TW200623997A - Method for fabricating a multi-layer packaging substrate - Google Patents
Method for fabricating a multi-layer packaging substrateInfo
- Publication number
- TW200623997A TW200623997A TW093140360A TW93140360A TW200623997A TW 200623997 A TW200623997 A TW 200623997A TW 093140360 A TW093140360 A TW 093140360A TW 93140360 A TW93140360 A TW 93140360A TW 200623997 A TW200623997 A TW 200623997A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- fabricating
- conductive
- packaging substrate
- disposed
- Prior art date
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A method for fabricating a multi-layer packaging substrate is provided. First, a plurality of connecting pads is disposed on a core circuit board. Next, a first dielectric layer and a second dielectric are formed on the core circuit board, in which a plurality of pattern openings is formed in the second dielectric layer and a plurality of via formations is formed in the first dielectric layer. Next, a seed layer is disposed on the pattern openings and via formations and then a conductive layer is disposed on the seed layer via an electroplating process for forming conductive wires in each pattern opening and conductive via in each via formation. Finally, a separation for the conductive wires in each opening is created by removing the surface of the conductive layer and the seed layer of the second dielectric layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93140360A TWI268130B (en) | 2004-12-23 | 2004-12-23 | Method for fabricating a multi-layer packaging substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93140360A TWI268130B (en) | 2004-12-23 | 2004-12-23 | Method for fabricating a multi-layer packaging substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200623997A true TW200623997A (en) | 2006-07-01 |
TWI268130B TWI268130B (en) | 2006-12-01 |
Family
ID=38220564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93140360A TWI268130B (en) | 2004-12-23 | 2004-12-23 | Method for fabricating a multi-layer packaging substrate |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI268130B (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI412081B (en) * | 2008-11-25 | 2013-10-11 | Intel Corp | Method of enabling selective area plating on a substrate |
TWI425895B (en) * | 2008-12-11 | 2014-02-01 | Unimicron Technology Corp | Manufacturing process of circuit substrate |
CN104247584A (en) * | 2012-03-14 | 2014-12-24 | Lg伊诺特有限公司 | The printed circuit board and the method for manufacturing the same |
TWI581689B (en) * | 2014-11-17 | 2017-05-01 | 欣興電子股份有限公司 | Method for manufacturing circuit board |
US10573615B2 (en) | 2012-07-31 | 2020-02-25 | Mediatek Inc. | Semiconductor package and method for fabricating base for semiconductor package |
US10991669B2 (en) | 2012-07-31 | 2021-04-27 | Mediatek Inc. | Semiconductor package using flip-chip technology |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8238114B2 (en) * | 2007-09-20 | 2012-08-07 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing same |
TWI398936B (en) * | 2009-10-22 | 2013-06-11 | Unimicron Technology Corp | Coreless package substrate and fabrication method thereof |
-
2004
- 2004-12-23 TW TW93140360A patent/TWI268130B/en active
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI412081B (en) * | 2008-11-25 | 2013-10-11 | Intel Corp | Method of enabling selective area plating on a substrate |
TWI425895B (en) * | 2008-12-11 | 2014-02-01 | Unimicron Technology Corp | Manufacturing process of circuit substrate |
CN104247584A (en) * | 2012-03-14 | 2014-12-24 | Lg伊诺特有限公司 | The printed circuit board and the method for manufacturing the same |
TWI487438B (en) * | 2012-03-14 | 2015-06-01 | Lg Innotek Co Ltd | The printed circuit board and the method for manufacturing the same |
US9642246B2 (en) | 2012-03-14 | 2017-05-02 | Lg Innotek Co., Ltd. | Printed circuit board and the method for manufacturing the same |
CN104247584B (en) * | 2012-03-14 | 2017-06-30 | Lg伊诺特有限公司 | Printed circuit board and manufacturing methods |
US10573615B2 (en) | 2012-07-31 | 2020-02-25 | Mediatek Inc. | Semiconductor package and method for fabricating base for semiconductor package |
US10573616B2 (en) | 2012-07-31 | 2020-02-25 | Mediatek Inc. | Semiconductor package and method for fabricating base for semiconductor package |
US10580747B2 (en) | 2012-07-31 | 2020-03-03 | Mediatek Inc. | Semiconductor package and method for fabricating base for semiconductor package |
US10991669B2 (en) | 2012-07-31 | 2021-04-27 | Mediatek Inc. | Semiconductor package using flip-chip technology |
US11469201B2 (en) | 2012-07-31 | 2022-10-11 | Mediatek Inc. | Semiconductor package and method for fabricating base for semiconductor package |
TWI581689B (en) * | 2014-11-17 | 2017-05-01 | 欣興電子股份有限公司 | Method for manufacturing circuit board |
Also Published As
Publication number | Publication date |
---|---|
TWI268130B (en) | 2006-12-01 |
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