JPWO2023100754A5 - - Google Patents

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Publication number
JPWO2023100754A5
JPWO2023100754A5 JP2023564928A JP2023564928A JPWO2023100754A5 JP WO2023100754 A5 JPWO2023100754 A5 JP WO2023100754A5 JP 2023564928 A JP2023564928 A JP 2023564928A JP 2023564928 A JP2023564928 A JP 2023564928A JP WO2023100754 A5 JPWO2023100754 A5 JP WO2023100754A5
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JP
Japan
Prior art keywords
semiconductor device
surface portion
terminal portions
side portion
facing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023564928A
Other languages
English (en)
Japanese (ja)
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JPWO2023100754A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/043496 external-priority patent/WO2023100754A1/ja
Publication of JPWO2023100754A1 publication Critical patent/JPWO2023100754A1/ja
Publication of JPWO2023100754A5 publication Critical patent/JPWO2023100754A5/ja
Pending legal-status Critical Current

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JP2023564928A 2021-12-03 2022-11-25 Pending JPWO2023100754A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021196624 2021-12-03
PCT/JP2022/043496 WO2023100754A1 (ja) 2021-12-03 2022-11-25 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023100754A1 JPWO2023100754A1 (cg-RX-API-DMAC7.html) 2023-06-08
JPWO2023100754A5 true JPWO2023100754A5 (cg-RX-API-DMAC7.html) 2024-08-15

Family

ID=86612155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023564928A Pending JPWO2023100754A1 (cg-RX-API-DMAC7.html) 2021-12-03 2022-11-25

Country Status (5)

Country Link
US (1) US20240282690A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2023100754A1 (cg-RX-API-DMAC7.html)
CN (1) CN118355490A (cg-RX-API-DMAC7.html)
DE (1) DE112022005309T5 (cg-RX-API-DMAC7.html)
WO (1) WO2023100754A1 (cg-RX-API-DMAC7.html)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008106339A (ja) * 2006-10-27 2008-05-08 Renesas Technology Corp 半導体装置の製造方法
JP6121692B2 (ja) * 2012-11-05 2017-04-26 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP6518547B2 (ja) * 2015-08-07 2019-05-22 新光電気工業株式会社 リードフレーム、半導体装置及びリードフレームの製造方法
JP6721346B2 (ja) 2016-01-27 2020-07-15 ローム株式会社 半導体装置
JP7001503B2 (ja) * 2018-01-15 2022-01-19 ローム株式会社 半導体装置、および半導体装置の製造方法
WO2021199635A1 (ja) * 2020-03-30 2021-10-07 ローム株式会社 半導体装置

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