JPWO2024010003A5 - - Google Patents

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Publication number
JPWO2024010003A5
JPWO2024010003A5 JP2024532592A JP2024532592A JPWO2024010003A5 JP WO2024010003 A5 JPWO2024010003 A5 JP WO2024010003A5 JP 2024532592 A JP2024532592 A JP 2024532592A JP 2024532592 A JP2024532592 A JP 2024532592A JP WO2024010003 A5 JPWO2024010003 A5 JP WO2024010003A5
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JP
Japan
Prior art keywords
plate
shaped conductive
conductive portion
terminal
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024532592A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024010003A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/024808 external-priority patent/WO2024010003A1/ja
Publication of JPWO2024010003A1 publication Critical patent/JPWO2024010003A1/ja
Publication of JPWO2024010003A5 publication Critical patent/JPWO2024010003A5/ja
Pending legal-status Critical Current

Links

JP2024532592A 2022-07-07 2023-07-04 Pending JPWO2024010003A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022109874 2022-07-07
PCT/JP2023/024808 WO2024010003A1 (ja) 2022-07-07 2023-07-04 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024010003A1 JPWO2024010003A1 (https=) 2024-01-11
JPWO2024010003A5 true JPWO2024010003A5 (https=) 2025-03-18

Family

ID=89453430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024532592A Pending JPWO2024010003A1 (https=) 2022-07-07 2023-07-04

Country Status (2)

Country Link
JP (1) JPWO2024010003A1 (https=)
WO (1) WO2024010003A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4218243B2 (ja) * 2002-01-30 2009-02-04 株式会社豊田自動織機 半導体装置
JP5285224B2 (ja) * 2007-01-31 2013-09-11 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 回路装置
JP2010177453A (ja) * 2009-01-29 2010-08-12 Rohm Co Ltd 半導体装置
JP6485257B2 (ja) * 2015-07-01 2019-03-20 富士電機株式会社 半導体装置及び半導体装置の製造方法

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