JPWO2024085050A1 - - Google Patents
Info
- Publication number
- JPWO2024085050A1 JPWO2024085050A1 JP2024551738A JP2024551738A JPWO2024085050A1 JP WO2024085050 A1 JPWO2024085050 A1 JP WO2024085050A1 JP 2024551738 A JP2024551738 A JP 2024551738A JP 2024551738 A JP2024551738 A JP 2024551738A JP WO2024085050 A1 JPWO2024085050 A1 JP WO2024085050A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/01—Manufacture or treatment
- H10W40/03—Manufacture or treatment of arrangements for cooling
- H10W40/037—Assembling together parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022166067 | 2022-10-17 | ||
| PCT/JP2023/036972 WO2024085050A1 (ja) | 2022-10-17 | 2023-10-12 | 放熱基板及び放熱装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024085050A1 true JPWO2024085050A1 (https=) | 2024-04-25 |
| JPWO2024085050A5 JPWO2024085050A5 (https=) | 2025-07-03 |
Family
ID=90737477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024551738A Pending JPWO2024085050A1 (https=) | 2022-10-17 | 2023-10-12 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024085050A1 (https=) |
| DE (1) | DE112023004364T5 (https=) |
| WO (1) | WO2024085050A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5748699U (https=) * | 1980-09-05 | 1982-03-18 | ||
| WO2004097936A1 (en) * | 2003-05-01 | 2004-11-11 | Queen Mary & Westfield College | A cellular thermal management device and method of making such a device |
| US20060113064A1 (en) * | 2004-12-01 | 2006-06-01 | Intel Corporation | Heat pipe remote heat exchanger (RHE) with graphite block |
| JP2008547216A (ja) * | 2005-06-23 | 2008-12-25 | テレフオンアクチーボラゲット エル エム エリクソン（パブル） | 冷却構体 |
| US20140038362A1 (en) * | 2004-11-12 | 2014-02-06 | International Business Machines Corporation | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive |
| JP2016540371A (ja) * | 2013-10-04 | 2016-12-22 | スペシャルティ ミネラルズ （ミシガン） インコーポレーテツド | 熱を放散する装置 |
| JP2022003656A (ja) * | 2018-09-20 | 2022-01-11 | 株式会社カネカ | 半導体パッケージ |
| JP2022117959A (ja) * | 2021-02-01 | 2022-08-12 | 株式会社サーモグラフィティクス | グラファイト構造体、冷却装置、グラファイト構造体の製造方法 |
-
2023
- 2023-10-12 JP JP2024551738A patent/JPWO2024085050A1/ja active Pending
- 2023-10-12 DE DE112023004364.7T patent/DE112023004364T5/de active Pending
- 2023-10-12 WO PCT/JP2023/036972 patent/WO2024085050A1/ja not_active Ceased
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5748699U (https=) * | 1980-09-05 | 1982-03-18 | ||
| WO2004097936A1 (en) * | 2003-05-01 | 2004-11-11 | Queen Mary & Westfield College | A cellular thermal management device and method of making such a device |
| US20140038362A1 (en) * | 2004-11-12 | 2014-02-06 | International Business Machines Corporation | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive |
| US20060113064A1 (en) * | 2004-12-01 | 2006-06-01 | Intel Corporation | Heat pipe remote heat exchanger (RHE) with graphite block |
| JP2008547216A (ja) * | 2005-06-23 | 2008-12-25 | テレフオンアクチーボラゲット エル エム エリクソン（パブル） | 冷却構体 |
| JP2016540371A (ja) * | 2013-10-04 | 2016-12-22 | スペシャルティ ミネラルズ （ミシガン） インコーポレーテツド | 熱を放散する装置 |
| JP2022003656A (ja) * | 2018-09-20 | 2022-01-11 | 株式会社カネカ | 半導体パッケージ |
| JP2022117959A (ja) * | 2021-02-01 | 2022-08-12 | 株式会社サーモグラフィティクス | グラファイト構造体、冷却装置、グラファイト構造体の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024085050A1 (ja) | 2024-04-25 |
| DE112023004364T5 (de) | 2025-09-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250415 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250415 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260127 |