WO2024085051A1 - 放熱基板及び放熱装置 - Google Patents

放熱基板及び放熱装置 Download PDF

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Publication number
WO2024085051A1
WO2024085051A1 PCT/JP2023/036982 JP2023036982W WO2024085051A1 WO 2024085051 A1 WO2024085051 A1 WO 2024085051A1 JP 2023036982 W JP2023036982 W JP 2023036982W WO 2024085051 A1 WO2024085051 A1 WO 2024085051A1
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WIPO (PCT)
Prior art keywords
heat dissipation
base
cover member
dissipation substrate
pipe mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/036982
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English (en)
French (fr)
Japanese (ja)
Inventor
隆志 宮本
和貴 西本
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Kyocera Corp
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Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2024551740A priority Critical patent/JPWO2024085051A1/ja
Priority to DE112023004372.8T priority patent/DE112023004372T5/de
Publication of WO2024085051A1 publication Critical patent/WO2024085051A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws

Definitions

  • This disclosure relates to a heat dissipation substrate and a heat dissipation device.
  • JP 2010-161177 A shows a heat dissipation device in which the pipe body of a heat pipe is held by a heat dissipation substrate.
  • the heat dissipation substrate of the present disclosure comprises: A substrate including a carbon material; a cover member located on an outer surface of the base; a pipe mounting portion which is a groove or a through hole located across the base and the cover member; Equipped with.
  • the heat dissipation device of the present disclosure comprises: The heat dissipation substrate; a heat pipe having a pipe body; Equipped with The pipe body is mounted on the pipe mounting portion.
  • FIG. 1 is a perspective view showing a heat dissipation substrate according to a first embodiment of the present disclosure.
  • FIG. 2 is an exploded perspective view showing components of a heat dissipation board according to the first embodiment of the present disclosure.
  • 1B is a cross-sectional view taken along line AA in FIG. 1A.
  • 1B is a cross-sectional view taken along line BB in FIG. 1A.
  • FIG. 11 is a cross-sectional view showing a heat dissipation substrate according to a second embodiment.
  • FIG. 11 is a cross-sectional view showing a heat dissipation substrate according to a third embodiment.
  • FIG. 10 is an exploded perspective view showing a heat dissipation substrate according to a fourth embodiment.
  • FIG. 10 is an exploded perspective view showing a heat dissipation substrate according to a fourth embodiment.
  • FIG. 13 is a perspective view showing a heat dissipation substrate according to a fourth embodiment.
  • 4B is a cross-sectional view taken along line AA in FIG. 4A.
  • 4B is a cross-sectional view taken along line BB in FIG. 4A.
  • FIG. 13 is a cross-sectional view showing a heat dissipation substrate according to a fifth embodiment.
  • FIG. 13 is a cross-sectional view showing a heat dissipation substrate according to a sixth embodiment.
  • FIG. 13 is an enlarged cross-sectional view showing a heat dissipation substrate according to a seventh embodiment.
  • FIG. 13 is a cross-sectional view showing a heat dissipation substrate according to an eighth embodiment.
  • FIG. 13 is a partially enlarged view showing a heat dissipation substrate according to an eighth embodiment.
  • 1 is a side view showing a heat dissipation device according to a first embodiment of the present disclosure.
  • FIG. 11 is a side view showing a heat dissipation device according to a second embodiment of the present disclosure.
  • FIGs. 1A and 1B are a perspective view showing a heat dissipation substrate according to a first embodiment of the present disclosure, and an exploded perspective view of components thereof.
  • FIGs. 2A and 2B are a cross-sectional view taken along line AA and line BB in FIG. 1A.
  • the heat dissipation substrate 10 of the first embodiment has a base 11 containing a carbon material and pipe mounting portions 15a to 15c located on the base 11.
  • the heat dissipation substrate 10 may be a substrate that exerts a heat dissipation effect by quickly transmitting heat received from an external heat source to the pipe mounting portions 15a to 15c.
  • the base 11 may be a block piece mainly composed of graphite.
  • the main component may mean a volume ratio of 80% or more.
  • the base 11 may be a block piece in which the crystal orientation of graphite is aligned.
  • the base 11 may be configured by joining a plurality of the above-mentioned block pieces.
  • the graphite may be pyrolytic graphite.
  • the above-mentioned graphite may be highly oriented graphite that has a thermal conductivity equivalent to that of copper or aluminum, or a thermal conductivity higher than that of copper or aluminum, and has anisotropic thermal conductivity.
