JPWO2024090143A5 - - Google Patents

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Publication number
JPWO2024090143A5
JPWO2024090143A5 JP2024552908A JP2024552908A JPWO2024090143A5 JP WO2024090143 A5 JPWO2024090143 A5 JP WO2024090143A5 JP 2024552908 A JP2024552908 A JP 2024552908A JP 2024552908 A JP2024552908 A JP 2024552908A JP WO2024090143 A5 JPWO2024090143 A5 JP WO2024090143A5
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JP
Japan
Prior art keywords
substrate
layer
electrode
barrier layer
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024552908A
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English (en)
Japanese (ja)
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JPWO2024090143A1 (https=
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/035853 external-priority patent/WO2024090143A1/ja
Publication of JPWO2024090143A1 publication Critical patent/JPWO2024090143A1/ja
Publication of JPWO2024090143A5 publication Critical patent/JPWO2024090143A5/ja
Pending legal-status Critical Current

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JP2024552908A 2022-10-27 2023-10-02 Pending JPWO2024090143A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022172651 2022-10-27
PCT/JP2023/035853 WO2024090143A1 (ja) 2022-10-27 2023-10-02 装置、電気装置および基板

Publications (2)

Publication Number Publication Date
JPWO2024090143A1 JPWO2024090143A1 (https=) 2024-05-02
JPWO2024090143A5 true JPWO2024090143A5 (https=) 2025-07-03

Family

ID=90830589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024552908A Pending JPWO2024090143A1 (https=) 2022-10-27 2023-10-02

Country Status (4)

Country Link
EP (1) EP4611024A1 (https=)
JP (1) JPWO2024090143A1 (https=)
CN (1) CN120092315A (https=)
WO (1) WO2024090143A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4547411B2 (ja) * 2007-10-05 2010-09-22 富士通株式会社 半導体装置、及び半導体装置の製造方法
WO2015022931A1 (ja) 2013-08-14 2015-02-19 株式会社村田製作所 弾性波装置、電子部品、および弾性波装置の製造方法
US11508704B2 (en) * 2019-12-17 2022-11-22 Seoul Viosys Co., Ltd. Method of repairing light emitting device and display panel having repaired light emitting device

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