CN120092315A - 装置、电气装置以及基板 - Google Patents

装置、电气装置以及基板 Download PDF

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Publication number
CN120092315A
CN120092315A CN202380074396.1A CN202380074396A CN120092315A CN 120092315 A CN120092315 A CN 120092315A CN 202380074396 A CN202380074396 A CN 202380074396A CN 120092315 A CN120092315 A CN 120092315A
Authority
CN
China
Prior art keywords
layer
substrate
electrode
bonding
barrier layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380074396.1A
Other languages
English (en)
Chinese (zh)
Inventor
丰田大介
前田和孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN120092315A publication Critical patent/CN120092315A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02992—Details of bus bars, contact pads or other electrical connections for finger electrodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN202380074396.1A 2022-10-27 2023-10-02 装置、电气装置以及基板 Pending CN120092315A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-172651 2022-10-27
JP2022172651 2022-10-27
PCT/JP2023/035853 WO2024090143A1 (ja) 2022-10-27 2023-10-02 装置、電気装置および基板

Publications (1)

Publication Number Publication Date
CN120092315A true CN120092315A (zh) 2025-06-03

Family

ID=90830589

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380074396.1A Pending CN120092315A (zh) 2022-10-27 2023-10-02 装置、电气装置以及基板

Country Status (4)

Country Link
EP (1) EP4611024A1 (https=)
JP (1) JPWO2024090143A1 (https=)
CN (1) CN120092315A (https=)
WO (1) WO2024090143A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4547411B2 (ja) * 2007-10-05 2010-09-22 富士通株式会社 半導体装置、及び半導体装置の製造方法
WO2015022931A1 (ja) 2013-08-14 2015-02-19 株式会社村田製作所 弾性波装置、電子部品、および弾性波装置の製造方法
US11508704B2 (en) * 2019-12-17 2022-11-22 Seoul Viosys Co., Ltd. Method of repairing light emitting device and display panel having repaired light emitting device

Also Published As

Publication number Publication date
WO2024090143A1 (ja) 2024-05-02
JPWO2024090143A1 (https=) 2024-05-02
EP4611024A1 (en) 2025-09-03

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