JPWO2024162171A5 - - Google Patents

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Publication number
JPWO2024162171A5
JPWO2024162171A5 JP2024574836A JP2024574836A JPWO2024162171A5 JP WO2024162171 A5 JPWO2024162171 A5 JP WO2024162171A5 JP 2024574836 A JP2024574836 A JP 2024574836A JP 2024574836 A JP2024574836 A JP 2024574836A JP WO2024162171 A5 JPWO2024162171 A5 JP WO2024162171A5
Authority
JP
Japan
Prior art keywords
substrate
processing apparatus
plasma processing
substrate support
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024574836A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024162171A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/002218 external-priority patent/WO2024162171A1/ja
Publication of JPWO2024162171A1 publication Critical patent/JPWO2024162171A1/ja
Publication of JPWO2024162171A5 publication Critical patent/JPWO2024162171A5/ja
Pending legal-status Critical Current

Links

JP2024574836A 2023-02-03 2024-01-25 Pending JPWO2024162171A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023015672 2023-02-03
PCT/JP2024/002218 WO2024162171A1 (ja) 2023-02-03 2024-01-25 プラズマ処理装置及びプラズマエッチング方法

Publications (2)

Publication Number Publication Date
JPWO2024162171A1 JPWO2024162171A1 (https=) 2024-08-08
JPWO2024162171A5 true JPWO2024162171A5 (https=) 2025-10-16

Family

ID=92146646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024574836A Pending JPWO2024162171A1 (https=) 2023-02-03 2024-01-25

Country Status (4)

Country Link
US (1) US20250349524A1 (https=)
JP (1) JPWO2024162171A1 (https=)
TW (1) TW202503828A (https=)
WO (1) WO2024162171A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022224795A1 (ja) * 2021-04-23 2022-10-27 東京エレクトロン株式会社 プラズマ処理装置及び基板処理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251397A (ja) * 1992-03-05 1993-09-28 Fujitsu Ltd 基板温度の測定方法
JPH08222549A (ja) * 1995-02-16 1996-08-30 Sony Corp プラズマ処理装置およびプラズマ処理方法
JP2020043180A (ja) * 2018-09-07 2020-03-19 東京エレクトロン株式会社 基板処理装置及び基板処理方法
WO2020110192A1 (ja) * 2018-11-27 2020-06-04 株式会社日立ハイテクノロジーズ プラズマ処理装置及びそれを用いた試料の処理方法

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