  • the base 11 being a block piece of graphite makes it easier to process a three-dimensional structure such as the pipe mounting parts 15a to 15c, compared to sheet-like graphite. Furthermore, the base 11 can support a pipe body (for example, a pipe body mounted on the pipe mounting parts 15a to 15c). Furthermore, the base 11 being a block piece of graphite makes it easier to fix the base 11 in a state in which pressure is applied from the base 11 to the heat source.
  • the thermal conductivity can be measured by a laser flash method. In the case where graphite has anisotropy in thermal conductivity, "having a thermal conductivity equivalent to or higher than that of copper or aluminum" means having a thermal conductivity equivalent to or higher than that of copper or aluminum in at least one direction.
  • Having a thermal conductivity equivalent to or higher than that of copper or aluminum means, for example, that the thermal conductivity is 200 W/m ⁇ K or more, more preferably 370 W/m ⁇ K or more, and even more preferably 450 W/m ⁇ K or more.
  • the graphite used in this embodiment may have a thermal conductivity of 800 W/m ⁇ K or more in one direction.
  • the heat dissipation substrate 10 may further include a cover member 20 located on the outer surface of the base 11.
  • the base 11 may include, as its outer surface, a first surface 11a, a second surface 11b located on the opposite side of the first surface 11a, and multiple side surfaces smaller than the first surface 11a and the second surface 11b.
  • the cover member 20 may be located on multiple outer surfaces of the base 11 (i.e., the first surface 11a, the second surface 11b, and the multiple side surfaces) excluding the pipe mounting portions 15a to 15c.
  • the thermal conductivity of the base 11 may be higher than that of the cover member 20. This configuration provides high thermal diffusivity in the base 11, improving the heat dissipation properties of the heat dissipation substrate 10. If the thermal conductivity of the base 11 is anisotropic, the thermal conductivity of the base 11 in at least the Z direction described below may be higher than the thermal conductivity of the cover member 20. This configuration improves the thermal conductivity in the direction from the second surface 11b of the heat dissipation substrate 10 toward the pipe mounting portions 15a-15c, improving the heat dissipation properties of the heat dissipation substrate 10.
  • the cover member 20 may be made of metal. This configuration can improve the thermal conductivity of the cover member 20, and reduce the reduction in the heat dissipation properties of the heat dissipation substrate 10 caused by the cover member 20.
  • the cover member 20 may include metal plating. The metal plating allows the cover member 20 to cover the fine details of the base 11, and reduces the release of fragments of the outer surface of the damaged base 11 to the outside. This makes it unnecessary to increase the hardness of the base 11, and increases the freedom of the material to be used.
  • the thermal conductivity of the cover member 20 may be 90 W/m ⁇ K or more. If the thermal conductivity of the cover member 20 is 90 W/m ⁇ K or more, the reduction in the heat dissipation properties of the heat dissipation substrate 10 caused by the cover member 20 can be further reduced.
  • the cover member 20 may include a first plate 21 located on the first surface 11a of the base 11, a second plate 22 located on the second surface 11b of the base 11, and a metal plating 23 located on the outer peripheral surface of the combined structure of the base 11, the first plate 21, and the second plate 22.
  • the first plate 21 and the second plate 22 provide high strength to the upper and lower surfaces of the heat dissipation substrate 10, making it easy to fix the heat dissipation substrate 10 by pressing the upper or lower surface against the heat source. This fixation improves the thermal conductivity from the heat source to the heat dissipation substrate 10. Furthermore, by holding the heat dissipation substrate 10 via the upper and lower surfaces with high strength, the heat dissipation substrate 10 can be easily handled.
  • the metal plating 23 is located on the outside of the first plate 21 and the second plate 22, the metal plating 23 is continuous on the outer peripheral surface of the heat dissipation substrate 10, and the peripheral end portion of the metal plating 23 is less likely to appear on the outer peripheral surface, which reduces peeling of the metal plating 23.
  • the hardness of the cover member 20 may be higher than the hardness of the base 11. With this configuration, even if an external force is applied to the cover member 20, the force is dispersed and acts on the base 11. Therefore, it is possible to reduce damage to the base 11 inside the cover member 20.
  • the hardness may be Vickers hardness.
  • the hardness of the cover member 20 may be preferably 10 times or more, more preferably 20 times or more, that of the base 11.
  • the hardness of the cover member 20 may be preferably Vickers hardness 200 MPa or more, more preferably Vickers hardness 500 MPa, and even more preferably Vickers hardness 900 MPa or more.
  • the hardness of the base 11 may be Vickers hardness 10 MPa or more and 40 MPa or less.
  • the Vickers hardness can be measured using the measurement method specified in JIS (Japanese Industrial Standards) _Z_2244:2009.
