JPWO2024085051A1 - - Google Patents

Info

Publication number
JPWO2024085051A1
JPWO2024085051A1 JP2024551740A JP2024551740A JPWO2024085051A1 JP WO2024085051 A1 JPWO2024085051 A1 JP WO2024085051A1 JP 2024551740 A JP2024551740 A JP 2024551740A JP 2024551740 A JP2024551740 A JP 2024551740A JP WO2024085051 A1 JPWO2024085051 A1 JP WO2024085051A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024551740A
Other languages
Japanese (ja)
Other versions
JPWO2024085051A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024085051A1 publication Critical patent/JPWO2024085051A1/ja
Publication of JPWO2024085051A5 publication Critical patent/JPWO2024085051A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2024551740A 2022-10-17 2023-10-12 Pending JPWO2024085051A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022166068 2022-10-17
PCT/JP2023/036982 WO2024085051A1 (ja) 2022-10-17 2023-10-12 放熱基板及び放熱装置

Publications (2)

Publication Number Publication Date
JPWO2024085051A1 true JPWO2024085051A1 (https=) 2024-04-25
JPWO2024085051A5 JPWO2024085051A5 (https=) 2025-06-27

Family

ID=90737488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024551740A Pending JPWO2024085051A1 (https=) 2022-10-17 2023-10-12

Country Status (3)

Country Link
JP (1) JPWO2024085051A1 (https=)
DE (1) DE112023004372T5 (https=)
WO (1) WO2024085051A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748699U (https=) * 1980-09-05 1982-03-18
WO2004097936A1 (en) * 2003-05-01 2004-11-11 Queen Mary & Westfield College A cellular thermal management device and method of making such a device
US20060113064A1 (en) * 2004-12-01 2006-06-01 Intel Corporation Heat pipe remote heat exchanger (RHE) with graphite block
JP2008547216A (ja) * 2005-06-23 2008-12-25 テレフオンアクチーボラゲット エル エム エリクソン（パブル） 冷却構体
US20140038362A1 (en) * 2004-11-12 2014-02-06 International Business Machines Corporation Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive
JP2016540371A (ja) * 2013-10-04 2016-12-22 スペシャルティ ミネラルズ （ミシガン） インコーポレーテツド 熱を放散する装置
JP2022003656A (ja) * 2018-09-20 2022-01-11 株式会社カネカ 半導体パッケージ
JP2022117959A (ja) * 2021-02-01 2022-08-12 株式会社サーモグラフィティクス グラファイト構造体、冷却装置、グラファイト構造体の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748699U (https=) * 1980-09-05 1982-03-18
WO2004097936A1 (en) * 2003-05-01 2004-11-11 Queen Mary & Westfield College A cellular thermal management device and method of making such a device
US20140038362A1 (en) * 2004-11-12 2014-02-06 International Business Machines Corporation Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive
US20060113064A1 (en) * 2004-12-01 2006-06-01 Intel Corporation Heat pipe remote heat exchanger (RHE) with graphite block
JP2008547216A (ja) * 2005-06-23 2008-12-25 テレフオンアクチーボラゲット エル エム エリクソン（パブル） 冷却構体
JP2016540371A (ja) * 2013-10-04 2016-12-22 スペシャルティ ミネラルズ （ミシガン） インコーポレーテツド 熱を放散する装置
JP2022003656A (ja) * 2018-09-20 2022-01-11 株式会社カネカ 半導体パッケージ
JP2022117959A (ja) * 2021-02-01 2022-08-12 株式会社サーモグラフィティクス グラファイト構造体、冷却装置、グラファイト構造体の製造方法

Also Published As

Publication number Publication date
DE112023004372T5 (de) 2025-07-31
WO2024085051A1 (ja) 2024-04-25

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