JPWO2023085033A5 - - Google Patents

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Publication number
JPWO2023085033A5
JPWO2023085033A5 JP2023559525A JP2023559525A JPWO2023085033A5 JP WO2023085033 A5 JPWO2023085033 A5 JP WO2023085033A5 JP 2023559525 A JP2023559525 A JP 2023559525A JP 2023559525 A JP2023559525 A JP 2023559525A JP WO2023085033 A5 JPWO2023085033 A5 JP WO2023085033A5
Authority
JP
Japan
Prior art keywords
semiconductor device
terminals
dimension
terminal
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023559525A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023085033A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/039095 external-priority patent/WO2023085033A1/ja
Publication of JPWO2023085033A1 publication Critical patent/JPWO2023085033A1/ja
Publication of JPWO2023085033A5 publication Critical patent/JPWO2023085033A5/ja
Pending legal-status Critical Current

Links

JP2023559525A 2021-11-12 2022-10-20 Pending JPWO2023085033A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021185249 2021-11-12
PCT/JP2022/039095 WO2023085033A1 (ja) 2021-11-12 2022-10-20 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023085033A1 JPWO2023085033A1 (cg-RX-API-DMAC7.html) 2023-05-19
JPWO2023085033A5 true JPWO2023085033A5 (cg-RX-API-DMAC7.html) 2024-07-30

Family

ID=86335639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023559525A Pending JPWO2023085033A1 (cg-RX-API-DMAC7.html) 2021-11-12 2022-10-20

Country Status (4)

Country Link
US (1) US20240297102A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2023085033A1 (cg-RX-API-DMAC7.html)
CN (1) CN118382927A (cg-RX-API-DMAC7.html)
WO (1) WO2023085033A1 (cg-RX-API-DMAC7.html)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000286378A (ja) * 1999-03-31 2000-10-13 Mitsui High Tec Inc 樹脂封止型半導体装置
JP2014236168A (ja) * 2013-06-04 2014-12-15 ルネサスエレクトロニクス株式会社 半導体装置及び半導体装置の製造方法
JP7210868B2 (ja) * 2018-09-05 2023-01-24 ローム株式会社 半導体装置

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