JPWO2023233459A5 - - Google Patents
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- Publication number
- JPWO2023233459A5 JPWO2023233459A5 JP2024524523A JP2024524523A JPWO2023233459A5 JP WO2023233459 A5 JPWO2023233459 A5 JP WO2023233459A5 JP 2024524523 A JP2024524523 A JP 2024524523A JP 2024524523 A JP2024524523 A JP 2024524523A JP WO2023233459 A5 JPWO2023233459 A5 JP WO2023233459A5
- Authority
- JP
- Japan
- Prior art keywords
- tip
- adhesive
- insulated
- connection structure
- electric wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 1
- PICOUKGVAGTEEW-UHFFFAOYSA-N [In][Ag][Sn] Chemical compound [In][Ag][Sn] PICOUKGVAGTEEW-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/021909 WO2023233459A1 (ja) | 2022-05-30 | 2022-05-30 | 接続構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023233459A1 JPWO2023233459A1 (https=) | 2023-12-07 |
| JPWO2023233459A5 true JPWO2023233459A5 (https=) | 2025-02-10 |
Family
ID=89025937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024524523A Pending JPWO2023233459A1 (https=) | 2022-05-30 | 2022-05-30 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250350046A1 (https=) |
| JP (1) | JPWO2023233459A1 (https=) |
| WO (1) | WO2023233459A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006164580A (ja) * | 2004-12-03 | 2006-06-22 | Hirose Electric Co Ltd | ケーブル付き電気コネクタ |
| JP2012014934A (ja) * | 2010-06-30 | 2012-01-19 | Sumitomo Electric Ind Ltd | 同軸線ハーネス、そのモジュール、その電子機器およびその製造方法 |
| JP2011171309A (ja) * | 2011-04-15 | 2011-09-01 | Sumitomo Electric Ind Ltd | 同軸ケーブルの接続構造およびその製造方法 |
| JP2014164842A (ja) * | 2013-02-22 | 2014-09-08 | Sumitomo Electric Ind Ltd | ケーブルハーネスおよびその加工方法 |
| JP6641079B2 (ja) * | 2014-10-29 | 2020-02-05 | タツタ電線株式会社 | プリント基板の製造方法及び導電性部材の接合方法 |
-
2022
- 2022-05-30 JP JP2024524523A patent/JPWO2023233459A1/ja active Pending
- 2022-05-30 WO PCT/JP2022/021909 patent/WO2023233459A1/ja not_active Ceased
- 2022-05-30 US US18/868,699 patent/US20250350046A1/en active Pending
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