JPWO2024085050A5 - - Google Patents

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Publication number
JPWO2024085050A5
JPWO2024085050A5 JP2024551738A JP2024551738A JPWO2024085050A5 JP WO2024085050 A5 JPWO2024085050 A5 JP WO2024085050A5 JP 2024551738 A JP2024551738 A JP 2024551738A JP 2024551738 A JP2024551738 A JP 2024551738A JP WO2024085050 A5 JPWO2024085050 A5 JP WO2024085050A5
Authority
JP
Japan
Prior art keywords
heat dissipation
pipe
base
pipe mounting
substrate according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024551738A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024085050A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/036972 external-priority patent/WO2024085050A1/ja
Publication of JPWO2024085050A1 publication Critical patent/JPWO2024085050A1/ja
Publication of JPWO2024085050A5 publication Critical patent/JPWO2024085050A5/ja
Pending legal-status Critical Current

Links

JP2024551738A 2022-10-17 2023-10-12 Pending JPWO2024085050A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022166067 2022-10-17
PCT/JP2023/036972 WO2024085050A1 (ja) 2022-10-17 2023-10-12 放熱基板及び放熱装置

Publications (2)

Publication Number Publication Date
JPWO2024085050A1 JPWO2024085050A1 (https=) 2024-04-25
JPWO2024085050A5 true JPWO2024085050A5 (https=) 2025-07-03

Family

ID=90737477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024551738A Pending JPWO2024085050A1 (https=) 2022-10-17 2023-10-12

Country Status (3)

Country Link
JP (1) JPWO2024085050A1 (https=)
DE (1) DE112023004364T5 (https=)
WO (1) WO2024085050A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748699U (https=) * 1980-09-05 1982-03-18
WO2004097936A1 (en) * 2003-05-01 2004-11-11 Queen Mary & Westfield College A cellular thermal management device and method of making such a device
US7351360B2 (en) * 2004-11-12 2008-04-01 International Business Machines Corporation Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive
US7308931B2 (en) * 2004-12-01 2007-12-18 Intel Corporation Heat pipe remote heat exchanger (RHE) with graphite block
JP2008547216A (ja) * 2005-06-23 2008-12-25 テレフオンアクチーボラゲット エル エム エリクソン（パブル） 冷却構体
US20150096719A1 (en) * 2013-10-04 2015-04-09 Specialty Minerals (Michigan) Inc. Apparatus for Dissipating Heat
JP2022003656A (ja) * 2018-09-20 2022-01-11 株式会社カネカ 半導体パッケージ
JP2022117959A (ja) * 2021-02-01 2022-08-12 株式会社サーモグラフィティクス グラファイト構造体、冷却装置、グラファイト構造体の製造方法

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