WO2024122114A1 - 電子部品およびその製造方法 - Google Patents

電子部品およびその製造方法 Download PDF

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Publication number
WO2024122114A1
WO2024122114A1 PCT/JP2023/030131 JP2023030131W WO2024122114A1 WO 2024122114 A1 WO2024122114 A1 WO 2024122114A1 JP 2023030131 W JP2023030131 W JP 2023030131W WO 2024122114 A1 WO2024122114 A1 WO 2024122114A1
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WIPO (PCT)
Prior art keywords
glass substrate
electronic component
conductor
terminal electrode
coil
Prior art date
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Ceased
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PCT/JP2023/030131
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English (en)
French (fr)
Japanese (ja)
Inventor
宏充 伊藤
裕一 飯田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN202380083549.9A priority Critical patent/CN120303752A/zh
Priority to JP2024562576A priority patent/JP7677555B2/ja
Publication of WO2024122114A1 publication Critical patent/WO2024122114A1/ja
Priority to US19/199,998 priority patent/US20250266206A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/10—Metal-oxide dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations

Definitions

  • This disclosure relates to electronic components and methods for manufacturing the same.
  • Patent Document 1 A conventional electronic component is described in JP 2020-174169 A (Patent Document 1).
  • This electronic component has a glass substrate including a bottom surface, a coil provided on the glass substrate, and a terminal electrode provided on the glass substrate and electrically connected to the coil.
  • the bottom conductor of the coil is provided on the bottom surface of the glass substrate, and the terminal electrode is provided on the bottom surface of the glass substrate.
  • the bottom conductor and the terminal electrodes are provided on the same bottom surface of the glass substrate, so the bottom conductor and the terminal electrodes interfere with each other, making it difficult to improve the design freedom of the electronic components.
  • the purpose of this disclosure is to provide electronic components and manufacturing methods thereof that can improve design freedom.
  • an electronic component comprises: a glass substrate including a top surface, a bottom surface, a first side surface, and a second side surface; an outer surface conductor provided on at least the first side surface of the first side surface and the second side surface and which is at least a part of a passive element; a terminal electrode embedded in the glass substrate so as to be exposed from the bottom surface and electrically connected to the outer surface conductor; the terminal electrode penetrates the glass substrate from the first side surface to the second side surface, A height dimension of the glass substrate, which is the distance between the top surface and the bottom surface, is smaller than a width dimension of the glass substrate, which is the distance between the first side surface and the second side surface.
  • the first side surface on which the outer conductor of the passive element is provided and the bottom surface on which the terminal electrode is provided are different surfaces, so the outer conductor and the terminal electrode can be designed without affecting each other, improving the design freedom of the electronic component.
  • the terminal electrode since the terminal electrode penetrates the glass substrate from the first side surface to the second side surface, the terminal electrode extends in the width direction from the first side surface to the second side surface while embedded in the glass substrate. If the terminal electrode were not present and the height dimension was smaller than the width dimension, the glass substrate would be more likely to bend in the height direction from the bottom surface to the top surface, but since the terminal electrode extends in the width direction while embedded in the glass substrate, the bending strength of the glass substrate in the height direction can be improved.
  • a method for producing an electronic component includes the steps of: providing a glass mother substrate including a first side and a second side; providing, on the first surface, two or more singulation regions in a direction parallel to the first side and two or more singulation regions in a direction parallel to the third side, the singulation regions being defined by first and second sides parallel to each other and having lengths smaller than a distance between the first surface and the second surface, and third and fourth sides perpendicular to the first side and parallel to each other; forming a through hole penetrating the mother substrate from the first surface to the second surface in each of all the individual regions, and filling a conductor in the through hole to form a terminal electrode; forming an outer surface conductor, which is at least a part of a passive element, on the first surface in each of all the individual regions; and a step of manufacturing a plurality of electronic components by singulating each of all of the singulation regions.
  • the electronic component and manufacturing method thereof that are one aspect of the present disclosure can improve the design freedom of the electronic component.
  • FIG. 1 is a side view showing a first embodiment of an electronic component as viewed from a first side surface side.
  • FIG. This is a cross-sectional view of FIG. 1A to 1C are explanatory diagrams illustrating a manufacturing method of an electronic component.
  • 1A to 1C are explanatory diagrams illustrating a manufacturing method of an electronic component.
  • 1A to 1C are explanatory diagrams illustrating a manufacturing method of an electronic component.
  • 1A to 1C are explanatory diagrams illustrating a manufacturing method of an electronic component.
  • FIG. 11 is a side view showing a second embodiment of the electronic component as viewed from a first side surface side.
  • FIG. 11 is a side view showing a second embodiment of the electronic component as viewed from a first side surface side.
  • FIG. 11 is a side view showing a third embodiment of an electronic component as viewed from a first side surface side. 6 is a cross-sectional view taken along line VI-VI of FIG. 5.
  • FIG. 11 is a side view showing a fourth embodiment of the electronic component as viewed from a first side surface side.
  • FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG. 7.
  • FIG. 13 is a side view showing a fifth embodiment of the electronic component as viewed from a first side surface side.
  • FIG. 13 is a side view showing a sixth embodiment of the electronic component as viewed from a first side surface side.
  • FIG. 13 is a side view showing a seventh embodiment of the electronic component as viewed from a first side surface side.
  • FIG. 13 is a side view showing an eighth embodiment of the electronic component as viewed from a first side surface side.
  • FIG. 13 is a side view showing a ninth embodiment of the electronic component as viewed from a first side surface side.
  • FIG. 23 is a side view showing a tenth embodiment of the electronic component as viewed from a first side surface side.
  • FIG. 23 is a side view showing an eleventh embodiment of the electronic component as viewed from a first side surface side. This is a cross-sectional view taken along the line XVI-XVI of Figure 15.
  • FIG. 23 is a side view showing a twelfth embodiment of the electronic component as viewed from the first side surface side.
  • FIG. 23 is a side view showing a thirteenth embodiment of the electronic component as viewed from the first side surface side.
  • FIG. 23 is a side view showing a fourteenth embodiment of the electronic component as viewed from the first side surface side. This is a cross-sectional view taken along the line XX-XX of
  • Fig. 1 is a side view of electronic component 1 as viewed from a first side surface.
  • Fig. 2 is a cross-sectional view taken along line II-II of Fig. 1.
  • electronic component 1 has a glass substrate 10, an inductor element 2, a first terminal electrode 41, and a second terminal electrode 42.
  • Inductor element 2 corresponds to an example of a "passive element" as defined in the claims.
  • Electronic component 1 is a surface-mount electronic component used, for example, in a high-frequency signal transmission circuit.
  • the glass substrate 10 has a top surface 10t and a bottom surface 10b located on opposite sides, and a first side surface 10s1 and a second side surface 10s2 located on opposite sides.
  • the inductor element 2 has a first coil conductor 21 provided on the first side surface 10s1 and a second coil conductor 22 provided on the second side surface 10s2.
  • the first coil conductor 21 and the second coil conductor 22 are examples of the "external conductor" described in the claims.
  • the first terminal electrode 41 and the second terminal electrode 42 are embedded in the glass substrate 10 so as to be exposed from the bottom surface 10b, and are electrically connected to the first coil conductor 21 and the second coil conductor 22, respectively.
