TWI859998B - 化學機械研磨用組成物及研磨方法 - Google Patents

化學機械研磨用組成物及研磨方法 Download PDF

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Publication number
TWI859998B
TWI859998B TW112127660A TW112127660A TWI859998B TW I859998 B TWI859998 B TW I859998B TW 112127660 A TW112127660 A TW 112127660A TW 112127660 A TW112127660 A TW 112127660A TW I859998 B TWI859998 B TW I859998B
Authority
TW
Taiwan
Prior art keywords
chemical mechanical
mechanical polishing
polishing composition
component
mass
Prior art date
Application number
TW112127660A
Other languages
English (en)
Chinese (zh)
Other versions
TW202412093A (zh
Inventor
山田裕也
高聖淵
Original Assignee
日商Ｊｓｒ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｊｓｒ股份有限公司 filed Critical 日商Ｊｓｒ股份有限公司
Publication of TW202412093A publication Critical patent/TW202412093A/zh
Application granted granted Critical
Publication of TWI859998B publication Critical patent/TWI859998B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW112127660A 2022-09-01 2023-07-25 化學機械研磨用組成物及研磨方法 TWI859998B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-139064 2022-09-01
JP2022139064 2022-09-01

Publications (2)

Publication Number Publication Date
TW202412093A TW202412093A (zh) 2024-03-16
TWI859998B true TWI859998B (zh) 2024-10-21

Family

ID=90099429

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112127660A TWI859998B (zh) 2022-09-01 2023-07-25 化學機械研磨用組成物及研磨方法

Country Status (5)

Country Link
US (1) US20250346784A1 (https=)
JP (1) JP7468811B1 (https=)
CN (1) CN119343748A (https=)
TW (1) TWI859998B (https=)
WO (1) WO2024048271A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202108733A (zh) * 2019-06-20 2021-03-01 日商富士軟片股份有限公司 研磨液及化學機械研磨方法
TW202132527A (zh) * 2019-12-12 2021-09-01 日商Ｊｓｒ股份有限公司 化學機械研磨用組成物及研磨方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7097541B2 (en) * 2002-01-22 2006-08-29 Cabot Microelectronics Corporation CMP method for noble metals
JP2008300858A (ja) * 2008-07-15 2008-12-11 Fujifilm Corp 金属用研磨液及び研磨方法
JP5760317B2 (ja) * 2010-02-05 2015-08-05 日立化成株式会社 Ｃｍｐ研磨液及びこのｃｍｐ研磨液を用いた研磨方法
JP6029916B2 (ja) * 2012-09-28 2016-11-24 株式会社フジミインコーポレーテッド 研磨用組成物
JPWO2014175393A1 (ja) * 2013-04-25 2017-02-23 日立化成株式会社 Ｃｍｐ用研磨液及びこれを用いた研磨方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202108733A (zh) * 2019-06-20 2021-03-01 日商富士軟片股份有限公司 研磨液及化學機械研磨方法
TW202132527A (zh) * 2019-12-12 2021-09-01 日商Ｊｓｒ股份有限公司 化學機械研磨用組成物及研磨方法

Also Published As

Publication number Publication date
JP7468811B1 (ja) 2024-04-16
TW202412093A (zh) 2024-03-16
WO2024048271A1 (ja) 2024-03-07
US20250346784A1 (en) 2025-11-13
JPWO2024048271A1 (https=) 2024-03-07
CN119343748A (zh) 2025-01-21

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