TWI815535B - 表面改質劑、積層體、金屬電路圖型之形成方法及印刷電路板之製造方法 - Google Patents

表面改質劑、積層體、金屬電路圖型之形成方法及印刷電路板之製造方法 Download PDF

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Publication number
TWI815535B
TWI815535B TW111124728A TW111124728A TWI815535B TW I815535 B TWI815535 B TW I815535B TW 111124728 A TW111124728 A TW 111124728A TW 111124728 A TW111124728 A TW 111124728A TW I815535 B TWI815535 B TW I815535B
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TW
Taiwan
Prior art keywords
layer
metal
aforementioned
forming
nitrogen
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TW111124728A
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English (en)
Chinese (zh)
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TW202313861A (zh
Inventor
有田浩了
原淳
山田哲也
Original Assignee
日商柯尼卡美能達股份有限公司
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Publication of TW202313861A publication Critical patent/TW202313861A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW111124728A 2021-07-15 2022-07-01 表面改質劑、積層體、金屬電路圖型之形成方法及印刷電路板之製造方法 TWI815535B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021116802 2021-07-15
JP2021-116802 2021-07-15

Publications (2)

Publication Number Publication Date
TW202313861A TW202313861A (zh) 2023-04-01
TWI815535B true TWI815535B (zh) 2023-09-11

Family

ID=84919284

Family Applications (1)

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TW111124728A TWI815535B (zh) 2021-07-15 2022-07-01 表面改質劑、積層體、金屬電路圖型之形成方法及印刷電路板之製造方法

Country Status (5)

Country Link
JP (1) JPWO2023286555A1 (https=)
KR (1) KR20240014516A (https=)
CN (1) CN117546615A (https=)
TW (1) TWI815535B (https=)
WO (1) WO2023286555A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024153251A (ja) * 2023-04-17 2024-10-29 コニカミノルタ株式会社 積層体、プリント基板、及びプリント基板の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008045156A (ja) * 2006-08-11 2008-02-28 Nippon Hyomen Kagaku Kk 銅又は銅合金表面の表面処理剤及び処理方法
JP2013080018A (ja) * 2011-09-30 2013-05-02 Jsr Corp 液浸用上層膜形成組成物及びレジストパターン形成方法
TW201935522A (zh) * 2017-12-28 2019-09-01 日商東京應化工業股份有限公司 表面處理方法、表面處理劑以及於基板上區域選擇性地製膜之方法
JP2019159151A (ja) * 2018-03-14 2019-09-19 株式会社東芝 配線パターンの形成方法、これを用いたプリント回路基板、半導体パッケージ、及び電子機器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2834885B2 (ja) * 1990-11-07 1998-12-14 四国化成工業株式会社 銅及び銅合金の表面処理方法
US10017863B2 (en) * 2007-06-21 2018-07-10 Joseph A. Abys Corrosion protection of bronzes
JP2009299096A (ja) 2008-06-10 2009-12-24 Ebara Densan Ltd プリント回路基板用銅及び銅合金の表面処理液と表面処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008045156A (ja) * 2006-08-11 2008-02-28 Nippon Hyomen Kagaku Kk 銅又は銅合金表面の表面処理剤及び処理方法
JP2013080018A (ja) * 2011-09-30 2013-05-02 Jsr Corp 液浸用上層膜形成組成物及びレジストパターン形成方法
TW201935522A (zh) * 2017-12-28 2019-09-01 日商東京應化工業股份有限公司 表面處理方法、表面處理劑以及於基板上區域選擇性地製膜之方法
JP2019159151A (ja) * 2018-03-14 2019-09-19 株式会社東芝 配線パターンの形成方法、これを用いたプリント回路基板、半導体パッケージ、及び電子機器

Also Published As

Publication number Publication date
CN117546615A (zh) 2024-02-09
TW202313861A (zh) 2023-04-01
KR20240014516A (ko) 2024-02-01
JPWO2023286555A1 (https=) 2023-01-19
WO2023286555A1 (ja) 2023-01-19

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