JPWO2024048271A5 - - Google Patents

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JPWO2024048271A5
JPWO2024048271A5 JP2023571859A JP2023571859A JPWO2024048271A5 JP WO2024048271 A5 JPWO2024048271 A5 JP WO2024048271A5 JP 2023571859 A JP2023571859 A JP 2023571859A JP 2023571859 A JP2023571859 A JP 2023571859A JP WO2024048271 A5 JPWO2024048271 A5 JP WO2024048271A5
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Japan
Prior art keywords
chemical mechanical
mechanical polishing
polishing composition
component
mass
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JP2023571859A
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Japanese (ja)
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JPWO2024048271A1 (https=
JP7468811B1 (ja
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Priority claimed from PCT/JP2023/029521 external-priority patent/WO2024048271A1/ja
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JP2023571859A 2022-09-01 2023-08-15 化学機械研磨用組成物及び研磨方法 Active JP7468811B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022139064 2022-09-01
JP2022139064 2022-09-01
PCT/JP2023/029521 WO2024048271A1 (ja) 2022-09-01 2023-08-15 化学機械研磨用組成物及び研磨方法

Publications (3)

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JPWO2024048271A1 JPWO2024048271A1 (https=) 2024-03-07
JP7468811B1 JP7468811B1 (ja) 2024-04-16
JPWO2024048271A5 true JPWO2024048271A5 (https=) 2024-08-06

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JP2023571859A Active JP7468811B1 (ja) 2022-09-01 2023-08-15 化学機械研磨用組成物及び研磨方法

Country Status (5)

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US (1) US20250346784A1 (https=)
JP (1) JP7468811B1 (https=)
CN (1) CN119343748A (https=)
TW (1) TWI859998B (https=)
WO (1) WO2024048271A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7097541B2 (en) * 2002-01-22 2006-08-29 Cabot Microelectronics Corporation CMP method for noble metals
JP2008300858A (ja) * 2008-07-15 2008-12-11 Fujifilm Corp 金属用研磨液及び研磨方法
JP5760317B2 (ja) * 2010-02-05 2015-08-05 日立化成株式会社 Ｃｍｐ研磨液及びこのｃｍｐ研磨液を用いた研磨方法
JP6029916B2 (ja) * 2012-09-28 2016-11-24 株式会社フジミインコーポレーテッド 研磨用組成物
JPWO2014175393A1 (ja) * 2013-04-25 2017-02-23 日立化成株式会社 Ｃｍｐ用研磨液及びこれを用いた研磨方法
KR102764775B1 (ko) * 2019-06-20 2025-02-11 후지필름 가부시키가이샤 연마액, 및, 화학적 기계적 연마 방법
TW202132527A (zh) * 2019-12-12 2021-09-01 日商Ｊｓｒ股份有限公司 化學機械研磨用組成物及研磨方法

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