DE112023004364T5 - Wärmeableitungssubstrat und wärmeableitungsvorrichtung - Google Patents

Wärmeableitungssubstrat und wärmeableitungsvorrichtung

Info

Publication number
DE112023004364T5
DE112023004364T5 DE112023004364.7T DE112023004364T DE112023004364T5 DE 112023004364 T5 DE112023004364 T5 DE 112023004364T5 DE 112023004364 T DE112023004364 T DE 112023004364T DE 112023004364 T5 DE112023004364 T5 DE 112023004364T5
Authority
DE
Germany
Prior art keywords
heat dissipation
base body
mounting portions
dissipation substrate
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112023004364.7T
Other languages
German (de)
English (en)
Inventor
Takashi Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of DE112023004364T5 publication Critical patent/DE112023004364T5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112023004364.7T 2022-10-17 2023-10-12 Wärmeableitungssubstrat und wärmeableitungsvorrichtung Pending DE112023004364T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-166067 2022-10-17
JP2022166067 2022-10-17
PCT/JP2023/036972 WO2024085050A1 (ja) 2022-10-17 2023-10-12 放熱基板及び放熱装置

Publications (1)

Publication Number Publication Date
DE112023004364T5 true DE112023004364T5 (de) 2025-09-04

Family

ID=90737477

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112023004364.7T Pending DE112023004364T5 (de) 2022-10-17 2023-10-12 Wärmeableitungssubstrat und wärmeableitungsvorrichtung

Country Status (3)

Country Link
JP (1) JPWO2024085050A1 (https=)
DE (1) DE112023004364T5 (https=)
WO (1) WO2024085050A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748699U (https=) * 1980-09-05 1982-03-18
WO2004097936A1 (en) * 2003-05-01 2004-11-11 Queen Mary & Westfield College A cellular thermal management device and method of making such a device
US7351360B2 (en) * 2004-11-12 2008-04-01 International Business Machines Corporation Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive
US7308931B2 (en) * 2004-12-01 2007-12-18 Intel Corporation Heat pipe remote heat exchanger (RHE) with graphite block
JP2008547216A (ja) * 2005-06-23 2008-12-25 テレフオンアクチーボラゲット エル エム エリクソン（パブル） 冷却構体
US20150096719A1 (en) * 2013-10-04 2015-04-09 Specialty Minerals (Michigan) Inc. Apparatus for Dissipating Heat
JP2022003656A (ja) * 2018-09-20 2022-01-11 株式会社カネカ 半導体パッケージ
JP2022117959A (ja) * 2021-02-01 2022-08-12 株式会社サーモグラフィティクス グラファイト構造体、冷却装置、グラファイト構造体の製造方法

Also Published As

Publication number Publication date
WO2024085050A1 (ja) 2024-04-25
JPWO2024085050A1 (https=) 2024-04-25

Similar Documents

Publication Publication Date Title
DE3884846T2 (de) Kühlungsgerät und eine dieses Gerät verwendende Halbleitervorrichtung.
DE68925403T2 (de) Kühlungsstruktur für elektronische Bauelemente
DE102004021075B4 (de) Halbleiterbauelement mit anisotrop thermisch leitender Radiatorbasis und Verfahren zu seiner Herstellung
DE4410467C2 (de) Wärmesenkenanordnung mit einer thermisch leitenden Platte für eine Mehrzahl von integrierten Schaltungen auf einem Substrat
DE69005382T2 (de) Wärmeabfuhrvorrichtung für Komponenten vom Typ SMD zur Montage auf Schaltplatten.
EP2439774A2 (de) Wärmeverteiler mit flexibel gelagertem Wärmerohr
DE102020207150A1 (de) Vorrichtung für das wärmemanagement von elektronikbauteilen
DE19932953A1 (de) Halbleitervorrichtung mit einer Wärmeabstrahlungsanordnung zum Entfernen von Wärme von dem Halbleiterelement
DE102013203932A1 (de) Elektronische, optoelektronische oder elektrische Anordnung
DE60023597T2 (de) Leiterplattenanordnung mit integriertem Verbundkern mit metallischer Matrix
DE112016005508T5 (de) Halbleitereinrichtung
DE4332115B4 (de) Anordnung zur Kühlung mindestens einen Kühlkörper aufweisenden Leiterplatte
DE202013002411U1 (de) Wärmeverteiler mit Flachrohrkühlelement
EP1938373A2 (de) Ic-bauelement mit kühlanordnung
EP2439775B1 (de) Wärmeverteiler mit mechanisch gesichertem Wärmekopplungselement
DE2420739A1 (de) Halterungsvorrichtung fuer gedruckte schaltungen
DE102007052397B4 (de) Kühlanordnung zur thermischen Kontaktierung zwischen elektronischem Bauelement und Kühlkörper
DE20304781U1 (de) CPU Kühlbasis
EP1791177A1 (de) Halbleitereinheit mit verbesserter Wärmekopplungsanordnung
DE112023004364T5 (de) Wärmeableitungssubstrat und wärmeableitungsvorrichtung
DE112023004372T5 (de) Wärmeableitungssubstrat und wärmeableitungsvorrichtung
EP0652694B1 (de) Steuergerät für ein Kraftfahrzeug
DE10249331B4 (de) Kühlvorrichtung
DE102019207498B4 (de) Befestigungsstruktur und die Struktur nutzende Halbleitervorrichtung
DE102021105707B4 (de) Stromversorgungseinheit

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023360000

Ipc: H10W0040200000