (ja) * 2017-12-22 2019-07-11 株式会社デンソー 半導体装置
JP7548714B2 (ja) * 2019-03-25 2024-09-10 ローム株式会社 電子装置、電子装置の製造方法、およびリードフレーム
DE112021006152B4 (de) * 2020-12-24 2024-10-31 Rohm Co., Ltd. Halbleiterausrüstung
JPWO2022145177A1 (cg-RX-API-DMAC7.html) * 2021-01-04 2022-07-07

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