JPWO2024005194A1 - - Google Patents
Info
- Publication number
- JPWO2024005194A1 JPWO2024005194A1 JP2024530997A JP2024530997A JPWO2024005194A1 JP WO2024005194 A1 JPWO2024005194 A1 JP WO2024005194A1 JP 2024530997 A JP2024530997 A JP 2024530997A JP 2024530997 A JP2024530997 A JP 2024530997A JP WO2024005194 A1 JPWO2024005194 A1 JP WO2024005194A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C39/00—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
- C07C39/12—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
- C07C39/15—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings with all hydroxy groups on non-condensed rings, e.g. phenylphenol
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/02—Esters of acyclic saturated monocarboxylic acids having the carboxyl group bound to an acyclic carbon atom or to hydrogen
- C07C69/12—Acetic acid esters
- C07C69/21—Acetic acid esters of hydroxy compounds with more than three hydroxy groups
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022107127 | 2022-07-01 | ||
| PCT/JP2023/024419 WO2024005194A1 (ja) | 2022-07-01 | 2023-06-30 | ポリフェノール化合物、リソグラフィー用膜形成用組成物、リソグラフィー用下層膜、及びパターン形成方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024005194A1 true JPWO2024005194A1 (https=) | 2024-01-04 |
Family
ID=89382543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024530997A Pending JPWO2024005194A1 (https=) | 2022-07-01 | 2023-06-30 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024005194A1 (https=) |
| TW (1) | TW202411187A (https=) |
| WO (1) | WO2024005194A1 (https=) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03201467A (ja) * | 1989-12-28 | 1991-09-03 | Nitto Denko Corp | 半導体装置 |
| JP2566169B2 (ja) * | 1989-12-28 | 1996-12-25 | 日本ゼオン株式会社 | ポジ型レジスト組成物 |
| JP2626363B2 (ja) * | 1991-11-05 | 1997-07-02 | 東レ株式会社 | 電子線感応組成物およびそれを用いるパターン形成方法 |
| JPH08277235A (ja) * | 1995-04-05 | 1996-10-22 | Honshu Chem Ind Co Ltd | 新規なポリフェノール化合物及びその製造方法 |
| JP4139575B2 (ja) * | 2001-04-13 | 2008-08-27 | 富士フイルム株式会社 | シリコン含有2層レジスト用下層レジスト組成物 |
| JP2004099570A (ja) * | 2002-09-12 | 2004-04-02 | Honshu Chem Ind Co Ltd | テトラヒドロピラニル化多核フェノール類 |
| KR20060027158A (ko) * | 2004-09-22 | 2006-03-27 | 주식회사 동진쎄미켐 | 유기 반사방지막 형성용 조성물 및 이를 이용한 반도체소자 패턴의 형성방법 |
| JP4662063B2 (ja) * | 2006-05-25 | 2011-03-30 | 信越化学工業株式会社 | フォトレジスト下層膜形成材料及びパターン形成方法 |
| JP4823959B2 (ja) * | 2006-08-10 | 2011-11-24 | 信越化学工業株式会社 | レジスト下層膜材料及びパターン形成方法 |
| JP5067537B2 (ja) * | 2007-03-02 | 2012-11-07 | 日産化学工業株式会社 | 多核フェノールを含むレジスト下層膜形成組成物 |
| KR20090035970A (ko) * | 2007-10-08 | 2009-04-13 | 주식회사 동진쎄미켐 | 고 굴절률을 갖는 유기반사방지막 형성용 중합체 및 이를포함하는 조성물 |
| JP5609882B2 (ja) * | 2009-09-29 | 2014-10-22 | Jsr株式会社 | パターン形成方法及びレジスト下層膜形成用組成物 |
| JP5929660B2 (ja) * | 2012-09-19 | 2016-06-08 | Dic株式会社 | ビフェノール−ナフトール樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板 |
-
2023
- 2023-06-30 JP JP2024530997A patent/JPWO2024005194A1/ja active Pending
- 2023-06-30 WO PCT/JP2023/024419 patent/WO2024005194A1/ja not_active Ceased
- 2023-06-30 TW TW112124633A patent/TW202411187A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024005194A1 (ja) | 2024-01-04 |
| TW202411187A (zh) | 2024-03-16 |
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