JPWO2024122114A5 - - Google Patents
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- Publication number
- JPWO2024122114A5 JPWO2024122114A5 JP2024562576A JP2024562576A JPWO2024122114A5 JP WO2024122114 A5 JPWO2024122114 A5 JP WO2024122114A5 JP 2024562576 A JP2024562576 A JP 2024562576A JP 2024562576 A JP2024562576 A JP 2024562576A JP WO2024122114 A5 JPWO2024122114 A5 JP WO2024122114A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- glass substrate
- component according
- conductor
- plate electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022195680 | 2022-12-07 | ||
| JP2022195680 | 2022-12-07 | ||
| PCT/JP2023/030131 WO2024122114A1 (ja) | 2022-12-07 | 2023-08-22 | 電子部品およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024122114A1 JPWO2024122114A1 (https=) | 2024-06-13 |
| JPWO2024122114A5 true JPWO2024122114A5 (https=) | 2025-05-09 |
| JP7677555B2 JP7677555B2 (ja) | 2025-05-15 |
Family
ID=91379161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024562576A Active JP7677555B2 (ja) | 2022-12-07 | 2023-08-22 | 電子部品およびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250266206A1 (https=) |
| JP (1) | JP7677555B2 (https=) |
| CN (1) | CN120303752A (https=) |
| WO (1) | WO2024122114A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6857329B2 (ja) * | 2016-10-24 | 2021-04-14 | 大日本印刷株式会社 | 高周波部品及びその製造方法 |
| AU2018297035B2 (en) * | 2017-07-07 | 2021-02-25 | 3D Glass Solutions, Inc. | 2D and 3D RF lumped element devices for RF system in a package photoactive glass substrates |
| JP7834430B2 (ja) * | 2020-09-17 | 2026-03-24 | 株式会社村田製作所 | インダクタ部品 |
| WO2023089967A1 (ja) * | 2021-11-18 | 2023-05-25 | 株式会社村田製作所 | インダクタ部品 |
-
2023
- 2023-08-22 WO PCT/JP2023/030131 patent/WO2024122114A1/ja not_active Ceased
- 2023-08-22 JP JP2024562576A patent/JP7677555B2/ja active Active
- 2023-08-22 CN CN202380083549.9A patent/CN120303752A/zh active Pending
-
2025
- 2025-05-06 US US19/199,998 patent/US20250266206A1/en active Pending
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