JPWO2023273779A5 - - Google Patents
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- JPWO2023273779A5 JPWO2023273779A5 JP2023526359A JP2023526359A JPWO2023273779A5 JP WO2023273779 A5 JPWO2023273779 A5 JP WO2023273779A5 JP 2023526359 A JP2023526359 A JP 2023526359A JP 2023526359 A JP2023526359 A JP 2023526359A JP WO2023273779 A5 JPWO2023273779 A5 JP WO2023273779A5
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- JP
- Japan
- Prior art keywords
- chip
- design
- temperature
- environmental
- development platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000007613 environmental effect Effects 0.000 claims 14
- 239000002184 metal Substances 0.000 claims 9
- 238000010438 heat treatment Methods 0.000 claims 7
- 238000000034 method Methods 0.000 claims 6
- 230000006641 stabilisation Effects 0.000 claims 6
- 238000011105 stabilization Methods 0.000 claims 6
- 238000001514 detection method Methods 0.000 claims 4
- 238000010586 diagram Methods 0.000 claims 4
- 230000020169 heat generation Effects 0.000 claims 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000005672 electromagnetic field Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110748503.7 | 2021-07-02 | ||
| CN202110748503.7A CN113204936B (zh) | 2021-07-02 | 2021-07-02 | 一种自动添加环境稳定系统的芯片设计方法 |
| PCT/CN2022/096633 WO2023273779A1 (zh) | 2021-07-02 | 2022-06-01 | 利用eda软件二次开发能力的芯片设计方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023547240A JP2023547240A (ja) | 2023-11-09 |
| JPWO2023273779A5 true JPWO2023273779A5 (zh) | 2024-03-04 |
Family
ID=77022711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023526359A Pending JP2023547240A (ja) | 2021-07-02 | 2022-06-01 | Ｅｄａソフト二次開発力を用いたチップ設計方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230385491A1 (zh) |
| JP (1) | JP2023547240A (zh) |
| CN (1) | CN113204936B (zh) |
| WO (1) | WO2023273779A1 (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113204936B (zh) * | 2021-07-02 | 2021-09-17 | 苏州贝克微电子有限公司 | 一种自动添加环境稳定系统的芯片设计方法 |
| CN114722746B (zh) * | 2022-05-24 | 2022-11-01 | 苏州浪潮智能科技有限公司 | 一种芯片辅助设计方法、装置、设备及可读介质 |
| CN116127903B (zh) * | 2023-02-14 | 2023-11-14 | 电子科技大学 | 一种大功率pa芯片版图布局及风洞式自散热封装设计方法 |
| CN115994491B (zh) * | 2023-03-24 | 2023-06-30 | 湖南光华防务科技集团有限公司 | 一种灭火弹挂飞温度补偿方法和系统 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7472363B1 (en) * | 2004-01-28 | 2008-12-30 | Gradient Design Automation Inc. | Semiconductor chip design having thermal awareness across multiple sub-system domains |
| CN107342279A (zh) * | 2017-06-08 | 2017-11-10 | 唯捷创芯(天津)电子技术股份有限公司 | 一种防电磁干扰的射频模块及其实现方法 |
| CN107330173B (zh) * | 2017-06-20 | 2021-01-05 | 嘉兴倚韦电子科技有限公司 | 集成电路后端设计自动化系统 |
| CN107784179B (zh) * | 2017-11-13 | 2022-01-04 | 嘉兴倚韦电子科技有限公司 | 集成电路半定制后端设计布线和优化方法 |
| CN212873293U (zh) * | 2020-07-09 | 2021-04-02 | 北京锐达芯集成电路设计有限责任公司 | 一种自加热恒温装置 |
| CN112507657B (zh) * | 2021-02-05 | 2021-05-18 | 苏州贝克微电子有限公司 | 一种减少仿真时间的辅助芯片设计方法 |
| CN113204936B (zh) * | 2021-07-02 | 2021-09-17 | 苏州贝克微电子有限公司 | 一种自动添加环境稳定系统的芯片设计方法 |
-
2021
- 2021-07-02 CN CN202110748503.7A patent/CN113204936B/zh active Active
-
2022
- 2022-06-01 US US18/034,300 patent/US20230385491A1/en active Pending
- 2022-06-01 JP JP2023526359A patent/JP2023547240A/ja active Pending
- 2022-06-01 WO PCT/CN2022/096633 patent/WO2023273779A1/zh active Application Filing
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