JPWO2024135456A5 - - Google Patents

Info

Publication number
JPWO2024135456A5
JPWO2024135456A5 JP2024565833A JP2024565833A JPWO2024135456A5 JP WO2024135456 A5 JPWO2024135456 A5 JP WO2024135456A5 JP 2024565833 A JP2024565833 A JP 2024565833A JP 2024565833 A JP2024565833 A JP 2024565833A JP WO2024135456 A5 JPWO2024135456 A5 JP WO2024135456A5
Authority
JP
Japan
Prior art keywords
base metal
metal layer
forming
groove
electrolytic plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2024565833A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024135456A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/044427 external-priority patent/WO2024135456A1/ja
Publication of JPWO2024135456A1 publication Critical patent/JPWO2024135456A1/ja
Publication of JPWO2024135456A5 publication Critical patent/JPWO2024135456A5/ja
Withdrawn legal-status Critical Current

Links

JP2024565833A 2022-12-20 2023-12-12 Withdrawn JPWO2024135456A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022203673 2022-12-20
JP2023029616 2023-02-28
PCT/JP2023/044427 WO2024135456A1 (ja) 2022-12-20 2023-12-12 配線基板およびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2024135456A1 JPWO2024135456A1 (https=) 2024-06-27
JPWO2024135456A5 true JPWO2024135456A5 (https=) 2025-11-12

Family

ID=91588520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024565833A Withdrawn JPWO2024135456A1 (https=) 2022-12-20 2023-12-12

Country Status (3)

Country Link
JP (1) JPWO2024135456A1 (https=)
TW (1) TWI889081B (https=)
WO (1) WO2024135456A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004165321A (ja) * 2002-11-12 2004-06-10 Kyocera Corp 配線基板およびその製造方法
TWI268130B (en) * 2004-12-23 2006-12-01 Phoenix Prec Technology Corp Method for fabricating a multi-layer packaging substrate
JP5221887B2 (ja) * 2007-03-22 2013-06-26 京セラＳｌｃテクノロジー株式会社 配線基盤の製造方法
TWI413468B (zh) * 2010-12-29 2013-10-21 Unimicron Technology Corp 製造內嵌式細線路之方法
JP6457881B2 (ja) * 2015-04-22 2019-01-23 新光電気工業株式会社 配線基板及びその製造方法
JP2017084979A (ja) * 2015-10-28 2017-05-18 富士通株式会社 配線の形成方法および配線構造
JP7159059B2 (ja) * 2019-01-09 2022-10-24 新光電気工業株式会社 積層基板及び積層基板製造方法

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