JPWO2023286555A5 - - Google Patents
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- Publication number
- JPWO2023286555A5 JPWO2023286555A5 JP2023535202A JP2023535202A JPWO2023286555A5 JP WO2023286555 A5 JPWO2023286555 A5 JP WO2023286555A5 JP 2023535202 A JP2023535202 A JP 2023535202A JP 2023535202 A JP2023535202 A JP 2023535202A JP WO2023286555 A5 JPWO2023286555 A5 JP WO2023286555A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- layer
- metal
- forming
- surface modification
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 238000012986 modification Methods 0.000 claims description 15
- 230000004048 modification Effects 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- 239000003607 modifier Substances 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000000206 photolithography Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 5
- 229910052757 nitrogen Inorganic materials 0.000 claims 4
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 4
- 125000003342 alkenyl group Chemical group 0.000 claims 2
- 125000003545 alkoxy group Chemical group 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000000304 alkynyl group Chemical group 0.000 claims 2
- 125000003277 amino group Chemical group 0.000 claims 2
- 125000003118 aryl group Chemical group 0.000 claims 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims 2
- 125000004093 cyano group Chemical group *C#N 0.000 claims 2
- 125000005843 halogen group Chemical group 0.000 claims 2
- 125000001072 heteroaryl group Chemical group 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 125000001424 substituent group Chemical group 0.000 claims 2
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims 2
- 238000005406 washing Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021116802 | 2021-07-15 | ||
| PCT/JP2022/025011 WO2023286555A1 (ja) | 2021-07-15 | 2022-06-23 | 表面改質剤、積層体、金属配線パターンの形成方法、及びプリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023286555A1 JPWO2023286555A1 (https=) | 2023-01-19 |
| JPWO2023286555A5 true JPWO2023286555A5 (https=) | 2024-06-17 |
Family
ID=84919284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023535202A Pending JPWO2023286555A1 (https=) | 2021-07-15 | 2022-06-23 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023286555A1 (https=) |
| KR (1) | KR20240014516A (https=) |
| CN (1) | CN117546615A (https=) |
| TW (1) | TWI815535B (https=) |
| WO (1) | WO2023286555A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024153251A (ja) * | 2023-04-17 | 2024-10-29 | コニカミノルタ株式会社 | 積層体、プリント基板、及びプリント基板の製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2834885B2 (ja) * | 1990-11-07 | 1998-12-14 | 四国化成工業株式会社 | 銅及び銅合金の表面処理方法 |
| JP4750645B2 (ja) * | 2006-08-11 | 2011-08-17 | 日本表面化学株式会社 | 銅又は銅合金表面の表面処理剤及び処理方法 |
| US10017863B2 (en) * | 2007-06-21 | 2018-07-10 | Joseph A. Abys | Corrosion protection of bronzes |
| JP2009299096A (ja) | 2008-06-10 | 2009-12-24 | Ebara Densan Ltd | プリント回路基板用銅及び銅合金の表面処理液と表面処理方法 |
| JP5708422B2 (ja) * | 2011-09-30 | 2015-04-30 | Jsr株式会社 | 液浸用上層膜形成組成物及びレジストパターン形成方法 |
| JP7194525B2 (ja) * | 2017-12-28 | 2022-12-22 | 東京応化工業株式会社 | 表面処理方法、表面処理剤、及び基板上に領域選択的に製膜する方法 |
| JP2019159151A (ja) | 2018-03-14 | 2019-09-19 | 株式会社東芝 | 配線パターンの形成方法、これを用いたプリント回路基板、半導体パッケージ、及び電子機器 |
-
2022
- 2022-06-23 KR KR1020237045158A patent/KR20240014516A/ko active Pending
- 2022-06-23 WO PCT/JP2022/025011 patent/WO2023286555A1/ja not_active Ceased
- 2022-06-23 CN CN202280044549.3A patent/CN117546615A/zh active Pending
- 2022-06-23 JP JP2023535202A patent/JPWO2023286555A1/ja active Pending
- 2022-07-01 TW TW111124728A patent/TWI815535B/zh active
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