JPWO2024090143A1 - - Google Patents
Info
- Publication number
- JPWO2024090143A1 JPWO2024090143A1 JP2024552908A JP2024552908A JPWO2024090143A1 JP WO2024090143 A1 JPWO2024090143 A1 JP WO2024090143A1 JP 2024552908 A JP2024552908 A JP 2024552908A JP 2024552908 A JP2024552908 A JP 2024552908A JP WO2024090143 A1 JPWO2024090143 A1 JP WO2024090143A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02992—Details of bus bars, contact pads or other electrical connections for finger electrodes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/058—Holders or supports for surface acoustic wave devices
- H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/951—Materials of bond pads
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022172651 | 2022-10-27 | ||
| PCT/JP2023/035853 WO2024090143A1 (ja) | 2022-10-27 | 2023-10-02 | 装置、電気装置および基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024090143A1 true JPWO2024090143A1 (https=) | 2024-05-02 |
| JPWO2024090143A5 JPWO2024090143A5 (https=) | 2025-07-03 |
Family
ID=90830589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024552908A Pending JPWO2024090143A1 (https=) | 2022-10-27 | 2023-10-02 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4611024A1 (https=) |
| JP (1) | JPWO2024090143A1 (https=) |
| CN (1) | CN120092315A (https=) |
| WO (1) | WO2024090143A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009094224A (ja) * | 2007-10-05 | 2009-04-30 | Fujitsu Ltd | 回路基板、半導体装置、及び半導体装置の製造方法 |
| US20210183828A1 (en) * | 2019-12-17 | 2021-06-17 | Seoul Viosys Co., Ltd. | Method of repairing light emitting device and display panel having repaired light emitting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015022931A1 (ja) | 2013-08-14 | 2015-02-19 | 株式会社村田製作所 | 弾性波装置、電子部品、および弾性波装置の製造方法 |
-
2023
- 2023-10-02 CN CN202380074396.1A patent/CN120092315A/zh active Pending
- 2023-10-02 WO PCT/JP2023/035853 patent/WO2024090143A1/ja not_active Ceased
- 2023-10-02 JP JP2024552908A patent/JPWO2024090143A1/ja active Pending
- 2023-10-02 EP EP23882352.0A patent/EP4611024A1/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009094224A (ja) * | 2007-10-05 | 2009-04-30 | Fujitsu Ltd | 回路基板、半導体装置、及び半導体装置の製造方法 |
| US20210183828A1 (en) * | 2019-12-17 | 2021-06-17 | Seoul Viosys Co., Ltd. | Method of repairing light emitting device and display panel having repaired light emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024090143A1 (ja) | 2024-05-02 |
| CN120092315A (zh) | 2025-06-03 |
| EP4611024A1 (en) | 2025-09-03 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250421 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250421 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260303 |