JPWO2024190410A5 - - Google Patents

Info

Publication number
JPWO2024190410A5
JPWO2024190410A5 JP2025506680A JP2025506680A JPWO2024190410A5 JP WO2024190410 A5 JPWO2024190410 A5 JP WO2024190410A5 JP 2025506680 A JP2025506680 A JP 2025506680A JP 2025506680 A JP2025506680 A JP 2025506680A JP WO2024190410 A5 JPWO2024190410 A5 JP WO2024190410A5
Authority
JP
Japan
Prior art keywords
resin composition
interlayer insulating
semiconductor device
insulating film
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025506680A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024190410A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/007249 external-priority patent/WO2024190410A1/ja
Publication of JPWO2024190410A1 publication Critical patent/JPWO2024190410A1/ja
Publication of JPWO2024190410A5 publication Critical patent/JPWO2024190410A5/ja
Pending legal-status Critical Current

Links

JP2025506680A 2023-03-10 2024-02-28 Pending JPWO2024190410A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023037498 2023-03-10
PCT/JP2024/007249 WO2024190410A1 (ja) 2023-03-10 2024-02-28 半導体装置及び樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2024190410A1 JPWO2024190410A1 (https=) 2024-09-19
JPWO2024190410A5 true JPWO2024190410A5 (https=) 2025-11-26

Family

ID=92754974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025506680A Pending JPWO2024190410A1 (https=) 2023-03-10 2024-02-28

Country Status (5)

Country Link
JP (1) JPWO2024190410A1 (https=)
KR (1) KR20250154396A (https=)
CN (1) CN120917567A (https=)
TW (1) TW202505700A (https=)
WO (1) WO2024190410A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007207872A (ja) * 2006-01-31 2007-08-16 Nec Electronics Corp 配線基板および半導体装置ならびにそれらの製造方法
JP2011001473A (ja) * 2009-06-19 2011-01-06 Hitachi Chem Co Ltd 電子部品用絶縁材料
JP6570259B2 (ja) * 2015-02-11 2019-09-04 ナミックス株式会社 樹脂組成物、絶縁フィルム、および半導体装置
JP7088639B2 (ja) 2017-08-01 2022-06-21 旭化成株式会社 半導体装置、及びその製造方法
WO2019012953A1 (ja) * 2017-07-12 2019-01-17 パナソニックＩｐマネジメント株式会社 金属張積層板、樹脂付き金属箔、及び配線板

Similar Documents

Publication Publication Date Title
US4902732A (en) Epoxy resin-based curable compositions
TWI867684B (zh) 具有熱傳導性黏著層的熱傳導性聚矽氧橡膠片及其製造方法
JP2019203122A (ja) 半導体封止用熱硬化性マレイミド樹脂組成物及び半導体装置
CN117736680A (zh) 一种绝缘胶组合物及其制备方法和应用
CN103571412B (zh) 高压条件下具有增强可靠性的粘胶剂及使用该粘胶剂用于半导体封装的胶带
EP3925993B1 (en) Photocurable resin composition and cured product obtained by curing same
JPS6013841A (ja) 成形用エポキシ樹脂組成物
JPWO2024190410A5 (https=)
CN113004462A (zh) 热固性树脂组合物及其应用
JPS63304021A (ja) エポキシ樹脂組成物
JP5107177B2 (ja) ダイボンド剤組成物
TW202009272A (zh) 半導體封裝用熱固性樹脂組合物和半導體裝置
TW201516088A (zh) 薄膜用樹脂組成物、絕緣膜及半導體裝置
Ohtsuka et al. Properties of polyrotaxane modified maleimide resin with a phase‐separated structure
JP2713320B2 (ja) エポキシ樹脂組成物
JP5234910B2 (ja) 接着剤組成物
JP7651073B1 (ja) プライマー組成物、電気絶縁用注型成形品およびその製造方法
JP7651084B1 (ja) 電気絶縁用注型成形品およびその製造方法
WO2024190410A1 (ja) 半導体装置及び樹脂組成物
JP3578592B2 (ja) 半導体用ダイアタッチ樹脂ペースト
WO2023058425A1 (ja) 樹脂組成物、半導体装置及び半導体装置の製造方法
WO1999000435A1 (en) Polymerizable resin, and cured resins, insulators, components of electrical appliances, and electrical appliances made by using the same
WO2025074949A1 (ja) 紫外線硬化性組成物
JPH09316177A (ja) 半導体封止用エポキシ樹脂組成物
WO2024063069A1 (ja) 紫外線硬化性組成物およびその用途