JPWO2023136264A5 - - Google Patents

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Publication number
JPWO2023136264A5
JPWO2023136264A5 JP2023574048A JP2023574048A JPWO2023136264A5 JP WO2023136264 A5 JPWO2023136264 A5 JP WO2023136264A5 JP 2023574048 A JP2023574048 A JP 2023574048A JP 2023574048 A JP2023574048 A JP 2023574048A JP WO2023136264 A5 JPWO2023136264 A5 JP WO2023136264A5
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JP
Japan
Prior art keywords
copper
resin
power module
cooler
semiconductor device
Prior art date
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Granted
Application number
JP2023574048A
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English (en)
Japanese (ja)
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JP7693024B2 (ja
JPWO2023136264A1 (cg-RX-API-DMAC7.html
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Priority claimed from PCT/JP2023/000462 external-priority patent/WO2023136264A1/ja
Publication of JPWO2023136264A1 publication Critical patent/JPWO2023136264A1/ja
Publication of JPWO2023136264A5 publication Critical patent/JPWO2023136264A5/ja
Application granted granted Critical
Publication of JP7693024B2 publication Critical patent/JP7693024B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023574048A 2022-01-13 2023-01-11 樹脂封止型半導体装置 Active JP7693024B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022003454 2022-01-13
JP2022003454 2022-01-13
PCT/JP2023/000462 WO2023136264A1 (ja) 2022-01-13 2023-01-11 樹脂封止型半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023136264A1 JPWO2023136264A1 (cg-RX-API-DMAC7.html) 2023-07-20
JPWO2023136264A5 true JPWO2023136264A5 (cg-RX-API-DMAC7.html) 2024-09-03
JP7693024B2 JP7693024B2 (ja) 2025-06-16

Family

ID=87068971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023574048A Active JP7693024B2 (ja) 2022-01-13 2023-01-11 樹脂封止型半導体装置

Country Status (5)

Country Link
US (1) US20230223317A1 (cg-RX-API-DMAC7.html)
JP (1) JP7693024B2 (cg-RX-API-DMAC7.html)
CN (2) CN116435271A (cg-RX-API-DMAC7.html)
DE (1) DE112023000590T5 (cg-RX-API-DMAC7.html)
WO (1) WO2023136264A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230402293A1 (en) * 2022-06-09 2023-12-14 Skyworks Solutions, Inc. Methods for manufacturing electronic packages and electronic assemblies

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05345969A (ja) * 1992-06-12 1993-12-27 Kobe Steel Ltd 半田付け性及びめっき密着性に優れたＡｌ系合金金属材
JP4159897B2 (ja) * 2003-02-26 2008-10-01 東洋鋼鈑株式会社 ハンダ性に優れた表面処理Ａｌ板、それを用いたヒートシンク、およびハンダ性に優れた表面処理Ａｌ板の製造方法
JP5344888B2 (ja) * 2008-11-06 2013-11-20 三菱電機株式会社 半導体装置
JP6877600B1 (ja) * 2020-01-16 2021-05-26 三菱電機株式会社 半導体装置

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