JPWO2024048271A1 - - Google Patents
Info
- Publication number
- JPWO2024048271A1 JPWO2024048271A1 JP2023571859A JP2023571859A JPWO2024048271A1 JP WO2024048271 A1 JPWO2024048271 A1 JP WO2024048271A1 JP 2023571859 A JP2023571859 A JP 2023571859A JP 2023571859 A JP2023571859 A JP 2023571859A JP WO2024048271 A1 JPWO2024048271 A1 JP WO2024048271A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P52/40—Chemomechanical polishing [CMP]
- H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022139064 | 2022-09-01 | ||
| JP2022139064 | 2022-09-01 | ||
| PCT/JP2023/029521 WO2024048271A1 (ja) | 2022-09-01 | 2023-08-15 | 化学機械研磨用組成物及び研磨方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024048271A1 true JPWO2024048271A1 (https=) | 2024-03-07 |
| JP7468811B1 JP7468811B1 (ja) | 2024-04-16 |
| JPWO2024048271A5 JPWO2024048271A5 (https=) | 2024-08-06 |
Family
ID=90099429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023571859A Active JP7468811B1 (ja) | 2022-09-01 | 2023-08-15 | 化学機械研磨用組成物及び研磨方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250346784A1 (https=) |
| JP (1) | JP7468811B1 (https=) |
| CN (1) | CN119343748A (https=) |
| TW (1) | TWI859998B (https=) |
| WO (1) | WO2024048271A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7097541B2 (en) * | 2002-01-22 | 2006-08-29 | Cabot Microelectronics Corporation | CMP method for noble metals |
| JP2008300858A (ja) * | 2008-07-15 | 2008-12-11 | Fujifilm Corp | 金属用研磨液及び研磨方法 |
| JP5760317B2 (ja) * | 2010-02-05 | 2015-08-05 | 日立化成株式会社 | Ｃｍｐ研磨液及びこのｃｍｐ研磨液を用いた研磨方法 |
| JP6029916B2 (ja) * | 2012-09-28 | 2016-11-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JPWO2014175393A1 (ja) * | 2013-04-25 | 2017-02-23 | 日立化成株式会社 | Ｃｍｐ用研磨液及びこれを用いた研磨方法 |
| WO2020255616A1 (ja) * | 2019-06-20 | 2020-12-24 | 富士フイルム株式会社 | 研磨液、及び、化学的機械的研磨方法 |
| TW202132527A (zh) * | 2019-12-12 | 2021-09-01 | 日商Ｊｓｒ股份有限公司 | 化學機械研磨用組成物及研磨方法 |
-
2023
- 2023-07-25 TW TW112127660A patent/TWI859998B/zh active
- 2023-08-15 WO PCT/JP2023/029521 patent/WO2024048271A1/ja not_active Ceased
- 2023-08-15 JP JP2023571859A patent/JP7468811B1/ja active Active
- 2023-08-15 CN CN202380044924.9A patent/CN119343748A/zh active Pending
- 2023-08-15 US US18/870,440 patent/US20250346784A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7468811B1 (ja) | 2024-04-16 |
| TW202412093A (zh) | 2024-03-16 |
| TWI859998B (zh) | 2024-10-21 |
| WO2024048271A1 (ja) | 2024-03-07 |
| US20250346784A1 (en) | 2025-11-13 |
| CN119343748A (zh) | 2025-01-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231120 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231120 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20231120 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240305 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240318 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7468811 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |