JPWO2024150666A1 - - Google Patents

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Publication number
JPWO2024150666A1
JPWO2024150666A1 JP2024570142A JP2024570142A JPWO2024150666A1 JP WO2024150666 A1 JPWO2024150666 A1 JP WO2024150666A1 JP 2024570142 A JP2024570142 A JP 2024570142A JP 2024570142 A JP2024570142 A JP 2024570142A JP WO2024150666 A1 JPWO2024150666 A1 JP WO2024150666A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024570142A
Other languages
Japanese (ja)
Other versions
JP7675954B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024150666A1 publication Critical patent/JPWO2024150666A1/ja
Priority to JP2025074159A priority Critical patent/JP2025114638A/ja
Application granted granted Critical
Publication of JP7675954B2 publication Critical patent/JP7675954B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H01J37/32183—Matching circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/3211—Antennas, e.g. particular shapes of coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/32119—Windows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
    • H01J37/32155—Frequency modulation
    • H01J37/32165—Plural frequencies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
JP2024570142A 2023-01-12 2023-12-25 プラズマ処理装置及びプラズマ処理方法 Active JP7675954B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025074159A JP2025114638A (ja) 2023-01-12 2025-04-28 プラズマ処理装置及びプラズマ処理方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023002993 2023-01-12
JP2023002993 2023-01-12
PCT/JP2023/046507 WO2024150666A1 (ja) 2023-01-12 2023-12-25 プラズマ処理装置及びプラズマ処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025074159A Division JP2025114638A (ja) 2023-01-12 2025-04-28 プラズマ処理装置及びプラズマ処理方法

Publications (2)

Publication Number Publication Date
JPWO2024150666A1 true JPWO2024150666A1 (https=) 2024-07-18
JP7675954B2 JP7675954B2 (ja) 2025-05-13

Family

ID=91896897

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024570142A Active JP7675954B2 (ja) 2023-01-12 2023-12-25 プラズマ処理装置及びプラズマ処理方法
JP2025074159A Pending JP2025114638A (ja) 2023-01-12 2025-04-28 プラズマ処理装置及びプラズマ処理方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025074159A Pending JP2025114638A (ja) 2023-01-12 2025-04-28 プラズマ処理装置及びプラズマ処理方法

Country Status (7)

Country Link
US (1) US20250343028A1 (https=)
EP (1) EP4651631A1 (https=)
JP (2) JP7675954B2 (https=)
KR (1) KR20250123936A (https=)
CN (1) CN120457773B (https=)
TW (1) TW202449837A (https=)
WO (1) WO2024150666A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026034454A1 (ja) * 2024-08-06 2026-02-12 パナソニックＩｐマネジメント株式会社 電波放射装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016528667A (ja) * 2013-06-17 2016-09-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ プラズマチャンバ内での高速で再現性のあるプラズマの点火及び同調のための方法
US20190252153A1 (en) * 2018-02-14 2019-08-15 Research & Business Foundation Sungkyunkwan University Apparatus for generating plasma and apparatus for treating substrate having the same
JP2020155814A (ja) * 2019-03-18 2020-09-24 コニカミノルタ株式会社 画像形成システムおよび異常紙情報表示方法
JP2022139328A (ja) * 2021-03-11 2022-09-26 東京エレクトロン株式会社 着火方法及びプラズマ処理装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008226857A (ja) * 2008-05-16 2008-09-25 Matsushita Electric Ind Co Ltd プラズマ処理方法及び装置
JP5479867B2 (ja) * 2009-01-14 2014-04-23 東京エレクトロン株式会社 誘導結合プラズマ処理装置
JP5851681B2 (ja) 2009-10-27 2016-02-03 東京エレクトロン株式会社 プラズマ処理装置
JP5606821B2 (ja) * 2010-08-04 2014-10-15 東京エレクトロン株式会社 プラズマ処理装置
JP2020158814A (ja) * 2019-03-26 2020-10-01 東京エレクトロン株式会社 成膜装置および成膜方法
JP7503993B2 (ja) * 2020-10-08 2024-06-21 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016528667A (ja) * 2013-06-17 2016-09-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ プラズマチャンバ内での高速で再現性のあるプラズマの点火及び同調のための方法
US20190252153A1 (en) * 2018-02-14 2019-08-15 Research & Business Foundation Sungkyunkwan University Apparatus for generating plasma and apparatus for treating substrate having the same
JP2020155814A (ja) * 2019-03-18 2020-09-24 コニカミノルタ株式会社 画像形成システムおよび異常紙情報表示方法
JP2022139328A (ja) * 2021-03-11 2022-09-26 東京エレクトロン株式会社 着火方法及びプラズマ処理装置

Also Published As

Publication number Publication date
CN120457773B (zh) 2026-04-28
KR20250123936A (ko) 2025-08-18
CN120457773A (zh) 2025-08-08
EP4651631A1 (en) 2025-11-19
JP7675954B2 (ja) 2025-05-13
WO2024150666A1 (ja) 2024-07-18
US20250343028A1 (en) 2025-11-06
TW202449837A (zh) 2024-12-16
JP2025114638A (ja) 2025-08-05

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