  • the first terminal electrode 41 and the second terminal electrode 42 each penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2.
  • the height dimension H of the glass substrate 10, which is the distance between the top surface 10t and the bottom surface 10b, is smaller than the width dimension W of the glass substrate 10, which is the distance between the first side surface 10s1 and the second side surface 10s2.
  • the relationship "height dimension H is smaller than width dimension W” refers to a relationship that satisfies at least one of the following: "the maximum distance (height dimension H) between the top surface 10t and the bottom surface 10b is smaller than the minimum distance (width dimension W) between the first side surface 10s1 and the second side surface 10s2" or "the average distance (height dimension H) between the top surface 10t and the bottom surface 10b is smaller than the average distance (width dimension W) between the first side surface 10s1 and the second side surface 10s2.”
  • the first side surface 10s1 on which the first coil conductor 21 is provided and the second side surface 10s2 on which the second coil conductor 22 is provided are different surfaces from the bottom surface 10b on which the first terminal electrode 41 and the second terminal electrode 42 are provided. This allows the first coil conductor 21 and the second coil conductor 22 and the first terminal electrode 41 and the second terminal electrode 42 to be designed without being affected by each other, improving the design freedom of the electronic component 1.
  • the first terminal electrode 41 and the second terminal electrode 42 each penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2, so that the first terminal electrode 41 and the second terminal electrode 42 each extend in the width direction (Y direction) from the first side surface 10s1 to the second side surface 10s2 while embedded in the glass substrate 10. If the first terminal electrode 41 and the second terminal electrode 42 do not exist, and the height dimension H is smaller than the width dimension W, the glass substrate 10 is likely to bend in the height direction (Z direction) from the bottom surface 10b to the top surface 10t, but since the first terminal electrode 41 and the second terminal electrode 42 extend in the width direction while embedded in the glass substrate 10, the bending strength of the glass substrate 10 in the height direction can be improved.
  • the height dimension H is smaller than the width dimension W, the height dimension H of the glass substrate 10 can be reduced, thereby enabling the electronic component 1 to have a low profile.
  • the passive element may be a capacitor element or a resistor instead of an inductor element.
  • An outer conductor, which is at least a part of the passive element, may be provided on at least the first side surface of the first and second side surfaces.
  • At least one terminal electrode may be provided.
  • the glass substrate 10 is a rectangular parallelepiped having a length, a width, and a height.
  • the glass substrate 10 has a first end face 10e1 and a second end face 10e2 at both ends in the length direction, a first side face 10s1 and a second side face 10s2 at both ends in the width direction, and a bottom face 10b and a top face 10t at both ends in the height direction.
  • the outer surface 100 of the glass substrate 10 includes the first end face 10e1 and the second end face 10e2, the first side face 10s1 and the second side face 10s2, the bottom face 10b, and the top face 10t.
  • the bottom face 10b is a face that faces the mounting board when the electronic component 1 is mounted on the mounting board.
  • the outer surface 100 of the glass substrate 10 does not simply mean the surface facing the outer periphery of the glass substrate 10, but the surface that is the boundary between the outside and the inside of the glass substrate 10. Furthermore, “above the outer surface 100 of the glass substrate 10" does not mean an absolute direction such as vertically upward as determined by the direction of gravity, but refers to the direction toward the outside of the outside and the inside with the outer surface 100 as the boundary, based on the outer surface 100. Therefore, “above the outer surface 100” is a relative direction determined by the orientation of the outer surface 100. Furthermore, "above” with respect to a certain element includes not only an upper position away from the element, that is, an upper position via another object on the element or an upper position with a space therebetween, but also a position directly above the element (on).
  • the lengthwise direction (longitudinal direction) of the glass substrate 10, which is the direction from the first end face 10e1 to the second end face 10e2, is referred to as the X direction.
  • the widthwise direction of the glass substrate 10, which is the direction from the first side face 10s1 to the second side face 10s2, is referred to as the Y direction.
  • the heightwise direction of the glass substrate 10, which is the direction from the bottom face 10b to the top face 10t is referred to as the Z direction.
  • the X direction, Y direction, and Z direction are mutually perpendicular, and when arranged in the order of X, Y, Z, they form a right-handed system.
  • the glass substrate 10 has insulating properties.
  • the glass substrate 10 is preferably a photosensitive glass substrate such as Foturan II (registered trademark of Schott AG).
  • the glass substrate 10 preferably contains cerium oxide (ceria: CeO2), in which case the cerium oxide acts as a sensitizer, making processing by photolithography easier.
  • the glass substrate 10 can be processed by mechanical processing such as drilling and sandblasting, dry/wet etching using a photoresist/metal mask, laser processing, etc., it may be a glass plate that does not have photosensitivity.
  • the glass substrate 10 may be made by sintering a glass paste, or may be formed by a known method such as the float method.
  • the height dimension H of the glass substrate 10 is smaller than the width dimension W of the glass substrate 10.
  • the relationship "length dimension L is smaller than width dimension W” refers to a relationship that satisfies at least one of the following: "the maximum distance (length dimension L) between the first end face 10e1 and the second end face 10e2 is smaller than the minimum distance (width dimension W) between the first side face 10s1 and the second side face 10s2" or "the average distance (length dimension L) between the first end face 10e1 and the second end face 10e2 is smaller than the average distance (width dimension W) between the first side face 10s1 and the second side face 10s2.”
  • the inductor element 2 has a coil 20, a first lead conductor 25 connected to a first end of the coil 20, and a second lead conductor 26 connected to a second end of the coil 20.
  • the coil 20 is wound in a spiral shape along an axis AX.
  • the first lead conductor 25 is connected to a first terminal electrode 41.
  • the second lead conductor 26 is connected to a second terminal electrode 42.
  • the axis AX of the coil 20 is arranged parallel to the bottom surface 10b of the glass substrate 10. With this, when the electronic component 1 is mounted on the mounting substrate so that the bottom surface 10b of the glass substrate 10 faces the mounting substrate, the axis AX of the coil 20 is horizontal to the mounting substrate, so that a decrease in the L value or Q value due to eddy currents flowing in the mounting substrate is unlikely to occur. "Parallel” does not only mean that the axis AX is completely parallel to the bottom surface 10b, but also includes the axis AX being substantially parallel, such as being slightly tilted relative to the bottom surface 10b.
  • the coil 20 includes a plurality of first coil conductors 21, a plurality of second coil conductors 22, a plurality of first through conductors 23, and a plurality of second through conductors 24.
  • the coil 20 is electrically connected in the order of the first through conductors 23, the second coil conductor 22, the second through conductor 24, and the first coil conductor 21 to form a spiral.
  • the number of turns of the coil 20 is multiple turns. Note that the number of turns of the coil 20 may be less than one turn.
  • the multiple first penetrating conductors 23 penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. Therefore, the multiple first penetrating conductors 23 extend in the width direction (Y direction) while embedded in the glass substrate 10. This further improves the bending strength of the glass substrate 10 in the height direction (Z direction).
  • the multiple first penetrating conductors 23 extend from the second coil conductor 22 toward the first coil conductor 21 and are arranged along the axis AX.
  • the first penetrating conductors 23 extend in a direction perpendicular to the first side surface 10s1 and the second side surface 10s2. All the first penetrating conductors 23 are arranged in parallel along the X direction.
