JPWO2023282013A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2023282013A5 JPWO2023282013A5 JP2023533494A JP2023533494A JPWO2023282013A5 JP WO2023282013 A5 JPWO2023282013 A5 JP WO2023282013A5 JP 2023533494 A JP2023533494 A JP 2023533494A JP 2023533494 A JP2023533494 A JP 2023533494A JP WO2023282013 A5 JPWO2023282013 A5 JP WO2023282013A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- electrode
- metal
- wires
- covering portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021112383 | 2021-07-06 | ||
| PCT/JP2022/024140 WO2023282013A1 (ja) | 2021-07-06 | 2022-06-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023282013A1 JPWO2023282013A1 (cg-RX-API-DMAC7.html) | 2023-01-12 |
| JPWO2023282013A5 true JPWO2023282013A5 (cg-RX-API-DMAC7.html) | 2024-04-05 |
Family
ID=84800220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023533494A Pending JPWO2023282013A1 (cg-RX-API-DMAC7.html) | 2021-07-06 | 2022-06-16 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240128169A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JPWO2023282013A1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN117616567A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2023282013A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7678773B2 (ja) * | 2022-02-15 | 2025-05-16 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| JPWO2024171887A1 (cg-RX-API-DMAC7.html) * | 2023-02-17 | 2024-08-22 | ||
| WO2025052798A1 (ja) * | 2023-09-06 | 2025-03-13 | ローム株式会社 | 半導体装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5975911B2 (ja) * | 2013-03-15 | 2016-08-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP6817777B2 (ja) * | 2015-12-16 | 2021-01-20 | ローム株式会社 | 半導体装置 |
| JP7280261B2 (ja) * | 2018-07-12 | 2023-05-23 | ローム株式会社 | 半導体素子および半導体装置 |
| JP6826665B2 (ja) * | 2018-12-27 | 2021-02-03 | 三菱電機株式会社 | 半導体装置、半導体装置の製造方法及び電力変換装置 |
-
2022
- 2022-06-16 WO PCT/JP2022/024140 patent/WO2023282013A1/ja not_active Ceased
- 2022-06-16 CN CN202280047968.2A patent/CN117616567A/zh active Pending
- 2022-06-16 JP JP2023533494A patent/JPWO2023282013A1/ja active Pending
-
2023
- 2023-12-08 US US18/533,721 patent/US20240128169A1/en active Pending