JPWO2024024371A5 - - Google Patents

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Publication number
JPWO2024024371A5
JPWO2024024371A5 JP2024536872A JP2024536872A JPWO2024024371A5 JP WO2024024371 A5 JPWO2024024371 A5 JP WO2024024371A5 JP 2024536872 A JP2024536872 A JP 2024536872A JP 2024536872 A JP2024536872 A JP 2024536872A JP WO2024024371 A5 JPWO2024024371 A5 JP WO2024024371A5
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JP
Japan
Prior art keywords
layer
semiconductor device
coating
support
conductive
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024536872A
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English (en)
Japanese (ja)
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JPWO2024024371A1 (cg-RX-API-DMAC7.html
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Priority claimed from PCT/JP2023/023816 external-priority patent/WO2024024371A1/ja
Publication of JPWO2024024371A1 publication Critical patent/JPWO2024024371A1/ja
Publication of JPWO2024024371A5 publication Critical patent/JPWO2024024371A5/ja
Pending legal-status Critical Current

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JP2024536872A 2022-07-27 2023-06-27 Pending JPWO2024024371A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022119652 2022-07-27
PCT/JP2023/023816 WO2024024371A1 (ja) 2022-07-27 2023-06-27 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024024371A1 JPWO2024024371A1 (cg-RX-API-DMAC7.html) 2024-02-01
JPWO2024024371A5 true JPWO2024024371A5 (cg-RX-API-DMAC7.html) 2025-04-03

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ID=89706044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024536872A Pending JPWO2024024371A1 (cg-RX-API-DMAC7.html) 2022-07-27 2023-06-27

Country Status (4)

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US (1) US20250157913A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2024024371A1 (cg-RX-API-DMAC7.html)
CN (1) CN119585864A (cg-RX-API-DMAC7.html)
WO (1) WO2024024371A1 (cg-RX-API-DMAC7.html)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4234518B2 (ja) * 2003-07-25 2009-03-04 新光電気工業株式会社 半導体搭載用基板製造方法、半導体パッケージ製造方法、半導体搭載用基板及び半導体パッケージ
JP6327058B2 (ja) * 2014-08-18 2018-05-23 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板、接合体の製造方法、パワーモジュール用基板の製造方法、及び、ヒートシンク付パワーモジュール用基板の製造方法
JP7125931B2 (ja) * 2017-03-31 2022-08-25 ローム株式会社 パワーモジュールおよびその製造方法
EP3875267A4 (en) * 2018-10-31 2022-08-03 Mitsubishi Materials Corporation CARBON ELEMENT INCLUDING A METALLIC LAYER AND THERMAL CONDUCTION PLATE

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