TW200623997A - Method for fabricating a multi-layer packaging substrate - Google Patents

Method for fabricating a multi-layer packaging substrate

Info

Publication number
TW200623997A
TW200623997A TW093140360A TW93140360A TW200623997A TW 200623997 A TW200623997 A TW 200623997A TW 093140360 A TW093140360 A TW 093140360A TW 93140360 A TW93140360 A TW 93140360A TW 200623997 A TW200623997 A TW 200623997A
Authority
TW
Taiwan
Prior art keywords
layer
fabricating
conductive
packaging substrate
disposed
Prior art date
Application number
TW093140360A
Other languages
Chinese (zh)
Other versions
TWI268130B (en
Inventor
Shih-Ping Hsu
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW93140360A priority Critical patent/TWI268130B/en
Publication of TW200623997A publication Critical patent/TW200623997A/en
Application granted granted Critical
Publication of TWI268130B publication Critical patent/TWI268130B/en

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A method for fabricating a multi-layer packaging substrate is provided. First, a plurality of connecting pads is disposed on a core circuit board. Next, a first dielectric layer and a second dielectric are formed on the core circuit board, in which a plurality of pattern openings is formed in the second dielectric layer and a plurality of via formations is formed in the first dielectric layer. Next, a seed layer is disposed on the pattern openings and via formations and then a conductive layer is disposed on the seed layer via an electroplating process for forming conductive wires in each pattern opening and conductive via in each via formation. Finally, a separation for the conductive wires in each opening is created by removing the surface of the conductive layer and the seed layer of the second dielectric layer.
TW93140360A 2004-12-23 2004-12-23 Method for fabricating a multi-layer packaging substrate TWI268130B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93140360A TWI268130B (en) 2004-12-23 2004-12-23 Method for fabricating a multi-layer packaging substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93140360A TWI268130B (en) 2004-12-23 2004-12-23 Method for fabricating a multi-layer packaging substrate

Publications (2)

Publication Number Publication Date
TW200623997A true TW200623997A (en) 2006-07-01
TWI268130B TWI268130B (en) 2006-12-01

Family

ID=38220564

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93140360A TWI268130B (en) 2004-12-23 2004-12-23 Method for fabricating a multi-layer packaging substrate

Country Status (1)

Country Link
TW (1) TWI268130B (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412081B (en) * 2008-11-25 2013-10-11 Intel Corp Method of enabling selective area plating on a substrate
TWI425895B (en) * 2008-12-11 2014-02-01 Unimicron Technology Corp Manufacturing process of circuit substrate
CN104247584A (en) * 2012-03-14 2014-12-24 Lg伊诺特有限公司 The printed circuit board and the method for manufacturing the same
TWI581689B (en) * 2014-11-17 2017-05-01 欣興電子股份有限公司 Method for manufacturing circuit board
US10573615B2 (en) 2012-07-31 2020-02-25 Mediatek Inc. Semiconductor package and method for fabricating base for semiconductor package
US10991669B2 (en) 2012-07-31 2021-04-27 Mediatek Inc. Semiconductor package using flip-chip technology

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8238114B2 (en) * 2007-09-20 2012-08-07 Ibiden Co., Ltd. Printed wiring board and method for manufacturing same
TWI398936B (en) * 2009-10-22 2013-06-11 Unimicron Technology Corp Coreless package substrate and fabrication method thereof

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412081B (en) * 2008-11-25 2013-10-11 Intel Corp Method of enabling selective area plating on a substrate
TWI425895B (en) * 2008-12-11 2014-02-01 Unimicron Technology Corp Manufacturing process of circuit substrate
CN104247584A (en) * 2012-03-14 2014-12-24 Lg伊诺特有限公司 The printed circuit board and the method for manufacturing the same
TWI487438B (en) * 2012-03-14 2015-06-01 Lg Innotek Co Ltd The printed circuit board and the method for manufacturing the same
US9642246B2 (en) 2012-03-14 2017-05-02 Lg Innotek Co., Ltd. Printed circuit board and the method for manufacturing the same
CN104247584B (en) * 2012-03-14 2017-06-30 Lg伊诺特有限公司 Printed circuit board and manufacturing methods
US10573615B2 (en) 2012-07-31 2020-02-25 Mediatek Inc. Semiconductor package and method for fabricating base for semiconductor package
US10573616B2 (en) 2012-07-31 2020-02-25 Mediatek Inc. Semiconductor package and method for fabricating base for semiconductor package
US10580747B2 (en) 2012-07-31 2020-03-03 Mediatek Inc. Semiconductor package and method for fabricating base for semiconductor package
US10991669B2 (en) 2012-07-31 2021-04-27 Mediatek Inc. Semiconductor package using flip-chip technology
US11469201B2 (en) 2012-07-31 2022-10-11 Mediatek Inc. Semiconductor package and method for fabricating base for semiconductor package
TWI581689B (en) * 2014-11-17 2017-05-01 欣興電子股份有限公司 Method for manufacturing circuit board

Also Published As

Publication number Publication date
TWI268130B (en) 2006-12-01

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