JPWO2024005194A1 - - Google Patents

Info

Publication number
JPWO2024005194A1
JPWO2024005194A1 JP2024530997A JP2024530997A JPWO2024005194A1 JP WO2024005194 A1 JPWO2024005194 A1 JP WO2024005194A1 JP 2024530997 A JP2024530997 A JP 2024530997A JP 2024530997 A JP2024530997 A JP 2024530997A JP WO2024005194 A1 JPWO2024005194 A1 JP WO2024005194A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024530997A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024005194A1 publication Critical patent/JPWO2024005194A1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C39/00Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
    • C07C39/12Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
    • C07C39/15Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings with all hydroxy groups on non-condensed rings, e.g. phenylphenol
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/02Esters of acyclic saturated monocarboxylic acids having the carboxyl group bound to an acyclic carbon atom or to hydrogen
    • C07C69/12Acetic acid esters
    • C07C69/21Acetic acid esters of hydroxy compounds with more than three hydroxy groups
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Materials For Photolithography (AREA)
JP2024530997A 2022-07-01 2023-06-30 Pending JPWO2024005194A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022107127 2022-07-01
PCT/JP2023/024419 WO2024005194A1 (ja) 2022-07-01 2023-06-30 ポリフェノール化合物、リソグラフィー用膜形成用組成物、リソグラフィー用下層膜、及びパターン形成方法

Publications (1)

Publication Number Publication Date
JPWO2024005194A1 true JPWO2024005194A1 (https=) 2024-01-04

Family

ID=89382543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024530997A Pending JPWO2024005194A1 (https=) 2022-07-01 2023-06-30

Country Status (3)

Country Link
JP (1) JPWO2024005194A1 (https=)
TW (1) TW202411187A (https=)
WO (1) WO2024005194A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03201467A (ja) * 1989-12-28 1991-09-03 Nitto Denko Corp 半導体装置
JP2566169B2 (ja) * 1989-12-28 1996-12-25 日本ゼオン株式会社 ポジ型レジスト組成物
JP2626363B2 (ja) * 1991-11-05 1997-07-02 東レ株式会社 電子線感応組成物およびそれを用いるパターン形成方法
JPH08277235A (ja) * 1995-04-05 1996-10-22 Honshu Chem Ind Co Ltd 新規なポリフェノール化合物及びその製造方法
JP4139575B2 (ja) * 2001-04-13 2008-08-27 富士フイルム株式会社 シリコン含有2層レジスト用下層レジスト組成物
JP2004099570A (ja) * 2002-09-12 2004-04-02 Honshu Chem Ind Co Ltd テトラヒドロピラニル化多核フェノール類
KR20060027158A (ko) * 2004-09-22 2006-03-27 주식회사 동진쎄미켐 유기 반사방지막 형성용 조성물 및 이를 이용한 반도체소자 패턴의 형성방법
JP4662063B2 (ja) * 2006-05-25 2011-03-30 信越化学工業株式会社 フォトレジスト下層膜形成材料及びパターン形成方法
JP4823959B2 (ja) * 2006-08-10 2011-11-24 信越化学工業株式会社 レジスト下層膜材料及びパターン形成方法
JP5067537B2 (ja) * 2007-03-02 2012-11-07 日産化学工業株式会社 多核フェノールを含むレジスト下層膜形成組成物
KR20090035970A (ko) * 2007-10-08 2009-04-13 주식회사 동진쎄미켐 고 굴절률을 갖는 유기반사방지막 형성용 중합체 및 이를포함하는 조성물
JP5609882B2 (ja) * 2009-09-29 2014-10-22 Jsr株式会社 パターン形成方法及びレジスト下層膜形成用組成物
JP5929660B2 (ja) * 2012-09-19 2016-06-08 Dic株式会社 ビフェノール−ナフトール樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板

Also Published As

Publication number Publication date
WO2024005194A1 (ja) 2024-01-04
TW202411187A (zh) 2024-03-16

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