JP2023004123A5 - - Google Patents

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Publication number
JP2023004123A5
JP2023004123A5 JP2021105634A JP2021105634A JP2023004123A5 JP 2023004123 A5 JP2023004123 A5 JP 2023004123A5 JP 2021105634 A JP2021105634 A JP 2021105634A JP 2021105634 A JP2021105634 A JP 2021105634A JP 2023004123 A5 JP2023004123 A5 JP 2023004123A5
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JP
Japan
Prior art keywords
electronic device
conductive member
substrate
closer
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021105634A
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English (en)
Japanese (ja)
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JP7653646B2 (ja
JP2023004123A (ja
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Publication date
Application filed filed Critical
Priority to JP2021105634A priority Critical patent/JP7653646B2/ja
Priority claimed from JP2021105634A external-priority patent/JP7653646B2/ja
Priority to PCT/JP2022/018637 priority patent/WO2022270145A1/ja
Publication of JP2023004123A publication Critical patent/JP2023004123A/ja
Publication of JP2023004123A5 publication Critical patent/JP2023004123A5/ja
Application granted granted Critical
Publication of JP7653646B2 publication Critical patent/JP7653646B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021105634A 2021-06-25 2021-06-25 電子機器用筐体 Active JP7653646B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021105634A JP7653646B2 (ja) 2021-06-25 2021-06-25 電子機器用筐体
PCT/JP2022/018637 WO2022270145A1 (ja) 2021-06-25 2022-04-22 電子機器用筐体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021105634A JP7653646B2 (ja) 2021-06-25 2021-06-25 電子機器用筐体

Publications (3)

Publication Number Publication Date
JP2023004123A JP2023004123A (ja) 2023-01-17
JP2023004123A5 true JP2023004123A5 (https=) 2024-05-07
JP7653646B2 JP7653646B2 (ja) 2025-03-31

Family

ID=84545631

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021105634A Active JP7653646B2 (ja) 2021-06-25 2021-06-25 電子機器用筐体

Country Status (2)

Country Link
JP (1) JP7653646B2 (https=)
WO (1) WO2022270145A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024100259A (ja) * 2023-01-13 2024-07-26 株式会社三洋物産 遊技機
JP2024100261A (ja) * 2023-01-13 2024-07-26 株式会社三洋物産 遊技機
JP2024100258A (ja) * 2023-01-13 2024-07-26 株式会社三洋物産 遊技機

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009231511A (ja) 2008-03-21 2009-10-08 Sharp Corp 筐体
JP2009283064A (ja) 2008-05-21 2009-12-03 I-O Data Device Inc 記憶装置収納筐体の放熱構造
JP6523207B2 (ja) 2016-04-27 2019-05-29 株式会社コンテック ヒートシンクおよび筐体

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