JP7653646B2 - 電子機器用筐体 - Google Patents

電子機器用筐体 Download PDF

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Publication number
JP7653646B2
JP7653646B2 JP2021105634A JP2021105634A JP7653646B2 JP 7653646 B2 JP7653646 B2 JP 7653646B2 JP 2021105634 A JP2021105634 A JP 2021105634A JP 2021105634 A JP2021105634 A JP 2021105634A JP 7653646 B2 JP7653646 B2 JP 7653646B2
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JP
Japan
Prior art keywords
electronic device
substrate
conductive member
thermal conduction
heat
Prior art date
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Active
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JP2021105634A
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English (en)
Japanese (ja)
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JP2023004123A5 (https=
JP2023004123A (ja
Inventor
望 鄭
浩幸 酒向
知弥 奥野
友紀 小宮
良英 川島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2021105634A priority Critical patent/JP7653646B2/ja
Priority to PCT/JP2022/018637 priority patent/WO2022270145A1/ja
Publication of JP2023004123A publication Critical patent/JP2023004123A/ja
Publication of JP2023004123A5 publication Critical patent/JP2023004123A5/ja
Application granted granted Critical
Publication of JP7653646B2 publication Critical patent/JP7653646B2/ja
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2021105634A 2021-06-25 2021-06-25 電子機器用筐体 Active JP7653646B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021105634A JP7653646B2 (ja) 2021-06-25 2021-06-25 電子機器用筐体
PCT/JP2022/018637 WO2022270145A1 (ja) 2021-06-25 2022-04-22 電子機器用筐体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021105634A JP7653646B2 (ja) 2021-06-25 2021-06-25 電子機器用筐体

Publications (3)

Publication Number Publication Date
JP2023004123A JP2023004123A (ja) 2023-01-17
JP2023004123A5 JP2023004123A5 (https=) 2024-05-07
JP7653646B2 true JP7653646B2 (ja) 2025-03-31

Family

ID=84545631

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021105634A Active JP7653646B2 (ja) 2021-06-25 2021-06-25 電子機器用筐体

Country Status (2)

Country Link
JP (1) JP7653646B2 (https=)
WO (1) WO2022270145A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024100259A (ja) * 2023-01-13 2024-07-26 株式会社三洋物産 遊技機
JP2024100261A (ja) * 2023-01-13 2024-07-26 株式会社三洋物産 遊技機
JP2024100258A (ja) * 2023-01-13 2024-07-26 株式会社三洋物産 遊技機

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009231511A (ja) 2008-03-21 2009-10-08 Sharp Corp 筐体
JP2009283064A (ja) 2008-05-21 2009-12-03 I-O Data Device Inc 記憶装置収納筐体の放熱構造
JP2017199770A (ja) 2016-04-27 2017-11-02 株式会社コンテック ヒートシンクおよび筐体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009231511A (ja) 2008-03-21 2009-10-08 Sharp Corp 筐体
JP2009283064A (ja) 2008-05-21 2009-12-03 I-O Data Device Inc 記憶装置収納筐体の放熱構造
JP2017199770A (ja) 2016-04-27 2017-11-02 株式会社コンテック ヒートシンクおよび筐体

Also Published As

Publication number Publication date
JP2023004123A (ja) 2023-01-17
WO2022270145A1 (ja) 2022-12-29

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