  • the first penetrating conductors 23 are arranged on the bottom surface 10b side with respect to the axis AX.
  • the second penetrating conductors 24 penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. Therefore, the second penetrating conductors 24 extend in the width direction (Y direction) while embedded in the glass substrate 10. This further improves the bending strength of the glass substrate 10 in the height direction (Z direction).
  • the multiple second penetrating conductors 24 extend from the second coil conductor 22 toward the first coil conductor 21 and are arranged along the axis AX.
  • the second penetrating conductors 24 extend in a direction perpendicular to the first side surface 10s1 and the second side surface 10s2. All the second penetrating conductors 24 are arranged parallel to each other along the X direction.
  • the second penetrating conductors 24 are provided on the opposite side of the axis AX to the first penetrating conductors 23. In other words, the second penetrating conductors 24 are arranged on the top surface 10t side with respect to the axis AX.
  • first coil conductors 21 are provided on the first side surface 10s1.
  • the first coil conductors 21 are shaped to extend in the Z direction. All of the first coil conductors 21 are arranged in parallel along the X direction.
  • the first end (pad portion) of the first coil conductor 21 is connected to the end of the first penetrating conductor 23.
  • the second end (pad portion) of the first coil conductor 21 is connected to the end of the second penetrating conductor 24.
  • the second coil conductors 22 are provided on the second side surface 10s2.
  • the second coil conductors 22 extend in the Z direction at a slight incline toward the X direction. All the second coil conductors 22 are arranged parallel to each other along the X direction.
  • the first end (pad portion) of the second coil conductor 22 is connected to the end of the first penetrating conductor 23.
  • the second end (pad portion) of the second coil conductor 22 is connected to the end of the second penetrating conductor 24.
  • the first extraction conductor 25 is provided on the first side surface 10s1.
  • the first extraction conductor 25 has a shape that extends in the Z direction.
  • the first end (pad portion) of the first extraction conductor 25 is connected to the end of the first penetrating conductor 23.
  • the second end of the first extraction conductor 25 is connected to the side surface of the first terminal electrode 41.
  • the second extraction conductor 26 is provided on the first side surface 10s1.
  • the second extraction conductor 26 has a shape that extends in the Z direction.
  • a first end (pad portion) of the second extraction conductor 26 is connected to an end of the second penetrating conductor 24.
  • a second end of the second extraction conductor 26 is connected to the side surface of the second terminal electrode 42.
  • the first coil conductor 21 and the second coil conductor 22 are made of a conductive material such as copper, silver, gold, or an alloy of these.
  • the first coil conductor 21 and the second coil conductor 22 may be a metal film formed by plating, vapor deposition, sputtering, or the like, or may be a metal sintered body formed by applying and sintering a conductive paste.
  • the material of the first through conductor 23 and the second through conductor 24 is the same as the material of the first coil conductor 21 and the second coil conductor 22.
  • the first coil conductor 21 and the second coil conductor 22 are preferably formed by a semi-additive method, which allows the first coil conductor 21 and the second coil conductor 22 to be formed with low electrical resistance, high precision, and high aspect ratio.
  • the first through conductor 23 and the second through conductor 24 can be formed in through holes pre-formed in the glass substrate 10 using the materials and manufacturing methods exemplified for the first coil conductor 21 and the second coil conductor 22.
  • the first and second lead-out conductors 25 and 26 can be formed using the same materials and methods as the first coil conductor.
  • the first terminal electrode 41 is embedded in the glass substrate 10 so as to be exposed from the bottom surface 10b, the first side surface 10s1, and the second side surface 10s2.
  • the first terminal electrode 41 is provided on the first end surface 10e1 side with respect to the center of the glass substrate 10 in the X direction.
  • the second terminal electrode 42 is embedded in the glass substrate 10 so as to be exposed from the bottom surface 10b, the first side surface 10s1, and the second side surface 10s2.
  • the second terminal electrode 42 is provided on the second end surface 10e2 side with respect to the center of the glass substrate 10 in the X direction.
  • the first terminal electrode 41 and the second terminal electrode 42 can be formed using the same material and method as the first coil conductor.
  • the first terminal electrode 41 and the second terminal electrode 42 may have a plating layer.
  • the first terminal electrode 41 is connected to the first lead conductor 25, which is the first end of the inductor element 2.
  • the second terminal electrode 42 is connected to the second lead conductor 26, which is the second end of the inductor element 2.
  • a glass mother substrate 1000 including a first surface 1000a and a second surface 1000b is prepared.
  • the first surface 1000a includes a first side surface 10s1
  • the second surface 1000b includes a second side surface 10s2.
  • Foturan II can be used as the mother substrate 1000.
  • the mother substrate 1000 generally includes oxides of silicon, lithium, aluminum, cerium, etc., making it compatible with high-precision photolithography.
  • a plurality of singulation regions 1100 are provided on the first surface 1000a.
  • the singulation regions 1100 are shown hatched.
  • the singulation regions 1100 are defined by a first side 1101, a second side 1102, a third side 1103, and a fourth side 1104.
  • the first side 1101 and the second side 1102 are parallel to each other, and the third side 1103 and the fourth side 1104 are parallel to each other.
  • the third side 1103 and the fourth side 1104 are perpendicular to the first side 1101. In other words, the singulation regions 1100 are rectangular.
  • the first side 1101 and the second side 1102 each have a length that is smaller than the distance between the first surface 1000a and the second surface 1000b.
  • the distance between the first surface 1000a and the second surface 1000b corresponds to the dimension W of the glass substrate 10.
  • the respective lengths of the first side 1101 and the second side 1102 correspond to the height dimension H of the glass substrate 10.
  • the respective lengths of the third side 1103 and the fourth side 1104 correspond to the length dimension L of the glass substrate 10.
  • Two or more singulation regions 1100 are provided in a direction parallel to the first side 1101 (Z direction) and two or more are provided in a direction parallel to the third side 1103 (X direction). In this embodiment, a total of four singulation regions 1100 are provided, two in the Z direction and two in the X direction.
  • a first through hole 1001, a second through hole 1002, a third through hole 1003, and a fourth through hole 1004 are formed penetrating the mother substrate 1000 from the first surface 1000a to the second surface 1000b.
  • the singulation regions 1100 are indicated by two-dot chain lines.
  • the first through hole 1001 is where the first through conductor 23 is formed.
  • the second through hole 1002 is where the second through conductor 24 is formed.
  • the third through hole 1003 is where the first terminal electrode 41 is formed.
  • the fourth through hole 1004 is where the second terminal electrode 42 is formed.
  • the first to fourth through holes 1001 to 1004 can be formed, for example, by irradiating the area where the through hole is to be formed with ultraviolet light, crystallizing it by heat treatment (e.g., baking), forming a crystallized portion, and then removing the crystallized portion by etching to form the through hole.
  • heat treatment e.g., baking
  • a conductor is filled in the first through hole 1001 to form the first through conductor 23.
  • a conductor is filled in the second through hole 1002 to form the second through conductor 24.
  • a conductor is filled in the third through hole 1003 to form the first terminal electrode 41.
  • a conductor is filled in the fourth through hole 1004 to form the second terminal electrode 42.
