JPWO2024176864A5 - - Google Patents
Info
- Publication number
- JPWO2024176864A5 JPWO2024176864A5 JP2025502273A JP2025502273A JPWO2024176864A5 JP WO2024176864 A5 JPWO2024176864 A5 JP WO2024176864A5 JP 2025502273 A JP2025502273 A JP 2025502273A JP 2025502273 A JP2025502273 A JP 2025502273A JP WO2024176864 A5 JPWO2024176864 A5 JP WO2024176864A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- etching method
- silicon
- containing layer
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023025510 | 2023-02-21 | ||
| PCT/JP2024/004407 WO2024176864A1 (ja) | 2023-02-21 | 2024-02-08 | エッチング方法及びプラズマ処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024176864A1 JPWO2024176864A1 (https=) | 2024-08-29 |
| JPWO2024176864A5 true JPWO2024176864A5 (https=) | 2026-01-05 |
Family
ID=92500838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025502273A Pending JPWO2024176864A1 (https=) | 2023-02-21 | 2024-02-08 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250372381A1 (https=) |
| JP (1) | JPWO2024176864A1 (https=) |
| KR (1) | KR20250154414A (https=) |
| CN (1) | CN120693684A (https=) |
| TW (1) | TW202437387A (https=) |
| WO (1) | WO2024176864A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100497474B1 (ko) * | 2003-06-20 | 2005-07-01 | 주식회사 하이닉스반도체 | 반도체소자의 게이트전극 형성방법 |
| CN114207858B (zh) * | 2019-07-31 | 2026-01-13 | 朗姆研究公司 | 用于mram图案化的化学蚀刻非挥发性材料 |
| US11837471B2 (en) | 2019-12-17 | 2023-12-05 | Tokyo Electron Limited | Methods of patterning small features |
| EP4368749A4 (en) * | 2021-07-05 | 2025-09-24 | Tokyo Electron Ltd | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS |
-
2024
- 2024-02-07 TW TW113104873A patent/TW202437387A/zh unknown
- 2024-02-08 WO PCT/JP2024/004407 patent/WO2024176864A1/ja not_active Ceased
- 2024-02-08 JP JP2025502273A patent/JPWO2024176864A1/ja active Pending
- 2024-02-08 KR KR1020257030371A patent/KR20250154414A/ko active Pending
- 2024-02-08 CN CN202480012643.XA patent/CN120693684A/zh active Pending
-
2025
- 2025-08-13 US US19/298,198 patent/US20250372381A1/en active Pending
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