JPWO2024185371A5 - - Google Patents
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- Publication number
- JPWO2024185371A5 JPWO2024185371A5 JP2024558190A JP2024558190A JPWO2024185371A5 JP WO2024185371 A5 JPWO2024185371 A5 JP WO2024185371A5 JP 2024558190 A JP2024558190 A JP 2024558190A JP 2024558190 A JP2024558190 A JP 2024558190A JP WO2024185371 A5 JPWO2024185371 A5 JP WO2024185371A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- component
- composition according
- mass
- styrene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025111208A JP7807849B2 (ja) | 2023-03-06 | 2025-07-01 | 樹脂組成物、並びに接着フィルム、積層基板、電子部品、及び半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023033944 | 2023-03-06 | ||
| JP2023033944 | 2023-03-06 | ||
| PCT/JP2024/003967 WO2024185371A1 (ja) | 2023-03-06 | 2024-02-06 | 樹脂組成物、並びにこれを用いた層間絶縁用の接着フィルム、積層基板、電子部品、及び半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025111208A Division JP7807849B2 (ja) | 2023-03-06 | 2025-07-01 | 樹脂組成物、並びに接着フィルム、積層基板、電子部品、及び半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024185371A1 JPWO2024185371A1 (cg-RX-API-DMAC7.html) | 2024-09-12 |
| JPWO2024185371A5 true JPWO2024185371A5 (cg-RX-API-DMAC7.html) | 2025-02-12 |
| JP7710267B2 JP7710267B2 (ja) | 2025-07-18 |
Family
ID=92674421
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024558190A Active JP7710267B2 (ja) | 2023-03-06 | 2024-02-06 | 樹脂組成物、並びに接着フィルム、積層基板、電子部品、及び半導体装置 |
| JP2025111208A Active JP7807849B2 (ja) | 2023-03-06 | 2025-07-01 | 樹脂組成物、並びに接着フィルム、積層基板、電子部品、及び半導体装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025111208A Active JP7807849B2 (ja) | 2023-03-06 | 2025-07-01 | 樹脂組成物、並びに接着フィルム、積層基板、電子部品、及び半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP7710267B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20250158018A (cg-RX-API-DMAC7.html) |
| CN (1) | CN120677207A (cg-RX-API-DMAC7.html) |
| TW (1) | TW202442795A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2024185371A1 (cg-RX-API-DMAC7.html) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5463110B2 (ja) * | 2009-09-24 | 2014-04-09 | ナミックス株式会社 | カバーレイフィルム |
| JP2011225639A (ja) * | 2010-04-15 | 2011-11-10 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物並びにこれを用いた樹脂ワニス、プリプレグ及び金属張積層板 |
| JP5955156B2 (ja) * | 2012-08-10 | 2016-07-20 | ナミックス株式会社 | 樹脂組成物、ならびに、それによる接着フィルムおよびカバーレイフィルム |
| WO2014148155A1 (ja) * | 2013-03-22 | 2014-09-25 | ナミックス株式会社 | 樹脂組成物、ならびに、それによる接着フィルム、カバーレイフィルム、層間接着剤 |
| JP6726877B2 (ja) * | 2016-07-04 | 2020-07-22 | パナソニックIpマネジメント株式会社 | 樹脂付き金属箔、積層板、プリント配線板及び多層プリント配線板 |
| US12098257B2 (en) * | 2019-07-17 | 2024-09-24 | Panasonic Intellectual Property Management Co., Ltd. | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board |
| JP7124227B2 (ja) * | 2019-08-06 | 2022-08-23 | 日本曹達株式会社 | ポリフェニレンエーテル樹脂組成物、プリプレグ、及び金属張積層板 |
| WO2021060046A1 (ja) * | 2019-09-27 | 2021-04-01 | パナソニックIpマネジメント株式会社 | 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板 |
| KR20230132809A (ko) * | 2021-01-27 | 2023-09-18 | 덴카 주식회사 | 구상 알루미나 입자 및 그 제조 방법, 그리고 수지조성물 |
| US12325770B2 (en) * | 2021-08-25 | 2025-06-10 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board |
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2024
- 2024-02-06 KR KR1020257027012A patent/KR20250158018A/ko active Pending
- 2024-02-06 CN CN202480013862.XA patent/CN120677207A/zh active Pending
- 2024-02-06 JP JP2024558190A patent/JP7710267B2/ja active Active
- 2024-02-06 WO PCT/JP2024/003967 patent/WO2024185371A1/ja not_active Ceased
- 2024-02-26 TW TW113106776A patent/TW202442795A/zh unknown
-
2025
- 2025-07-01 JP JP2025111208A patent/JP7807849B2/ja active Active