  • the first through conductor 23, the second through conductor 24, the first terminal electrode 41 and the second terminal electrode 42 are formed, for example, by a semi-additive method.
  • the first coil conductor 21, the first lead conductor 25, and the second lead conductor 26 are formed on the first surface 1000a, and the second coil conductor 22 is formed on the second surface 1000b.
  • the cutting region 1200 between adjacent individualization regions 1100 is irradiated with ultraviolet light and crystallized by heat treatment (e.g., baking) to form a crystallized portion.
  • the cutting region 1200 coincides with the cut line when dividing and individualizing the mother substrate 1000.
  • the crystallized portion of the cutting region 1200 is shown hatched in FIG. 3D.
  • the crystallized portion of the cutting region 1200 is removed by etching, and each of the singulation regions 1100 is singulated as shown in FIG. 3E to manufacture a plurality of electronic components 1.
  • the mother substrate 1000 may also be singulated by a dicer, laser, or the like.
  • the above manufacturing method singulates the mother substrate 1000 having two singulation regions 1100 in the Z direction and two in the X direction, so that the mother substrate 1000 is less likely to crack.
  • the height dimension H is smaller than the width dimension W in each singulation region, so that when the mother substrate is cut in the Z direction, it is cut along the direction in which the height dimension H is smaller. In this way, because the mother substrate is cut along the direction in which its strength is weak, the glass substrate is more likely to crack.
  • Second Embodiment 4 is a side view of the electronic component according to the second embodiment, as viewed from the first side.
  • the second embodiment differs from the first embodiment in the position of the coil of the inductor element. This difference in configuration will be described below.
  • the other configurations are the same as those of the first embodiment, and the same reference numerals as those of the first embodiment are used, and the description thereof will be omitted.
  • the axis AX of the coil 20A of the inductor element 2A is perpendicular to the bottom surface 10b of the glass substrate 10.
  • Perpendicular does not only mean that the axis AX is completely perpendicular to the bottom surface 10b, but also includes being substantially perpendicular, such as when the angle between the axis AX and the bottom surface 10b is 80° to 100°.
  • the multiple first penetrating conductors 23 penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. All the first penetrating conductors 23 are arranged in parallel along the Z direction. The first penetrating conductors 23 are arranged on the first end surface 10e1 side with respect to the axis AX.
  • the multiple second penetrating conductors 24 penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. All the second penetrating conductors 24 are arranged parallel to each other along the Z direction. The second penetrating conductors 24 are provided on the opposite side of the axis AX to the first penetrating conductors 23. In other words, the second penetrating conductors 24 are arranged on the second end surface 10e2 side of the axis AX.
  • first coil conductors 21 are provided on the first side surface 10s1.
  • the first coil conductors 21 extend in the X direction at a slight incline toward the Z direction. All of the first coil conductors 21 are arranged in parallel along the Z direction.
  • a number of second coil conductors 22 are provided on the second side surface 10s2.
  • the second coil conductors 22 extend in the X direction. All of the second coil conductors 22 are arranged in parallel along the Z direction.
  • the electronic component 1A of the second embodiment has the same effect as the electronic component 1 of the first embodiment. That is, the first side surface 10s1 on which the first coil conductor 21 is provided and the second side surface 10s2 on which the second coil conductor 22 is provided are different surfaces from the bottom surface 10b on which the first terminal electrode 41 and the second terminal electrode 42 are provided, so that the first coil conductor 21 and the second coil conductor 22 and the first terminal electrode 41 and the second terminal electrode 42 can be designed without being influenced by each other, improving the design freedom of the electronic component 1A.
  • first terminal electrode 41 and the second terminal electrode 42 each penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2, so that the first terminal electrode 41 and the second terminal electrode 42 each extend in the width direction (Y direction) from the first side surface 10s1 to the second side surface 10s2 while embedded in the glass substrate 10. This improves the bending strength of the glass substrate 10 in the height direction (Z direction).
  • the height dimension H is smaller than the width dimension W, the height dimension H of the glass substrate 10 can be reduced, thereby enabling the electronic component 1A to have a low profile.
  • the multiple first through conductors 23 extend in the width direction (Y direction) while embedded in the glass substrate 10. This further improves the bending strength of the glass substrate 10 in the height direction (Z direction).
  • the multiple second through conductors 24 extend in the width direction (Y direction) while embedded in the glass substrate 10. This further improves the bending strength of the glass substrate 10 in the height direction (Z direction).
  • Fig. 5 is a side view showing a third embodiment of the electronic component as seen from the first side surface.
  • Fig. 6 is a cross-sectional view taken along line VI-VI in Fig. 5.
  • the third embodiment differs from the first embodiment in the configuration of the passive elements. This different configuration will be described below.
  • the other configurations are the same as those of the first embodiment, and the same reference numerals as those of the first embodiment will be used and the description thereof will be omitted.
  • the passive element is a capacitor element 3.
  • the capacitor element 3 has a first plate electrode 31, a second plate electrode 32, a dielectric film 33, a first lead conductor 35, and a second lead conductor 36.
  • the first plate electrode 31, the second plate electrode 32, the first lead conductor 35, and the second lead conductor 36 correspond to an example of an "external conductor" as defined in the claims.
  • the first plate electrode 31 is provided on the first side surface 10s1, and the second plate electrode 32 is provided on the first plate electrode 31.
  • the dielectric film 33 is provided between the first plate electrode 31 and the second plate electrode 32.
  • the first plate electrode 31 and the second plate electrode 32 each extend along the X direction.
  • the dielectric film 33 extends along the X direction and covers both ends of the first plate electrode 31 in the Z direction.
  • the first extraction conductor 35 is provided on the first side surface 10s1.
  • the first extraction conductor 35 has a shape that extends in the Z direction.
  • a first end of the first extraction conductor 35 is connected to the second flat plate electrode 32.
  • a second end of the first extraction conductor 35 is connected to the side surface of the first terminal electrode 41.
  • the second extraction conductor 36 is provided on the first side surface 10s1.
  • the second extraction conductor 36 has a shape that extends in the Z direction.
  • a first end of the second extraction conductor 36 is connected to the first flat plate electrode 31.
  • a second end of the second extraction conductor 36 is connected to the side surface of the second terminal electrode 42.
  • stray capacitance between the mounting board and the ground is less likely to occur compared to when the capacitor element 3 is provided on the bottom surface 10b. Also, compared to when the capacitor element 3 is provided on the top surface 10t, the parasitic inductance can be reduced.
  • the electronic component 1B of the second embodiment has the same effect as the electronic component 1 of the first embodiment.
  • the first side surface 10s1 on which the first plate electrode 31 and the second plate electrode 32 are provided is a surface different from the bottom surface 10b on which the first terminal electrode 41 and the second terminal electrode 42 are provided, so that the first plate electrode 31 and the second plate electrode 32 and the first terminal electrode 41 and the second terminal electrode 42 can be designed without being influenced by each other, improving the design freedom of the electronic component 1B.
  • first terminal electrode 41 and the second terminal electrode 42 each penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2, so that the first terminal electrode 41 and the second terminal electrode 42 each extend in the width direction (Y direction) from the first side surface 10s1 to the second side surface 10s2 while embedded in the glass substrate 10. This improves the bending strength of the glass substrate 10 in the height direction (Z direction).