  • the first plate 21 and the second plate 22 may be mainly composed of copper or aluminum. Copper or aluminum can be used as the material for the first plate 21 and the second plate 22. Copper has a high thermal conductivity of about 370 W/m ⁇ K and has good workability, making it easy to process the cover member 20. Aluminum has a high thermal conductivity of about 200 W/m ⁇ K and is lighter than copper, making it possible to reduce the weight of the cover member 20.
  • the metal plating 23 may be made of various metals such as nickel, gold, and silver. The metal plating 23 may be a single layer or multiple layers. When the metal plating 23 is made of multiple layers, it may be, for example, two layers of gold and nickel. When the metal plating 23 contains gold and nickel, it may contain an alloy of gold and nickel.
  • the first plate 21 and the second plate 22 may be joined to the base 11 via a joining material such as solder or a thermally conductive resin.
  • a joining material such as solder or a thermally conductive resin.
  • the pipe mounting portions 15a to 15c may be configured to be capable of mounting a pipe body included in a heat pipe.
  • the heat dissipation substrate 10 may have multiple pipe mounting portions 15a to 15c, or may have one pipe mounting portion.
  • the cross-sectional shape of the pipe mounting portions 15a to 15c may be circular, elliptical, rectangular, polygonal, or a combination of these.
  • the cross section may be a vertical cross section (see FIG. 2A) perpendicular to the direction in which the pipe mounting portions 15a to 15c extend.
  • the number of the multiple pipe mounting portions 15a to 15c is three, but is not limited to this.
  • the number of the multiple pipe mounting portions 15a to 15c may be two, or four or more.
  • the number of the multiple pipe mounting portions 15a to 15c is three or more.
  • heat can be dispersed to each of the pipe mounting parts 15a-15c compared to when there are two or fewer pipe mounting parts, so heat from the base 11 can be transferred more efficiently to the pipes mounted on the pipe mounting parts 15a-15c.
  • the pipe mounting portions 15a to 15c may be located across the base 11 and the cover member 20. By having parts of the pipe mounting portions 15a to 15c located on the base 11, the thermal resistance from the base 11 to the pipe body can be reduced, and heat can be efficiently sent to the pipe body. This improves the heat dissipation performance of the heat dissipation substrate 10. Furthermore, by having parts of the pipe mounting portions 15a to 15c located on the cover member 20, the holding strength of the pipe body mounted on the pipe mounting portions 15a to 15c can be improved. In the first embodiment, the pipe mounting portions 15a to 15c penetrate the metal plating 23, and parts of the pipe mounting portions 15a to 15c are located on the metal plating 23.
  • Each of the pipe mounting parts 15a to 15c may be a through hole.
  • the pipe mounting parts 15a to 15c, which are through holes, may be located between the first surface 11a and the second surface 11b of the base 11 along the first surface 11a of the base 11.
  • the pipe mounting parts 15a to 15c may penetrate the metal plating 23 on the side surface of the heat dissipation substrate 10.
  • the inner surface of the pipe mounting parts 15a to 15c is not covered by the cover member 20 (e.g., the metal plating 23), and the base 11 may be located on the inner surface of the pipe mounting parts 15a to 15c when the pipe body is not mounted.
  • the base 11 which has a high thermal conductivity, is close to the pipe body, and heat can be efficiently sent from the heat dissipation substrate 10 to the pipe body. Furthermore, by covering the inner surfaces of the pipe mounting parts 15a to 15c, the pipe body protects the surface parts of the base 11 exposed on the inner surfaces of the pipe mounting parts 15a to 15c, reducing damage to the surface parts of the base 11.
  • the base 11 may have anisotropy of thermal conductivity.
  • the anisotropy may be a property in which the thermal conductivity in one of three mutually orthogonal directions is higher than the thermal conductivity in the other direction.
  • the thermal conductivity in one of the three mutually orthogonal directions may be 100 times or more higher than the thermal conductivity in the other direction.
  • the direction of heat conduction can be controlled, so that heat management becomes easier.
  • the anisotropy may be a property in which the thermal conductivity in two of the three mutually orthogonal directions is higher than the thermal conductivity in the other direction of the three mutually orthogonal directions.
  • the thermal conductivity in two of the three mutually orthogonal directions may be 100 times or more higher than the thermal conductivity in the other direction. In this case, heat management becomes easier.
  • the above three directions do not have to be orthogonal to each other, and it is sufficient that the remaining direction intersects with a plane along the two directions.
  • the direction in which the multiple pipe mounting parts 15a to 15c are lined up is called the X direction
  • the direction in which each of the multiple pipe mounting parts 15a to 15c extends is called the Y direction
  • the plane extending in the X and Y directions is called the XY plane
  • the direction intersecting (e.g. perpendicular to) the XY plane is called the Z direction.
