CN119343748A - 化学机械研磨用组合物及研磨方法 - Google Patents

化学机械研磨用组合物及研磨方法 Download PDF

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Publication number
CN119343748A
CN119343748A CN202380044924.9A CN202380044924A CN119343748A CN 119343748 A CN119343748 A CN 119343748A CN 202380044924 A CN202380044924 A CN 202380044924A CN 119343748 A CN119343748 A CN 119343748A
Authority
CN
China
Prior art keywords
chemical mechanical
mechanical polishing
polishing composition
component
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380044924.9A
Other languages
English (en)
Chinese (zh)
Inventor
山田裕也
高圣渊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jicc 02 Co ltd
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Publication of CN119343748A publication Critical patent/CN119343748A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN202380044924.9A 2022-09-01 2023-08-15 化学机械研磨用组合物及研磨方法 Pending CN119343748A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-139064 2022-09-01
JP2022139064 2022-09-01
PCT/JP2023/029521 WO2024048271A1 (ja) 2022-09-01 2023-08-15 化学機械研磨用組成物及び研磨方法

Publications (1)

Publication Number Publication Date
CN119343748A true CN119343748A (zh) 2025-01-21

Family

ID=90099429

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380044924.9A Pending CN119343748A (zh) 2022-09-01 2023-08-15 化学机械研磨用组合物及研磨方法

Country Status (5)

Country Link
US (1) US20250346784A1 (https=)
JP (1) JP7468811B1 (https=)
CN (1) CN119343748A (https=)
TW (1) TWI859998B (https=)
WO (1) WO2024048271A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7097541B2 (en) * 2002-01-22 2006-08-29 Cabot Microelectronics Corporation CMP method for noble metals
JP2008300858A (ja) * 2008-07-15 2008-12-11 Fujifilm Corp 金属用研磨液及び研磨方法
JP5760317B2 (ja) * 2010-02-05 2015-08-05 日立化成株式会社 Ｃｍｐ研磨液及びこのｃｍｐ研磨液を用いた研磨方法
JP6029916B2 (ja) * 2012-09-28 2016-11-24 株式会社フジミインコーポレーテッド 研磨用組成物
JPWO2014175393A1 (ja) * 2013-04-25 2017-02-23 日立化成株式会社 Ｃｍｐ用研磨液及びこれを用いた研磨方法
WO2020255616A1 (ja) * 2019-06-20 2020-12-24 富士フイルム株式会社 研磨液、及び、化学的機械的研磨方法
TW202132527A (zh) * 2019-12-12 2021-09-01 日商Ｊｓｒ股份有限公司 化學機械研磨用組成物及研磨方法

Also Published As

Publication number Publication date
JP7468811B1 (ja) 2024-04-16
TW202412093A (zh) 2024-03-16
TWI859998B (zh) 2024-10-21
WO2024048271A1 (ja) 2024-03-07
US20250346784A1 (en) 2025-11-13
JPWO2024048271A1 (https=) 2024-03-07

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Country or region after: Japan

Address after: Japan's Tokyo port east bridge yidingmu 9 No. 2

Applicant after: JSR Corp.

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Effective date of registration: 20250407

Address after: Japan's Tokyo port east bridge yidingmu 9 No. 2

Applicant after: JICC-02 Co.,Ltd.

Country or region after: Japan

Address before: Japan's Tokyo port east bridge yidingmu 9 No. 2

Applicant before: JSR Corp.

Country or region before: Japan

TA01 Transfer of patent application right