  • the height dimension H is smaller than the width dimension W, the height dimension H of the glass substrate 10 can be reduced, thereby enabling the electronic component 1B to have a low profile.
  • Fig. 7 is a side view showing a fourth embodiment of the electronic component as seen from the first side surface side.
  • Fig. 8 is a cross-sectional view taken along line VIII-VIII in Fig. 7.
  • the fourth embodiment differs from the third embodiment in the configuration of the capacitor element. This different configuration will be described below.
  • the other configurations are the same as those of the third embodiment, and the same reference numerals as those of the third embodiment will be used and the description thereof will be omitted.
  • the capacitor element 3C has a plurality of first plate electrodes 31C, a plurality of second plate electrodes 32C, a first supporting conductor 37, and a second supporting conductor 38.
  • the first plate electrode 31C, the second plate electrode 32C, the first supporting conductor 37, and the second supporting conductor 38 correspond to an example of an "external conductor" as described in the claims.
  • the multiple first plate electrodes 31C penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. Therefore, the multiple first plate electrodes 31C extend in the width direction (Y direction) while embedded in the glass substrate 10.
  • the first plate electrodes 31C extend in a direction parallel to the YZ plane. All of the first plate electrodes 31C are arranged parallel to the X direction.
  • the second plate electrodes 32C penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. Therefore, the second plate electrodes 32C extend in the width direction (Y direction) while embedded in the glass substrate 10.
  • the second plate electrodes 32C extend in a direction parallel to the YZ plane. All the second plate electrodes 32C are arranged parallel to the X direction.
  • the first support conductor 37 penetrates the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. Therefore, the first support conductor 37 extends in the width direction (Y direction) while embedded in the glass substrate 10.
  • the first support conductor 37 has a first portion 371 extending in a direction parallel to the XY plane, and a second portion 372 connected to the first portion 371 and extending in a direction parallel to the YZ plane.
  • the first portion 371 is disposed on the top surface 10t side
  • the second portion 372 is disposed on the second end surface 10e2 side.
  • a plurality of first plate electrodes 31C are connected to the first portion 371.
  • the second portion 372 is connected to the second terminal electrode 42.
  • the second support conductor 38 penetrates the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2. Therefore, the second support conductor 38 extends in the width direction (Y direction) while embedded in the glass substrate 10.
  • the second support conductor 38 has a first portion 381 extending in a direction parallel to the XY plane, and a second portion 382 connected to the first portion 381 and extending in a direction parallel to the YZ plane.
  • the first portion 381 is disposed on the bottom surface 10b side, and the second portion 382 is disposed on the first end surface 10e1 side.
  • a plurality of first plate electrodes 31C are connected to the first portion 381.
  • the second portion 382 is connected to the first terminal electrode 41.
  • the multiple first plate electrodes 31C and the multiple second plate electrodes 32C are arranged alternately along the X direction. In other words, the multiple first plate electrodes 31C and the multiple second plate electrodes 32C form a comb-tooth structure.
  • a part of the glass substrate 10 is present between the first plate electrodes 31C and the second plate electrodes 32C. In other words, the part of the glass substrate 10 functions as a dielectric for the capacitor element 3C.
  • the electronic component 1C of the fourth embodiment has the same effect as the electronic component 1B of the third embodiment.
  • the first side surface 10s1 and the second side surface 10s2 on which the first plate electrode 31C and the second plate electrode 32C are provided are different surfaces from the bottom surface 10b on which the first terminal electrode 41 and the second terminal electrode 42 are provided, so that the first plate electrode 31C and the second plate electrode 32C and the first terminal electrode 41 and the second terminal electrode 42 can be designed without being influenced by each other, improving the design freedom of the electronic component 1C.
  • first terminal electrode 41 and the second terminal electrode 42 each penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2, so that the first terminal electrode 41 and the second terminal electrode 42 each extend in the width direction (Y direction) from the first side surface 10s1 to the second side surface 10s2 while embedded in the glass substrate 10. This improves the bending strength of the glass substrate 10 in the height direction (Z direction).
  • the height dimension H is smaller than the width dimension W, the height dimension H of the glass substrate 10 can be reduced, thereby enabling the electronic component 1C to have a low profile.
  • first flat plate electrodes 31C extend in the width direction (Y direction) while embedded in the glass substrate 10. This further improves the bending strength of the glass substrate 10 in the height direction (Z direction).
  • the second flat plate electrodes 32C extend in the width direction (Y direction) while embedded in the glass substrate 10. This further improves the bending strength of the glass substrate 10 in the height direction (Z direction).
  • Fifth Embodiment 9 is a side view of the fifth embodiment of the electronic component as viewed from the first side.
  • the fifth embodiment differs from the fourth embodiment in the configuration of the dielectric. This different configuration will be described below.
  • the other configurations are the same as those of the fourth embodiment, and the same reference numerals as those of the fourth embodiment are used and the description thereof will be omitted.
  • the capacitor element 3C has a dielectric 34 between the first plate electrode and the second plate electrode.
  • the dielectric 34 is made of a material different from the glass material of the glass substrate 10.
  • the glass material is a material in an amorphous state that has not been crystallized.
  • the dielectric 34 is made of, for example, crystallized glass, air, or a high dielectric material other than glass.
  • a large capacitance is obtained by using a material for the dielectric 34 that has a higher dielectric constant than the glass substrate 10.
  • a high Q value is obtained by using a material for the dielectric 34 that has a smaller dielectric loss than the glass substrate.
  • electronic component 1D of the fifth embodiment has the same effects as electronic component 1C of the fourth embodiment.
  • Sixth Embodiment 10 is a side view of a sixth embodiment of an electronic component as viewed from the first side.
  • the sixth embodiment differs from the first embodiment in the configuration of the passive elements. This different configuration will be described below.
  • the other configurations are the same as those of the first embodiment, and the same reference numerals as those of the first embodiment are used, and the description thereof will be omitted.
  • the passive elements include an inductor element 2 and a capacitor element 3.
  • the inductor element 2 has a similar configuration to the inductor element 2 of the electronic component 1 of the first embodiment.
  • the capacitor element 3 has a similar configuration to the capacitor element 3 of the electronic component 1B of the third embodiment.
  • the inductor element 2 is disposed on the second end face 10e2 side (second terminal electrode 42 side), and the capacitor element 3 is disposed on the first end face 10e1 side (first terminal electrode 41 side).
  • the inductor element 2 and the capacitor element 3 are electrically connected in series.
  • the inductor element 2 has a coil 20 and a second lead-out conductor 26.
  • the coil 20 includes a first coil conductor 21, a second coil conductor 22, a first through conductor 23, and a second through conductor 24.
  • the first coil conductor 21 is provided on the first side surface 10s1.
  • the second coil conductor 22 is provided on the second side surface 10s2.
  • the first through conductor 23 and the second through conductor 24 penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2.
  • the second lead-out conductor 26 is connected to the second terminal electrode 42.
  • the capacitor element 3 has a first plate electrode 31, a second plate electrode 32, a dielectric film 33, a first lead conductor 35, and a second lead conductor 36.
  • the first plate electrode 31, the second plate electrode 32, the first lead conductor 35, and the second lead conductor 36 are provided above the first side surface 10s1.
  • the first lead conductor 35 is connected to the first terminal electrode 41.