  • the thermal conductivity of the base 11 in the Z direction may be higher than the thermal conductivity in at least one direction along the XY plane of the base 11.
  • the direction of heat conduction can be more strongly controlled to the Z direction from the heat source toward the pipe mounting parts 15a to 15c. Furthermore, it is preferable that the thermal conductivity of the base 11 in the Z direction is higher than the thermal conductivity of the base 11 in the Y direction. In this case, the path that heat takes from the heat source to the pipe body can be made shorter than when the thermal conductivity in the Z direction is equal to or less than that in the Y direction. This allows the heat dissipation substrate 10 to dissipate heat more efficiently.
  • the thermal conductivity of the base 11 in the X direction may be higher than the thermal conductivity of the base 11 in the Y direction.
  • the thermal conductivity of the base 11 in the X direction is 100 times or more higher than the thermal conductivity of the base 11 in the Y direction, the heat can be more efficiently dispersed and sent to the multiple pipe mounting parts 15a to 15c lined up in the X direction.
  • Fig. 3A is a cross-sectional view showing a heat dissipation substrate according to embodiment 2.
  • Fig. 3B is a cross-sectional view showing a heat dissipation substrate according to embodiment 3.
  • the heat dissipation substrates 10A and 10B according to embodiments 2 and 3 differ mainly in the Z-direction positions of the pipe mounting portions 15a to 15c, which are through holes, and other components may be similar to those of embodiment 1.
  • the pipe mounting parts 15a to 15c which are through holes, may be positioned offset from the center in the Z direction of the base 11.
  • the distance L1 from the pipe mounting part 15b to the first surface 11a and the distance L2 from the pipe mounting part 15b to the second surface 11b may be different.
  • the distance means the length between the closest points. According to this configuration, by bringing the surface with the shorter distance (the second surface 11b in FIGS.
  • the thermal resistance from the heat source to the pipe mounting part 15b can be reduced, and heat can be efficiently sent to the pipe body. Therefore, the heat dissipation performance of the heat dissipation substrate 10 can be further improved.
  • the height of the heat dissipation substrate 10 can be secured by making the distance L1 to the opposite surface (the first surface 11a in FIGS. 3A and 3B) longer. By ensuring the height of the heat dissipation substrate 10, the strength of the heat dissipation substrate 10 can be improved.
  • the relationship between the distances L1 and L2 may be a relationship that holds true in any longitudinal section in the Y direction, or a relationship that holds true in a partial range of longitudinal sections in the Y direction.
  • the longitudinal section refers to a section perpendicular to the Y direction. The more locations where the relationship between the distances L1 and L2 holds true, the greater the range over which the effect of the distances L1 and L2 described above can be obtained.
  • the relationship between the distances L1 and L2 may be established for only one pipe mounting portion 15b, or may be established for any or all of the multiple pipe mounting portions 15a-15c.
  • the base 11 in the second and third embodiments may have a configuration having two layers of block pieces 111, 112.
  • the layer means a layer extending in a direction along the XY plane.
  • a bonding material 118 may be located between the two layers of block pieces 111, 112.
  • the bonding material 118 may be solder, a thermally conductive adhesive, a thermally conductive filler (such as grease), or the like. With this configuration, the height of the base 11 can be easily ensured.
  • the thicknesses T1 and T2 of the two layers of block pieces 111 and 112 may be the same as each other as shown in FIG. 3A, or may be different as shown in FIG. 3B. In either case, the relationship between the distances L1 and L2 described above can be realized.
  • the thicknesses T1 and T2 of the block pieces 111 and 112 may be greater than half the dimension T15 in the Z direction of the pipe mounting parts 15a to 15c.
  • the boundary surface where the bonding material 118 is located may be located at a position halfway in the Z direction of the pipe mounting parts 15a to 15c, or closer to the first surface 11a than that position.
  • the bonding material 118 Since the bonding material 118 has a lower thermal conductivity than the block pieces 111 and 112 alone, heat retention occurs at the bonding material 118 when heat is conducted in the Z direction of the base 11. Therefore, with the above configuration, more heat is absorbed by the pipe body before heat retention occurs, and the heat dissipation performance of the heat dissipation board 10 can be further improved.
  • the thermal conductivity in the Z direction may be higher than the thermal conductivity in at least one direction along the XY plane in each of the block pieces 111, 112. Furthermore, the thermal conductivity in the X direction may be higher than the thermal conductivity in the Y direction. With this configuration, the effect of the anisotropy of thermal conductivity described in embodiment 1 is similarly achieved.
  • FIG. 4A and Fig. 4B are an exploded perspective view and a perspective view showing a heat dissipation substrate according to embodiment 4.
