TWI889081B - 配線基板及其製造方法 - Google Patents

配線基板及其製造方法 Download PDF

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Publication number
TWI889081B
TWI889081B TW112149567A TW112149567A TWI889081B TW I889081 B TWI889081 B TW I889081B TW 112149567 A TW112149567 A TW 112149567A TW 112149567 A TW112149567 A TW 112149567A TW I889081 B TWI889081 B TW I889081B
Authority
TW
Taiwan
Prior art keywords
layer
insulating layer
trench
base metal
conductor
Prior art date
Application number
TW112149567A
Other languages
English (en)
Chinese (zh)
Other versions
TW202442036A (zh
Inventor
仲井宏和
清水範征
Original Assignee
日商京瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202442036A publication Critical patent/TW202442036A/zh
Application granted granted Critical
Publication of TWI889081B publication Critical patent/TWI889081B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW112149567A 2022-12-20 2023-12-19 配線基板及其製造方法 TWI889081B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2022203673 2022-12-20
JP2022-203673 2022-12-20
JP2023029616 2023-02-28
JP2023-029616 2023-02-28

Publications (2)

Publication Number Publication Date
TW202442036A TW202442036A (zh) 2024-10-16
TWI889081B true TWI889081B (zh) 2025-07-01

Family

ID=91588520

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112149567A TWI889081B (zh) 2022-12-20 2023-12-19 配線基板及其製造方法

Country Status (3)

Country Link
JP (1) JPWO2024135456A1 (https=)
TW (1) TWI889081B (https=)
WO (1) WO2024135456A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004165321A (ja) * 2002-11-12 2004-06-10 Kyocera Corp 配線基板およびその製造方法
TW200623997A (en) * 2004-12-23 2006-07-01 Phoenix Prec Technology Corp Method for fabricating a multi-layer packaging substrate
TW201228501A (en) * 2010-12-29 2012-07-01 Unimicron Technology Corp Method for forming embedded circuit

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5221887B2 (ja) * 2007-03-22 2013-06-26 京セラＳｌｃテクノロジー株式会社 配線基盤の製造方法
JP6457881B2 (ja) * 2015-04-22 2019-01-23 新光電気工業株式会社 配線基板及びその製造方法
JP2017084979A (ja) * 2015-10-28 2017-05-18 富士通株式会社 配線の形成方法および配線構造
JP7159059B2 (ja) * 2019-01-09 2022-10-24 新光電気工業株式会社 積層基板及び積層基板製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004165321A (ja) * 2002-11-12 2004-06-10 Kyocera Corp 配線基板およびその製造方法
TW200623997A (en) * 2004-12-23 2006-07-01 Phoenix Prec Technology Corp Method for fabricating a multi-layer packaging substrate
TW201228501A (en) * 2010-12-29 2012-07-01 Unimicron Technology Corp Method for forming embedded circuit

Also Published As

Publication number Publication date
WO2024135456A1 (ja) 2024-06-27
TW202442036A (zh) 2024-10-16
JPWO2024135456A1 (https=) 2024-06-27

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