JPWO2024257543A5 - - Google Patents

Info

Publication number
JPWO2024257543A5
JPWO2024257543A5 JP2025527580A JP2025527580A JPWO2024257543A5 JP WO2024257543 A5 JPWO2024257543 A5 JP WO2024257543A5 JP 2025527580 A JP2025527580 A JP 2025527580A JP 2025527580 A JP2025527580 A JP 2025527580A JP WO2024257543 A5 JPWO2024257543 A5 JP WO2024257543A5
Authority
JP
Japan
Prior art keywords
boundary
partition
semiconductor device
section
extension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025527580A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024257543A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/018091 external-priority patent/WO2024257543A1/ja
Publication of JPWO2024257543A1 publication Critical patent/JPWO2024257543A1/ja
Publication of JPWO2024257543A5 publication Critical patent/JPWO2024257543A5/ja
Pending legal-status Critical Current

Links

JP2025527580A 2023-06-12 2024-05-16 Pending JPWO2024257543A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023096057 2023-06-12
PCT/JP2024/018091 WO2024257543A1 (ja) 2023-06-12 2024-05-16 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024257543A1 JPWO2024257543A1 (cg-RX-API-DMAC7.html) 2024-12-19
JPWO2024257543A5 true JPWO2024257543A5 (cg-RX-API-DMAC7.html) 2026-03-12

Family

ID=93852078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025527580A Pending JPWO2024257543A1 (cg-RX-API-DMAC7.html) 2023-06-12 2024-05-16

Country Status (5)

Country Link
US (1) US20260090404A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2024257543A1 (cg-RX-API-DMAC7.html)
CN (1) CN121312323A (cg-RX-API-DMAC7.html)
DE (1) DE112024002507T5 (cg-RX-API-DMAC7.html)
WO (1) WO2024257543A1 (cg-RX-API-DMAC7.html)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5380244B2 (ja) * 2009-10-22 2014-01-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5755186B2 (ja) * 2012-06-25 2015-07-29 三菱電機株式会社 半導体装置の製造方法および半導体装置
JP7527916B2 (ja) 2020-09-29 2024-08-05 ローム株式会社 半導体装置
DE112021006144T5 (de) * 2020-12-25 2023-09-07 Rohm Co., Ltd. Halbleiterbauteil

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