  • Fig. 5A and Fig. 5B are a cross-sectional view taken along line AA in Fig. 4A and a cross-sectional view taken along line BB in Fig. 4A.
  • the heat dissipation substrate 10C of the fourth embodiment differs mainly in the configuration of the pipe mounting portions 16a to 16c.
  • the components having the same reference numerals as those of the first embodiment may be the same as those of the heat dissipation substrate 10 of the first embodiment unless otherwise specified.
  • the heat dissipation substrate 10C may have pipe mounting portions 16a-16c that are grooves.
  • the cross-sectional shape of the pipe mounting portions 16a-16c may be a circular arc, an oval arc, a rectangular shape, a polygonal shape including a V-shape, or the like.
  • the above cross section may refer to a vertical cross section perpendicular to the direction in which the pipe mounting portions 16a-16c extend.
  • the pipe mounting portions 16a to 16c may be located on the first surface 11a side of the base 11. With this arrangement, the second surface 11b side can be made flat with the pipe body mounted on the pipe mounting portions 16a to 16c, making it easier to bring the heat source closer to the second surface 11b side. This shortens the distance between the heat source and the pipe mounting portions 16a to 16c, and reduces the thermal resistance from the heat source to the pipe mounting portions 16a to 16c.
  • the pipe mounting portions 16a to 16c may be located across the base 11 and the cover member 20. That is, as shown in FIG. 5A, in a vertical section perpendicular to the direction in which the pipe mounting portions 16a to 16c extend, the cover member 20 located on the surface may be divided by the pipe mounting portions 16a to 16c (e.g., grooves).
  • the base 11 located below the cover member 20 may be located (e.g., exposed) at the bottom of the pipe mounting portions 16a to 16c (e.g., the bottom of the grooves).
  • the base 11 By positioning the base 11 on at least a portion of the inner surface of the pipe mounting portions 16a to 16c, the base 11, which has a high thermal conductivity, can be brought into close proximity with the pipe body, and heat can be efficiently transferred from the base 11 to the pipe body. This improves the heat dissipation properties of the heat dissipation substrate 10C.
  • the direction in which the multiple pipe mounting portions 16a to 16c are lined up is called the X direction
  • the direction in which each of the multiple pipe mounting portions 16a to 16c extends is called the Y direction
  • the plane extending in the X and Y directions is called the XY plane
  • the direction intersecting (e.g. perpendicular to) the XY plane is called the Z direction.
  • the thermal conductivity of the base 11 in the Z direction may be higher than the thermal conductivity of the base 11 in at least one direction along the XY plane.
  • the thermal conductivity of the base 11 in the X direction may be higher than the thermal conductivity of the base 11 in the Y direction.
  • the pipe mounting portions 16a to 16c that are grooves may be located from one end to the other end of the heat dissipation substrate 10C in the Y direction.
  • the pipe mounting portions 16a to 16c that are grooves may be located only in a partial range in the Y direction.
  • the pipe mounting portions 16a to 16c that are grooves may be located only in the central region in the Y direction, and the pipe body may be mounted so that it is in contact with the upper surface of the heat dissipation substrate 10C at one end and the other end in the Y direction or separated upward.
  • the pipe mounting portions 16a to 16c that are grooves and the pipe mounting portions 16a to 16c that are through holes may be connected in the Y direction, and the pipe body may be mounted on the grooves and across the through holes.
  • the upper side does not have to match the up-down relationship in the actual usage state.
  • the upper side is, for example, the direction from the second surface 11b to the first surface 11a of the heat dissipation substrate 10C in the Z direction.
  • the pipe bodies 61a to 61c may be joined to the pipe mounting portions 16a to 16c via a joining material such as solder or a thermally conductive adhesive, or may be positioned via a thermally conductive filler (such as grease).
  • a joining material such as solder or a thermally conductive adhesive
  • a thermally conductive filler such as grease
  • the heat dissipation substrate 10C may include a metal plate 30 (see FIG. 4A) that covers at least a portion of the pipe mounting portions 16a to 16c from above.
  • the metal plate 30 holds the pipes 61a to 61c mounted on the pipe mounting portions 16a to 16c by sandwiching them from above.
  • the metal plate 30 may have the function of receiving heat from the cover member 20 and sending it to the pipes 61a to 61c by being close to the upper portions of the pipes 61a to 61c of the heat dissipation substrate 10C.
  • the material of the metal plate 30 may be mainly copper, aluminum, etc. Copper has a high thermal conductivity of about 370 W/m ⁇ K and has good workability, making it easy to process the cover member 20. Aluminum also has a high thermal conductivity of about 200 W/m ⁇ K and is lighter than copper, making it possible to reduce the weight of the cover member 20.