  • the second lead conductor 36 is connected to the first through conductor 23, which is the first end of the coil 20.
  • the electronic component 1E of the sixth embodiment includes an inductor element 2 and a capacitor element 3, and therefore can realize an LC circuit. Note that there may be multiple inductor elements 2 and multiple capacitor elements 3.
  • the electronic component 1E of the sixth embodiment has the same effects as the electronic component 1 of the first embodiment and the electronic component 1B of the third embodiment.
  • Seventh Embodiment 11 is a side view showing a seventh embodiment of an electronic component as viewed from a first side surface.
  • the seventh embodiment differs from the sixth embodiment in the configuration of the glass substrate. This different configuration will be described below.
  • the other configurations are the same as those of the sixth embodiment, and the same reference numerals as those of the sixth embodiment are used and the description thereof will be omitted.
  • the glass substrate 10F has a first portion 101 and a second portion 102.
  • the height dimension H2 of the second portion 102 is smaller than the height dimension H1 of the first portion 101.
  • the height dimension H1 of the first portion 101 and the height dimension H2 of the second portion 102 are smaller than the width dimension W of the glass substrate 10F.
  • a capacitor element 3 is provided in the first portion 101, and an inductor element 2 is provided in the second portion 102.
  • the space provided in the height difference between the first portion 101 and the second portion 102 can be effectively utilized.
  • the glass substrate 10F may be provided with three or more portions with different height dimensions, providing multiple steps in the glass substrate 10F.
  • the electronic component 1F of the seventh embodiment has the same effects as the electronic component 1E of the sixth embodiment.
  • Eighth Embodiment 12 is a side view showing an eighth embodiment of an electronic component as viewed from a first side surface.
  • the eighth embodiment differs from the sixth embodiment in the configuration of the glass substrate. This different configuration will be described below.
  • the other configurations are the same as those of the sixth embodiment, and the same reference numerals as those of the sixth embodiment are used and the description thereof will be omitted.
  • the length dimension L of the glass substrate 10G is at least twice the width dimension W of the glass substrate 10G.
  • the axial length of the coil 20 is at least twice the axial length of the coil 20 of the sixth embodiment.
  • the length dimension L of the glass substrate 10G can be increased, so the inductor element 2 and the capacitor element 3 can be made larger, improving performance.
  • the length dimension L can be increased to achieve larger size, there is no need to increase the width dimension of the glass substrate 10G. This means that there is no need to increase the length of the terminal electrodes 41, 42 in the width direction, making manufacturing easier, and there is no need to increase the length of the through conductors 23, 24 in the width direction, so the diameter of the through conductors 23, 24 can be reduced.
  • electronic component 1G of the eighth embodiment has the same effects as electronic component 1E of the sixth embodiment.
  • Ninth embodiment 13 is a side view of a ninth embodiment of an electronic component as viewed from a first side surface.
  • the ninth embodiment differs from the sixth embodiment in the number of terminal electrodes. This difference in configuration will be described below.
  • the other configurations are the same as those of the sixth embodiment, and the same reference numerals as those of the sixth embodiment are used, and the description thereof will be omitted.
  • the electronic component 1H of the ninth embodiment further includes a third terminal electrode 43.
  • the third terminal electrode 43 is embedded in the glass substrate 10 so as to be exposed from the bottom surface 10b.
  • the third terminal electrode 43 penetrates the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2.
  • the third terminal electrode 43 is located between the first terminal electrode 41 and the second terminal electrode 42 along the X direction.
  • the third terminal electrode 43 is connected between the inductor element 2 and the capacitor element 3. Specifically, the third terminal electrode 43 is connected to the second lead conductor 36.
  • more terminal electrodes 41, 42, and 43 can be provided, and a more complex circuit can be realized.
  • the third terminal electrode 43 extends in the width direction (Y direction) while embedded in the glass substrate 10, so that the bending strength of the glass substrate 10 in the height direction (Z direction) can be further improved. Note that there may be four or more terminal electrodes.
  • electronic component 1H of the ninth embodiment has the same effects as electronic component 1E of the sixth embodiment.
  • Tenth Embodiment 14 is a side view of a tenth embodiment of an electronic component as viewed from a first side surface.
  • the tenth embodiment differs from the first embodiment in the configuration of the terminal electrodes. This different configuration will be described below.
  • the other configurations are the same as those of the first embodiment, and the same reference numerals as those of the first embodiment will be used and the description thereof will be omitted.
  • the first terminal electrode 41J is further exposed from the first end face 10e1.
  • the first terminal electrode 41J has a first portion 411 and a second portion 412 connected to the first portion 411.
  • the first portion 411 extends along the bottom face 10b, and the second portion 412 extends along the first end face 10e1.
  • the first terminal electrode 41J is an L-shaped electrode.
  • the first portion 411 is exposed from the bottom face 10b, and the second portion 412 is exposed from the first end face 10e1.
  • the first portion 411 and the second portion 412 each penetrate the glass substrate 10 from the first side face 10s1 to the second side face 10s2.
  • the second terminal electrode 42J is further exposed from the second end face 10e2.
  • the second terminal electrode 42J has a first portion 421 and a second portion 422 connected to the first portion 421.
  • the first portion 421 extends along the bottom face 10b, and the second portion 422 extends along the second end face 10e2.
  • the second terminal electrode 42J is an L-shaped electrode.
  • the first portion 421 is exposed from the bottom face 10b, and the second portion 422 is exposed from the second end face 10e2.
  • the first portion 421 and the second portion 422 each penetrate the glass substrate 10 from the first side face 10s1 to the second side face 10s2.
  • solder when the electronic component 1J is mounted on a mounting board so that the bottom surface 10b of the glass substrate 10 faces the mounting board, solder also adheres to the portion of the first terminal electrode 41J exposed from the first end surface 10e1, suppressing tilt and solder balls of the electronic component 1J and improving mounting strength. Similarly, solder also adheres to the portion of the second terminal electrode 42J exposed from the second end surface 10e2, suppressing tilt and solder balls of the electronic component 1J and improving mounting strength.
  • the electronic component 1J of the tenth embodiment has the same effects as the electronic component 1 of the first embodiment in other configurations.
  • FIG. 15 is a side view showing an eleventh embodiment of an electronic component as viewed from the first side.
  • Fig. 16 is a cross-sectional view taken along line XVI-XVI of Fig. 15.
  • the eleventh embodiment differs from the first embodiment in that a protective layer is provided. This different configuration will be described below.
  • the other configurations are the same as those of the first embodiment, and the same reference numerals as those of the first embodiment will be used and description thereof will be omitted.
  • the electronic component 1K of the eleventh embodiment has a first protective layer 15 and a second protective layer 16. Note that the electronic component 1K may have either the first protective layer 15 or the second protective layer 16.
  • the first protective layer 15 is provided on the first side surface 10s1 and covers the first coil conductor 21, the first lead conductor 25, and the second lead conductor 26. When viewed from a direction perpendicular to the first side surface 10s1, the first protective layer 15 has the same size as the first side surface 10s1 of the glass substrate 10.
  • the first protective layer 15 is insulating and is made of a resin such as epoxy or polyimide.
  • the first protective layer 15 is colored.
  • the first protective layer 15 is colored, for example, green or blue, and the transparency of the first protective layer 15 is lower than the transparency of the glass material of the glass substrate 10.
