JPWO2024135456A1 - - Google Patents

Info

Publication number
JPWO2024135456A1
JPWO2024135456A1 JP2024565833A JP2024565833A JPWO2024135456A1 JP WO2024135456 A1 JPWO2024135456 A1 JP WO2024135456A1 JP 2024565833 A JP2024565833 A JP 2024565833A JP 2024565833 A JP2024565833 A JP 2024565833A JP WO2024135456 A1 JPWO2024135456 A1 JP WO2024135456A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2024565833A
Other languages
Japanese (ja)
Other versions
JPWO2024135456A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024135456A1 publication Critical patent/JPWO2024135456A1/ja
Publication of JPWO2024135456A5 publication Critical patent/JPWO2024135456A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2024565833A 2022-12-20 2023-12-12 Withdrawn JPWO2024135456A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022203673 2022-12-20
JP2023029616 2023-02-28
PCT/JP2023/044427 WO2024135456A1 (ja) 2022-12-20 2023-12-12 配線基板およびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2024135456A1 true JPWO2024135456A1 (https=) 2024-06-27
JPWO2024135456A5 JPWO2024135456A5 (https=) 2025-11-12

Family

ID=91588520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024565833A Withdrawn JPWO2024135456A1 (https=) 2022-12-20 2023-12-12

Country Status (3)

Country Link
JP (1) JPWO2024135456A1 (https=)
TW (1) TWI889081B (https=)
WO (1) WO2024135456A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004165321A (ja) * 2002-11-12 2004-06-10 Kyocera Corp 配線基板およびその製造方法
TWI268130B (en) * 2004-12-23 2006-12-01 Phoenix Prec Technology Corp Method for fabricating a multi-layer packaging substrate
JP5221887B2 (ja) * 2007-03-22 2013-06-26 京セラＳｌｃテクノロジー株式会社 配線基盤の製造方法
TWI413468B (zh) * 2010-12-29 2013-10-21 Unimicron Technology Corp 製造內嵌式細線路之方法
JP6457881B2 (ja) * 2015-04-22 2019-01-23 新光電気工業株式会社 配線基板及びその製造方法
JP2017084979A (ja) * 2015-10-28 2017-05-18 富士通株式会社 配線の形成方法および配線構造
JP7159059B2 (ja) * 2019-01-09 2022-10-24 新光電気工業株式会社 積層基板及び積層基板製造方法

Also Published As

Publication number Publication date
TWI889081B (zh) 2025-07-01
WO2024135456A1 (ja) 2024-06-27
TW202442036A (zh) 2024-10-16

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