  • the metal plate 30 may have a main body portion 31 located above the pipe mounting portions 16a to 16c, and a flange portion 32 connected to the peripheral portion of the main body portion 31.
  • the flange portion 32 may be joined to the cover member 20 to fix the metal plate 30.
  • a thermally conductive filler (e.g., grease, etc.) 44 (see FIG. 7) may be located between the main body portion 31 of the metal plate 30 and the pipe bodies 61a to 61c. This configuration simplifies the process of mounting the pipe bodies 61a to 61c and the process of fixing the metal plate 30.
  • FIG. 5 is a cross-sectional view showing a heat dissipation substrate according to embodiment 5.
  • a heat dissipation substrate 10D of embodiment 5 may be similar to embodiment 4 except for the fixing structure of the metal plate 30.
  • the flange portion 32 may be joined to the cover member 20 on the first surface 11a side via a bonding material 41 such as solder or a thermally conductive adhesive.
  • a bonding material 41 such as solder or a thermally conductive adhesive.
  • FIG. 6B is a cross-sectional view showing a heat dissipation substrate according to embodiment 6.
  • a heat dissipation substrate 10E of embodiment 6 may be similar to embodiment 4 except that the fixing structure of the metal plate 30 is different.
  • the flange portion 32 may be configured to be screwed to the combined structure of the base 11 and the cover member 20. That is, the combined structure of the base 11 and the cover member 20 may have a screw hole 18 at a portion overlapping with the flange portion 32, and the flange portion 32 may have a screw hole 33 at a corresponding position.
  • the screw hole 18 may have a female thread at the position of the second plate 22 or the position of the first plate 21.
  • the screw hole 18 may penetrate the base 11 and the cover member 20 from the first surface 11a side to the second surface 11b side.
  • Fig. 7 is an enlarged cross-sectional view showing a heat dissipation substrate of embodiment 7.
  • the heat dissipation substrate 10F of embodiment 7 may be the same as those of embodiments 4 to 6, except that the positions of the pipe mounting portions 16a to 16c, which are grooves, in the Z direction (i.e., the depth direction) are different.
  • Fig. 7 shows an example in which the joining structure of the metal plate 30 of embodiment 5 is adopted, but the joining structure of embodiment 6 may also be adopted.
  • Pipe bodies 61a to 61c are mounted on the pipe mounting portions 16a to 16c.
  • the length of the facing portion 63 between the pipe bodies 61a to 61c and the base 11 and the cover member 20 may be greater than the length of the facing portion 62 between the pipe bodies 61a to 61c and the metal plate 30.
  • the facing portions 62 and 63 are indicated by thick dashed lines and thick solid lines.
  • the above-mentioned longitudinal section refers to a section where the pipe mounting portions 16a to 16c are covered by the metal plate 30, and is perpendicular to the direction in which the pipe mounting portions 16a to 16c extend.
  • the path that transfers heat from the heat source to the pipe bodies 61a to 61c via the base 11 and the cover member 20 has a smaller thermal resistance than the path that transfers heat via the metal plate 30 in between. Therefore, the size relationship between the opposing portions 62 and 63 reduces the overall thermal resistance from the heat source to the pipes 61a to 61c, and heat can be efficiently transferred to the pipes 61a to 61c. This further improves the heat dissipation properties of the heat dissipation board 10F.
  • the size relationship between the opposing portions 62, 63 may be a relationship that holds from one end to the other end of the metal plate 30 in the Y direction, or may hold only in a certain range. The more locations where the size relationship between the opposing portions 62, 63 holds, the greater the range over which the above-mentioned effect can be obtained.
  • FIG. 8 is a cross-sectional view and a partially enlarged view showing a heat dissipation substrate of embodiment 8.
  • the heat dissipation substrate 10G of embodiment 8 may be the same as those of embodiments 4 to 7, except that the positions of the pipe mounting portions 16a to 16c, which are grooves, in the Z direction (i.e., the depth direction) are different.
  • the metal plate 30 is omitted in FIG. 8, the configuration and fixing structure of the metal plate 30 may be the same as those of embodiments 4 to 7.
  • the length of the facing portion 66 between the pipes 61a-61c and the base 11 may be greater than the length of the facing portion 65 between the pipes 61a-61c and the cover member 20.
  • the facing portions 65, 66 are indicated by thick dashed and solid lines.
  • the above-mentioned longitudinal section refers to a section where the pipe mounting portions 16a-16c are covered by the metal plate 30, and is perpendicular to the direction in which the pipe mounting portions 16a-16c extend.