  • the glass material is a material in an amorphous state that has not been crystallized.
  • the second protective layer 16 is provided on the second side surface 10s2 and covers the second coil conductor 22. When viewed from a direction perpendicular to the second side surface 10s2, the second protective layer 16 has the same size as the second side surface 10s2 of the glass substrate 10.
  • the second protective layer 16 has insulating properties and is made of a resin such as epoxy or polyimide.
  • the second protective layer 16 is colored.
  • the second protective layer 16 is colored, for example, green or blue, and the transparency of the second protective layer 16 is lower than the transparency of the glass material of the glass substrate 10.
  • the first protective layer 15 is provided, so that the first coil conductor 21, the first lead conductor 25, and the second lead conductor 26 are protected, improving reliability.
  • the exposed area of the glass substrate 10 is reduced, improving the strength of the electronic component 1K.
  • the solder can be prevented from adhering to the first coil conductor 21, the first lead conductor 25, and the second lead conductor 26.
  • the width dimension W of the glass substrate 10 is large, so that the occurrence of warping in the width direction (Y direction) of the glass substrate 10 can be reduced.
  • the first protective layer 15 is colored, so that it can be detected by a laser sensor or a camera.
  • the second protective layer 16 is protected, improving reliability. Also, the exposed area of the glass substrate 10 is reduced, improving the strength of the electronic component 1K. Also, it is possible to prevent solder from adhering to the second coil conductor 22. Even if the second protective layer 16 is provided, the width dimension W of the glass substrate 10 is large, so that the occurrence of warping in the width direction (Y direction) of the glass substrate 10 can be reduced.
  • the second protective layer 16 is colored, so that it can be detected by a laser sensor or camera.
  • the electronic component 1K of the eleventh embodiment has the same effects as the electronic component 1 of the first embodiment in other configurations.
  • ⁇ Twelfth embodiment> 17 is a side view of the electronic component according to the twelfth embodiment as viewed from the first side.
  • the twelfth embodiment differs from the eleventh embodiment in the size of the protective layer. This difference will be described below.
  • the other configurations are the same as those of the eleventh embodiment, and the same reference numerals as those of the eleventh embodiment will be used and the description thereof will be omitted.
  • first protective layer 15 when viewed from a direction perpendicular to first side surface 10s1, first protective layer 15 is located inside the outer periphery of first side surface 10s1 of glass substrate 10.
  • second protective layer 16 when viewed from a direction perpendicular to second side surface 10s2, second protective layer 16 is located inside the outer periphery of second side surface 10s2 of glass substrate 10.
  • first protective layer 15 and second protective layer 16 only first protective layer 15 needs to satisfy the above configuration.
  • first protective layer 15 is smaller than the outer periphery of first side surface 10s1, which makes it easier to process glass substrate 10. For example, when cutting glass substrate 10, it is possible to crystallize the portion of glass substrate 10 to be cut and then cut it by etching. Also, for example, when cutting with a dicer, it is possible to prevent first protective layer 15 from peeling off glass substrate 10 due to the load of the dicer.
  • the second protective layer 16 is smaller than the outer periphery of the second side surface 10s2, the glass substrate 10 can be easily processed when cutting the glass substrate 10. Also, when cutting the glass substrate 10 with a dicer, the second protective layer 16 can be prevented from peeling off from the glass substrate 10 due to the load of the dicer.
  • electronic component 1L of the 12th embodiment has the same effects as electronic component 1K of the 11th embodiment.
  • Thirteenth Embodiment 18 is a side view of the electronic component according to the thirteenth embodiment, as viewed from the first side.
  • the thirteenth embodiment differs from the twelfth embodiment in the configuration of the end face of the glass substrate. This different configuration will be described below.
  • the other configurations are the same as those of the twelfth embodiment, and the same reference numerals as those of the twelfth embodiment will be used and the description thereof will be omitted.
  • the first end surface 10e1 of the glass substrate 10 is colored.
  • the first end surface 10e1 of the glass substrate 10 is composed of a crystallized portion 10a.
  • the crystallized portion 10a is shown hatched in FIG. 18.
  • the crystallized portion 10a is the portion of the glass substrate 10 that has been crystallized.
  • the transparency of the crystallized portion 10a is lower than the transparency of the uncrystallized glass material of the glass substrate 10.
  • the crystallized portion 10a can be formed by irradiating the portion of the glass substrate 10 to be crystallized with ultraviolet light, followed by heat treatment (e.g., baking).
  • the second end face 10e2 of the glass substrate 10 is colored. Specifically, the second end face 10e2 of the glass substrate 10 is composed of the crystallized portion 10a. Of the first end face 10e1 and the second end face 10e2, only the first end face 10e1 needs to satisfy the above configuration.
  • the first end face 10e1 is colored and can be detected by a laser sensor or a camera.
  • the second end face 10e2 is colored and can be detected by a laser sensor or a camera.
  • the end face may be colored by other methods, such as separately coloring the end face other than the crystallized portion 10a.
  • a colored resin layer may be provided on the end face.
  • electronic component 1M of the 13th embodiment has the same effects as electronic component 1L of the 12th embodiment.
  • Fig. 19 is a side view showing a fourteenth embodiment of the electronic component as viewed from the first side.
  • Fig. 20 is a cross-sectional view taken along the line XX-XX in Fig. 19.
  • the fourteenth embodiment differs from the third embodiment in that an inductor element is added. This different configuration will be described below.
  • the other configurations are the same as those of the third embodiment, and the same reference numerals as those of the third embodiment will be used and the description thereof will be omitted.
  • the electronic component 1N of the 14th embodiment has a first coil conductor 21 of the inductor element 2 on the first plate electrode 31 and second plate electrode 32 of the capacitor element 3 on the first side surface 10s1.
  • the first plate electrode 31 and second plate electrode 32 correspond to an example of an "external conductor” as defined in the claims.
  • the first coil conductor 21 corresponds to an example of a "wiring layer" as defined in the claims.
  • the inductor element 2 has a configuration similar to that of the inductor element 2 of the first embodiment.
  • the capacitor element 3 has a configuration similar to that of the capacitor element 3 of the third embodiment. For this reason, detailed descriptions of the inductor element 2 and the capacitor element 3 will be omitted.
  • Electronic component 1N further has a first protective layer 15, a second protective layer 16, and a third protective layer 17.
  • the first protective layer 15 is provided on the first side surface 10s1, the second protective layer 16 is provided on the second side surface 10s2, and the third protective layer 17 is provided on the first protective layer 15.
  • the first protective layer 15, the second protective layer 16, and the third protective layer 17 have the same configuration as the first protective layer 15 and the second protective layer 16 of the twelfth embodiment. For this reason, a detailed description of the first protective layer 15, the second protective layer 16, and the third protective layer 17 will be omitted.
  • the capacitor element 3 has a first plate electrode 31, a second plate electrode 32, a dielectric film 33, a first lead conductor 35, and a second lead conductor 36.
  • the first plate electrode 31, the second plate electrode 32, the dielectric film 33, the first lead conductor 35, and the second lead conductor 36 are provided on the first side surface 10s1.
  • the capacitor element 3 is covered by a first protective layer 15.
