JPWO2024048271A5 - - Google Patents
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- Publication number
- JPWO2024048271A5 JPWO2024048271A5 JP2023571859A JP2023571859A JPWO2024048271A5 JP WO2024048271 A5 JPWO2024048271 A5 JP WO2024048271A5 JP 2023571859 A JP2023571859 A JP 2023571859A JP 2023571859 A JP2023571859 A JP 2023571859A JP WO2024048271 A5 JPWO2024048271 A5 JP WO2024048271A5
- Authority
- JP
- Japan
- Prior art keywords
- chemical mechanical
- mechanical polishing
- polishing composition
- component
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 24
- 239000000126 substance Substances 0.000 claims 21
- 125000000524 functional group Chemical group 0.000 claims 3
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical group C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims 2
- 239000006061 abrasive grain Substances 0.000 claims 2
- 150000001768 cations Chemical class 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- -1 nitrogen-containing heterocyclic compound Chemical class 0.000 claims 2
- 239000007800 oxidant agent Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 150000001450 anions Chemical class 0.000 claims 1
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022139064 | 2022-09-01 | ||
| JP2022139064 | 2022-09-01 | ||
| PCT/JP2023/029521 WO2024048271A1 (ja) | 2022-09-01 | 2023-08-15 | 化学機械研磨用組成物及び研磨方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024048271A1 JPWO2024048271A1 (https=) | 2024-03-07 |
| JP7468811B1 JP7468811B1 (ja) | 2024-04-16 |
| JPWO2024048271A5 true JPWO2024048271A5 (https=) | 2024-08-06 |
Family
ID=90099429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023571859A Active JP7468811B1 (ja) | 2022-09-01 | 2023-08-15 | 化学機械研磨用組成物及び研磨方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250346784A1 (https=) |
| JP (1) | JP7468811B1 (https=) |
| CN (1) | CN119343748A (https=) |
| TW (1) | TWI859998B (https=) |
| WO (1) | WO2024048271A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7097541B2 (en) * | 2002-01-22 | 2006-08-29 | Cabot Microelectronics Corporation | CMP method for noble metals |
| JP2008300858A (ja) * | 2008-07-15 | 2008-12-11 | Fujifilm Corp | 金属用研磨液及び研磨方法 |
| JP5760317B2 (ja) * | 2010-02-05 | 2015-08-05 | 日立化成株式会社 | Ｃｍｐ研磨液及びこのｃｍｐ研磨液を用いた研磨方法 |
| JP6029916B2 (ja) * | 2012-09-28 | 2016-11-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JPWO2014175393A1 (ja) * | 2013-04-25 | 2017-02-23 | 日立化成株式会社 | Ｃｍｐ用研磨液及びこれを用いた研磨方法 |
| WO2020255616A1 (ja) * | 2019-06-20 | 2020-12-24 | 富士フイルム株式会社 | 研磨液、及び、化学的機械的研磨方法 |
| TW202132527A (zh) * | 2019-12-12 | 2021-09-01 | 日商Ｊｓｒ股份有限公司 | 化學機械研磨用組成物及研磨方法 |
-
2023
- 2023-07-25 TW TW112127660A patent/TWI859998B/zh active
- 2023-08-15 WO PCT/JP2023/029521 patent/WO2024048271A1/ja not_active Ceased
- 2023-08-15 JP JP2023571859A patent/JP7468811B1/ja active Active
- 2023-08-15 CN CN202380044924.9A patent/CN119343748A/zh active Pending
- 2023-08-15 US US18/870,440 patent/US20250346784A1/en active Pending
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