  • the thermal conductivity of the base 11 is higher than that of the cover member 20, when a heat source is close to the second surface 11b side, the thermal conduction path from the heat source to the pipes 61a-61c via the facing portion 66 has a lower thermal resistance than the thermal conduction path via the cover member 20 and the facing portion 65. Therefore, the size relationship between the opposing portions 65, 66 reduces the overall thermal resistance from the heat source to the pipe body, and the heat dissipation properties of the heat dissipation substrate 10G can be further improved.
  • the size relationship between the opposing portions 65, 66 may be a relationship that holds true in any longitudinal cross section from one end to the other end of the base 11 in the Y direction, or may be a relationship that holds true at at least one location between the one end and the other end. The more locations where the size relationship between the opposing portions 65, 66 holds true, the greater the range over which the aforementioned effect can be obtained.
  • FIG. 9A is a side view of a heat dissipation device according to the first embodiment of the present disclosure.
  • Fig. 9B is a side view of a heat dissipation device according to the second embodiment of the present disclosure.
  • Figs. 9A and 9B show a state in which a heat dissipation device 100, 100A is attached to a heat-generating electronic device (e.g., a central processing unit (CPU)) 200.
  • a heat-generating electronic device e.g., a central processing unit (CPU)
  • the heat dissipation device 100 of the first embodiment includes the heat dissipation substrate 10 of the first embodiment described above and a heat pipe 60.
  • the heat pipe 60 has pipe bodies 61a to 61c, which are mounted on the pipe mounting portions 15a to 15c.
  • the heat dissipation substrate 10 may be replaced by the heat dissipation substrates 10A and 10B of the second and third embodiments.
  • the heat dissipation device 100A of the second embodiment includes the heat dissipation substrate 10C of the fourth embodiment described above and a heat pipe 60.
  • the heat pipe 60 has pipe bodies 61a to 61c, which are mounted on the pipe mounting portions 16a to 16c and are partially covered by the metal plate 30.
  • the heat dissipation substrate 10C may be replaced with the heat dissipation substrates 10D to 10G of the fifth to eighth embodiments.
  • the heat dissipation device 100, 100A may further include a heat sink thermally connected to the heat pipe 60, and/or a cooling mechanism (e.g., a cooling fan, a coolant circuit, etc.).
  • a cooling mechanism e.g., a cooling fan, a coolant circuit, etc.
  • the outer surface of the base 11 of the heat dissipation board 10, 10C may be covered by the cover member 20, and the inner surfaces of the pipe mounting portions 15a-15c, 16a-16c may be covered by the pipe bodies 61a-61c.
  • the outer surface of the base 11 is not exposed to the outside. Therefore, even if a material that has high thermal conductivity but does not necessarily require improved hardness of the outer surface is used as the base 11, the outer surface of the base 11 can be protected and damage to the base 11 can be reduced.
  • the pipe bodies 61a to 61c may be made of metal.
  • a thermally conductive filler 51 may be filled between the outer circumferential surfaces of the pipe bodies 61a to 61c and the inner surfaces of the pipe mounting portions 15a to 15c and 16a to 16c.
  • a hardening material i.e., a bonding material
  • solder or a thermally conductive resin adhesive may be used, or a non-hardening material such as a thermally conductive grease may be used.
  • the electronic device 200 may have a semiconductor element 210 and a heat spreader 222. Furthermore, the heat spreader 222 may function as a package that houses the semiconductor element 210. The heat spreader 222 may be in surface contact with the semiconductor element 210 via thermally conductive grease 55 or the like.
  • the heat dissipation device 100, 100A may be mounted so that the second surface 11b side of the heat dissipation substrate 10 is in surface contact with the heat spreader 222 via thermally conductive grease 53.
  • the heat dissipation device 100, 100A configured as described above receives heat from the heat-generating electronic device 200 via the heat dissipation substrate 10, 10C, and the heat is efficiently transferred to the heat pipe 60 in the heat dissipation substrate 10, 10C, and the heat is then released to the outside via the heat pipe 60. Therefore, high heat dissipation performance can be achieved in response to the electronic device 200 that generates a large amount of heat.
  • the heat dissipation substrate and heat dissipation device of the present disclosure are not limited to the above embodiments.
  • the first and second metal plates 21 and 22 and the metal plating 23 are shown as the cover member 20, but the first and second plates 21 and 22 may be omitted and the metal plating may be used as the cover member.
  • a film-like or plate-like resin may be used as the cover member.
  • Other details shown in the embodiments can be modified as appropriate.
  • the heat dissipation substrate is A substrate including a carbon material; a cover member located on an outer surface of the base; a pipe mounting portion which is a groove or a through hole located across the base and the cover member; Equipped with.
  • the heat dissipation substrate of (1) above is The cover member has a hardness greater than that of the base body.