  • the first lead conductor 35 is connected to a first terminal electrode 41, and the second lead conductor 36 is connected to a second terminal electrode 42.
  • the inductor element 2 has a coil 20, a first lead-out conductor 25, and a second lead-out conductor 26.
  • the first lead-out conductor 25 and the second lead-out conductor 26 are provided on the first side surface 10s1 and are covered by a first protective layer 15.
  • the first lead-out conductor 25 is connected to a first terminal electrode 41, and the second lead-out conductor 26 is connected to a second terminal electrode 42.
  • the inductor element 2 and the capacitor element 3 are electrically connected in parallel.
  • the coil 20 includes a first coil conductor 21, a second coil conductor 22, a first through conductor 23, and a second through conductor 24.
  • the first through conductor 23 and the second through conductor 24 each penetrate the glass substrate 10 from the first side surface 10s1 to the second side surface 10s2.
  • the second coil conductor 22 is provided on the second side surface 10s2.
  • the second coil conductor 22 is covered with a second protective layer 16.
  • the first coil conductor 21 is provided on the first protective layer 15 and covered by the third protective layer 17.
  • the first coil conductor 21 is connected to the first through conductor 23 and the second through conductor 24 through a via conductor 27 that penetrates the first protective layer 15.
  • the first coil conductor 21 is located on the first plate electrode 31 and the second plate electrode 32.
  • the first plate electrode 31 and the second plate electrode 32 are disposed inside the coil 20. Specifically, a portion of the capacitor element 3 is provided between the first coil conductor 21 and the second coil conductor 22 of the coil 20, between the first through conductor 23 and the second through conductor 24. "Inside the coil 20" refers to the area surrounded by two surfaces in contact with the inner circumferences of the first through conductor 23 and the second through conductor 24 that face each other, and two surfaces in contact with the inner circumferences of the first coil conductor 21 and the second coil conductor 22 that face each other.
  • the electronic component 1N of the 14th embodiment allows for more complex circuits to be realized without increasing the height dimension of the electronic component 1N.
  • electronic component 1N of the 14th embodiment has the same effects as electronic component 1 of the first embodiment and electronic component 1B of the third embodiment.
  • a glass substrate including a top surface, a bottom surface, a first side surface, and a second side surface; an outer surface conductor provided on at least the first side surface of the first side surface and the second side surface and which is at least a part of a passive element; a terminal electrode embedded in the glass substrate so as to be exposed from the bottom surface and electrically connected to the outer surface conductor; the terminal electrode penetrates the glass substrate from the first side surface to the second side surface, an electronic component, wherein a height dimension of the glass substrate, which is the distance between the top surface and the bottom surface, is smaller than a width dimension of the glass substrate, which is the distance between the first side surface and the second side surface.
  • the passive element is an inductor element
  • the inductor element has a coil wound in a spiral shape along an axis and including the outer conductor and the through conductor;
  • the inductor element has a coil wound in a spiral shape along an axis and including the outer conductor and the through conductor;
  • the electronic component according to ⁇ 2>, wherein the axis of the coil is perpendicular to the bottom surface.
  • the passive element is a capacitor element
  • the outer conductor includes a first plate electrode provided on the first side surface and a second plate electrode provided on the first plate electrode
  • the passive element is a capacitor element
  • the electronic component described in ⁇ 1>, wherein the outer surface conductor includes a first flat plate electrode penetrating the glass substrate from the first side surface to the second side surface, and a second flat plate electrode facing the first flat plate electrode and penetrating the glass substrate from the first side surface to the second side surface.
  • the passive elements include an inductor element and a capacitor element.
  • the glass substrate has a first portion and a second portion having a height dimension smaller than a height dimension of the first portion.
  • the glass substrate includes a first end surface and a second end surface;
  • a length dimension of the glass substrate which is a distance between the first end face and the second end face, is equal to or greater than twice a width dimension of the glass substrate.
  • ⁇ 11> The electronic component according to any one of ⁇ 1> to ⁇ 10>, wherein there are three or more terminal electrodes.
  • the glass substrate includes a first end surface and a second end surface;
  • ⁇ 13> The electronic component according to any one of ⁇ 1> to ⁇ 12>, further comprising a protective layer provided on the first side surface and covering the external conductors.
  • ⁇ 14> The electronic component according to ⁇ 13>, wherein the protective layer is colored.
  • ⁇ 15> The electronic component according to ⁇ 13> or ⁇ 14>, wherein the protective layer is located inside an outer periphery of the first side surface of the glass substrate when viewed from a direction perpendicular to the first side surface.
  • the glass substrate includes a first end surface and a second end surface;
  • ⁇ 17> The electronic component according to any one of ⁇ 1> to ⁇ 16>, further comprising a wiring layer on the outer conductor on the first side surface.
  • ⁇ 18> providing a glass mother substrate including a first side and a second side; providing, on the first surface, two or more singulation regions in a direction parallel to the first side and two or more singulation regions in a direction parallel to the third side, the singulation regions being defined by first and second sides parallel to each other and having lengths smaller than a distance between the first surface and the second surface, and third and fourth sides perpendicular to the first side and parallel to each other; forming a through hole penetrating the mother substrate from the first surface to the second surface in each of all the individual regions, and filling a conductor in the through hole to form a terminal electrode; forming an outer surface conductor, which is at least a part of a passive element, on the first surface in each of all the individual regions; and manufacturing a plurality of electronic components by singulating each of all of the singulation

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Coils Or Transformers For Communication (AREA)
PCT/JP2023/030131 2022-12-07 2023-08-22 電子部品およびその製造方法 Ceased WO2024122114A1 (ja)

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CN202380083549.9A CN120303752A (zh) 2022-12-07 2023-08-22 电子部件及其制造方法
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US19/199,998 US20250266206A1 (en) 2022-12-07 2025-05-06 Electronic component and method for manufacturing the same

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018074134A (ja) * 2016-10-24 2018-05-10 大日本印刷株式会社 高周波部品及びその製造方法
JP2020526952A (ja) * 2017-07-07 2020-08-31 スリーディー グラス ソリューションズ，インク３Ｄ Ｇｌａｓｓ Ｓｏｌｕｔｉｏｎｓ，Ｉｎｃ パッケージ光活性ガラス基板内のｒｆシステムのための２ｄ及び３ｄのｒｆ集中素子デバイス
JP2022050298A (ja) * 2020-09-17 2022-03-30 株式会社村田製作所 インダクタ部品
WO2023089967A1 (ja) * 2021-11-18 2023-05-25 株式会社村田製作所 インダクタ部品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018074134A (ja) * 2016-10-24 2018-05-10 大日本印刷株式会社 高周波部品及びその製造方法
JP2020526952A (ja) * 2017-07-07 2020-08-31 スリーディー グラス ソリューションズ，インク３Ｄ Ｇｌａｓｓ Ｓｏｌｕｔｉｏｎｓ，Ｉｎｃ パッケージ光活性ガラス基板内のｒｆシステムのための２ｄ及び３ｄのｒｆ集中素子デバイス
JP2022050298A (ja) * 2020-09-17 2022-03-30 株式会社村田製作所 インダクタ部品
WO2023089967A1 (ja) * 2021-11-18 2023-05-25 株式会社村田製作所 インダクタ部品

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US20250266206A1 (en) 2025-08-21

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