JPWO2024095464A5 - - Google Patents
Info
- Publication number
- JPWO2024095464A5 JPWO2024095464A5 JP2024554064A JP2024554064A JPWO2024095464A5 JP WO2024095464 A5 JPWO2024095464 A5 JP WO2024095464A5 JP 2024554064 A JP2024554064 A JP 2024554064A JP 2024554064 A JP2024554064 A JP 2024554064A JP WO2024095464 A5 JPWO2024095464 A5 JP WO2024095464A5
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- manufacturing
- semiconductor device
- grindstone
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/041199 WO2024095464A1 (ja) | 2022-11-04 | 2022-11-04 | 半導体デバイスの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024095464A1 JPWO2024095464A1 (https=) | 2024-05-10 |
| JPWO2024095464A5 true JPWO2024095464A5 (https=) | 2025-07-16 |
Family
ID=90929987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024554064A Pending JPWO2024095464A1 (https=) | 2022-11-04 | 2022-11-04 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250329549A1 (https=) |
| JP (1) | JPWO2024095464A1 (https=) |
| CN (1) | CN119137731A (https=) |
| TW (1) | TW202420556A (https=) |
| WO (1) | WO2024095464A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5837272B2 (ja) * | 2008-05-21 | 2015-12-24 | 日立化成株式会社 | 半導体製造装置の製造方法 |
| JP2015213201A (ja) * | 2015-08-25 | 2015-11-26 | 日東電工株式会社 | 半導体装置の製造方法 |
| JP2019033124A (ja) * | 2017-08-04 | 2019-02-28 | リンテック株式会社 | 半導体装置の製造方法、及び接着積層体 |
-
2022
- 2022-11-04 CN CN202280095458.2A patent/CN119137731A/zh active Pending
- 2022-11-04 WO PCT/JP2022/041199 patent/WO2024095464A1/ja not_active Ceased
- 2022-11-04 JP JP2024554064A patent/JPWO2024095464A1/ja active Pending
- 2022-11-04 US US18/857,189 patent/US20250329549A1/en active Pending
-
2023
- 2023-10-27 TW TW112141219A patent/TW202420556A/zh unknown
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