  • the direction in which the plurality of pipe mounting parts are arranged is called the X direction
  • the direction in which each of the plurality of pipe mounting parts extends is called the Y direction
  • a plane extending in the X direction and the Y direction is called the XY plane
  • a direction intersecting the XY plane is called the Z direction
  • the thermal conductivity of the base in the Z direction is higher than the thermal conductivity of the cover member.
  • the cover member is made of metal.
  • the heat dissipation substrate of (4) above is The cover member includes a metal plating.
  • the substrate has a first surface and a second surface opposite to the first surface
  • the cover member includes a first plate located on the first surface, a second plate located on the second surface, and a metal plating located on the outer peripheral surface of the combined structure of the base and the first and second plates.
  • the heat dissipation substrate of (6) above, the pipe mounting portion is a through hole extending along the first surface between the first surface and the second surface, The vias extend through the metal plating.
  • the heat dissipation substrate of (7) above, A distance from the pipe mounting portion to the first surface is different from a distance from the pipe mounting portion to the second surface.
  • the heat dissipation substrate (6) is the pipe mounting portion is a groove located on the first surface side of the base, In a vertical cross section intersecting the direction in which the groove extends, the groove divides the first plate, and the base is located at the bottom of the groove.
  • the heat dissipation substrate of (9) above, The nozzle further includes a metal plate that covers at least a portion of the pipe mounting portion from above the groove.
  • the cover member has screw holes into which the metal plate can be screwed.
  • the heat dissipation device comprises: The heat dissipation substrate according to (10) or (11), a heat pipe including a pipe body mounted on the pipe mounting portion; Equipped with In a vertical cross section of the area where the pipe mounting portion is covered by the metal plate, a length of an opposing portion between the pipe body and the base and the cover member is greater than a length of an opposing portion between the metal plate and the pipe body; Heat dissipation device. (13) The heat dissipation device according to (12) above, In the vertical cross section, the length of the opposing portion between the pipe body and the base body is greater than the length of the opposing portion between the pipe body and the cover member.
  • the heat dissipation device according to (12) or (13) above The pipe body is made of metal, and a thermally conductive filler is located between the pipe body and the heat dissipation substrate. (15) Any one of the heat dissipation devices according to (12) to (14) above, The outer surface of the base body is covered by the cover member and the pipe body.
  • This disclosure can be used in heat dissipation substrates and heat dissipation devices.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PCT/JP2023/036982 2022-10-17 2023-10-12 放熱基板及び放熱装置 Ceased WO2024085051A1 (ja)

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Citations (8)

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Publication number Priority date Publication date Assignee Title
JPS5748699U (https=) * 1980-09-05 1982-03-18
WO2004097936A1 (en) * 2003-05-01 2004-11-11 Queen Mary & Westfield College A cellular thermal management device and method of making such a device
US20060113064A1 (en) * 2004-12-01 2006-06-01 Intel Corporation Heat pipe remote heat exchanger (RHE) with graphite block
JP2008547216A (ja) * 2005-06-23 2008-12-25 テレフオンアクチーボラゲット エル エム エリクソン（パブル） 冷却構体
US20140038362A1 (en) * 2004-11-12 2014-02-06 International Business Machines Corporation Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive
JP2016540371A (ja) * 2013-10-04 2016-12-22 スペシャルティ ミネラルズ （ミシガン） インコーポレーテツド 熱を放散する装置
JP2022003656A (ja) * 2018-09-20 2022-01-11 株式会社カネカ 半導体パッケージ
JP2022117959A (ja) * 2021-02-01 2022-08-12 株式会社サーモグラフィティクス グラファイト構造体、冷却装置、グラファイト構造体の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748699U (https=) * 1980-09-05 1982-03-18
WO2004097936A1 (en) * 2003-05-01 2004-11-11 Queen Mary & Westfield College A cellular thermal management device and method of making such a device
US20140038362A1 (en) * 2004-11-12 2014-02-06 International Business Machines Corporation Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive
US20060113064A1 (en) * 2004-12-01 2006-06-01 Intel Corporation Heat pipe remote heat exchanger (RHE) with graphite block
JP2008547216A (ja) * 2005-06-23 2008-12-25 テレフオンアクチーボラゲット エル エム エリクソン（パブル） 冷却構体
JP2016540371A (ja) * 2013-10-04 2016-12-22 スペシャルティ ミネラルズ （ミシガン） インコーポレーテツド 熱を放散する装置
JP2022003656A (ja) * 2018-09-20 2022-01-11 株式会社カネカ 半導体パッケージ
JP2022117959A (ja) * 2021-02-01 2022-08-12 株式会社サーモグラフィティクス グラファイト構造体、冷却装置、グラファイト構造体の製造方法

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